High Reliability Chip - C0G
16Vdc to 10kVdc
A range of MLC chip capacitors in Ultra stable EIA Class I C0G, or
NP0, dielectric with special testing for long term reliability. They
are designed for optimum reliability; burned in at elevated voltage
and temperature, and 100% physically and electrically inspected
to ascertain conformance to strict performance criteria. Units may
be tested in accordance with MIL-PRF-55681, MIL-PRF-123, MIL-
PRF-49467, or customer SCD.
Designed for surface mount application with nickel barrier
terminations making them suitable for solder wave and reflow
solder board attachment as well as vapor phase attachment for
part sizes 2225 or smaller. Silver-palladium terminations are also
available for hybrid use with conductive epoxy.
C0G chips are used in precision circuitry requiring Class I stability
and exhibit linear temperature coefficient, low loss and stable
electrical properties with time, voltage & frequency.
They find application for High Reliability use such as medical
implanted devices, aerospace, airborne and military use as well
as consumer uses requiring safety margins not attainable with
commercial products.
Standard EIA case sizes and available C/V values are listed below
- special sizes, thicknesses and other voltage ratings are available;
please contact the sales office for information.
Capacitance and voltage selection for popular chip sizes
Size
Min cap.
Tmax
inches:
mm:
0402
0R3
0.024
0.61
0504
0R5
0.044
1.12
0603
0R3
0.035
0.89
0805
0R5
0.054
1.37
1206
0R5
0.054
1.37
1206
3R0
0.064
1.63
1210
5R0
0.065
1.63
1515
3R0
0.130
3.02
1808
5R0
0.065
1.63
1812
100
0.065
1.63
1825
150
0.080
2.03
5R0
0.080*
2.03
100
0.100*
2.54
150
0.140*
3.56
16V
25V
50V
100V
200V
250V
300V
400V
500V
600V
800V
†
1kV
†
1.5kV
†
2kV
†
3kV
†
4kV
†
5kV
†
6kV
†
7kV
†
8kV
†
9kV
†
10kV
†
†
81
181
181
101
101
390
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
152
152
152
821
561
391
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
102
102
102
561
331
271
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
392
392
392
222
152
102
681
681
681
•
•
•
•
•
•
•
•
•
•
•
•
•
562
562
562
332
222
152
681
561
561
•
•
•
•
•
•
•
•
•
•
•
•
•
103
123
123
682
392
272
182
152
152
122
102
681
271
151
•
•
•
•
•
•
•
•
223
223
223
123
822
562
392
392
392
392
222
152
681
391
•
•
•
•
•
•
•
•
393
393
333
273
223
183
123
822
682
682
472
392
222
122
561
•
•
•
•
•
•
•
223
223
183
123
822
562
392
392
392
392
222
152
681
391
181
•
•
•
•
•
•
•
273
273
223
183
103
682
472
472
392
392
222
152
102
391
181
•
•
•
•
•
•
•
473
473
393
273
153
123
822
822
822
822
472
332
152
821
391
•
•
•
•
•
•
•
473
473
393
273
273
183
123
103
103
103
682
562
222
122
561
•
•
•
•
•
•
•
104
104
104
683
473
273
223
183
183
183
123
822
392
222
102
391
221
•
•
•
•
•
104
104
104
823
683
473
273
183
183
183
153
123
682
392
182
681
471
•
•
•
•
•
Units rated above 800V may require conformal coating to preclude arcing over chip surface
Maximum voltage for MIL-PRF-123 tested parts is 1kV
28
Phone: +1.661.295.5920 | www.novacap.com
High Reliability Chip - C0G
16Vdc to 10kVdc
l
l
l
l
l
For dielectric characteristics see page 4.
For dimensions see page 12.
For termination options see pages 3 & 15.
For capacitance tolerances available see page 15.
For ordering information see page 15.
Note:
Maximum capacitance values are shown below as 3 digit
code: 2 significant figures followed by the no. of zeros
e.g. 183 = 18,000pF.
Capacitance and voltage selection for popular chip sizes
2020
270
0.180
4.57
2221
270
0.080
2.03
2225
270
0.080
2.03
2520
270
390
0.180
4.57
3333
390
0.250
6.35
3530
390
0.250
6.35
4040
390
0.300
7.62
4540
390
0.300
7.62
5440
390
0.300
7.62
5550
390
0.300
7.62
6560
560
0.300
7.62
7565
101
0.300
7.62
Size
Min cap.
:inches
:mm
0.150*
3.81
Tmax
683
683
683
563
473
393
333
223
153
153
103
103
682
392
182
681
391
•
•
•
•
•
104
104
104
683
393
223
183
183
183
183
103
822
392
182
821
331
221
•
•
•
•
•
124
124
124
823
473
273
273
273
273
273
153
123
562
272
122
471
331
•
•
•
•
•
124
124
124
104
823
563
473
273
273
273
223
183
103
562
272
102
681
•
•
•
•
•
104
104
104
823
683
563
473
333
183
183
123
123
822
472
222
102
561
•
•
•
•
•
184
184
154
124
104
823
823
563
473
393
333
273
183
153
682
272
182
152
•
•
•
•
184
184
184
154
104
104
823
563
473
393
333
273
183
153
682
272
182
152
821
•
•
•
334
334
274
224
184
154
154
124
823
683
563
473
333
223
153
562
392
272
152
102
•
•
334
334
334
274
184
184
154
124
104
823
683
563
393
273
183
682
472
332
182
122
821
681
334
334
274
224
184
184
154
124
104
823
683
563
393
333
183
822
472
332
182
122
102
821
394
394
394
274
224
224
184
154
124
124
104
823
563
473
273
103
682
472
272
182
122
122
684
684
564
474
394
394
334
274
224
184
154
124
823
683
393
153
103
822
392
272
222
182
824
824
824
564
474
474
394
334
274
274
184
184
124
823
473
223
123
822
472
392
272
222
16V
25V
50V
100V
200V
250V
300V
400V
500V
600V
800V
†
1kV
†
1.5kV
†
2kV
†
3kV
†
4kV
†
5kV
†
6kV
†
7kV
†
8kV
†
9kV
†
10kV
†
* Denotes non standard chip thickness.
Order code needs to have an ’X’ inserted together with the dimension in inches e.g. X080 where dimension is 0.080”
Phone: +1.661.295.5920 | www.novacap.com
29
Chip Ordering Information
High Reliability
Testing
High Reliability
Test Criteria
-
HB
Positive
Class
X5R VTC
II
E/G W
P
Termination
Capacitance
Capacitance
Tolerance
Packaging
T
None
M
Special
Thickness
Case Size
Dielectric
XX
1206
N
472
J
101
N
X050
H
Capacitance Code
1st two digits are
significant, third
digit denotes
number of zeros,
R = decimal
Examples:
1R0 = 1.0pF
120 = 12pF
471 = 470pF
102 = 1,000pF
273 = 0.027µF
474 = 0.47µF
105 = 1.0µF
X
Special Thickness
None
Standard thickness
as per Novacap
catalog specifications
Denotes a special
thickness other than
standard. Specify in
inches if required.
(As shown above
X
= 0.050”)
Packaging
None
T
W
Bulk
Tape and Reel
Waffle Pack
Marking
Unmarked
Marked
*
Marking not
available on
sizes < 0603
High Reliability
Testing
None
Standard product
H
H
High Reliability Testing
High Temp Screening
Dielectric Codes
N
M
F
D
K
R
Y
Z
B
C
X
S
E
G
W
P
RN
RB
C0G/NP0
C0G/NP0
C0G/NP0
C0G/NP0
R3L
R2D
Y5V
Z5U
X7R
X7R
BX
X8R
Class II
Class II
X5R
Positive VTC
NP0
X7R
Ultra Stable
Ultra Stable Magnetic Free
High Temp. (up to 160ºC)
High Temp. (up to 200ºC)
Ultra Stable
Pulse Energy
General Purpose
General Purpose
Stable
Stable Magnetic Free
MIL
High Temp. (up to 150ºC)
High Temp. (up to 200ºC)
High Temp. (up to 160ºC)
Stable
Pulse Power
RoHS 2013 < 200V
RoHS 2013 < 200V
B
{
Hi-Reliability
Testing Criteria
HB
MIL-PRF-55681 Group A
HK
MIL-PRF-38534 Class K
HS
MIL-PRF-123 Group A
Termination Codes
Voltage Code
1st two digits are significant,
third digit denotes number of
zeros. For example:
160 =
101 =
501 =
102 =
502 =
103 =
16 Volts
100 Volts
500 Volts
1,000 Volts
5,000 Volts
10,000 Volts
P
PR
K
N
Y
NG
C
D
B
E
S
Palladium Silver
Palladium Silver*
Solderable Palladium Silver*
Nickel Barrier*
Nickel Barrier
Nickel Barrier Gold Flash*
FlexiCap™/Nickel Barrier*
FlexiCap™/Nickel Barrier
Copper Barrier*
Copper Barrier
Silver*
100% tin
90% tin, 10% lead
100% tin
90% tin, 10% lead
100% tin
90% tin, 10% lead
*
Indicates RoHS terminations
Capacitance Tolerance Codes
Code Tolerance
*
Not RF series
Cap. Value
< 10pF
C0G/NP0
N
•
•
•
•
•
•
•
•
•
•
M
•
•
•
•
•
•
•
•
•
•
•
•
F/D
Y5V
R3L
R2D Z5U
X7R
B
C
BX
X
K
•
•
R
Y/Z
±0.10pF
±0.25pF
±0.50pF
±1%
±2%
±5%
±10%
±20%
+80% -20%
+100% -0%
Prefix Definitions
None
RF
LS
ES
ST
SM
CR
RC
Standard chip
Improved ESR Capacitor
Y
3
Certified Safety Capacitor
Y Certified Safety Capacitor
2
C
D
p. 23
p. 42 - 43
p. 42 - 43
p. 48 - 53
p. 48 - 53
p. 54
p. 58 - 61
F
G
J
K
M
Z
P
•
•
•
•
•
•
•
•
•
•
•
•
•*
•
•
•*
•*
•
•
•
•*
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Stacked Capacitor Assembly
Stacked Hi-Rel Capacitor Assembly
Cap-Rack Capacitor Array
Bleed Resistor
Marking
M
X8R
S
Voltage
Prefix
Phone: +1.661.295.5920 | www.novacap.com
15
Technical Summary
W
Technical Information
Novacap provides application notes throughout this catalog as
a guide to chip selection and attachment methods. Refer to the
Novacap Technical Brochure found at www.novacap.com for
more details. This technical information includes the nature of
capacitance, dielectric properties, electrical properties, classes
of dielectrics, ferroelectric behavior, test standards, and high
reliability test plans. Please do not hesitate to contact the sales
office for any product or technical assistance.
Capacitor Size
Size availability is based primarily on capacitance values and
voltage rating. Smaller units are generally less expensive.
Because mass affects the thermal shock susceptibility of chip
capacitors, size selection should consider the soldering method
used to attach the chip to the board. Sizes 1812 and smaller
can be wave, vapor phase, or reflow soldered. Larger units
require reflow soldering.
Chip Selection
Multilayer capacitors (MLC) are categorized by dielectric
performance with temperature. The Temperature Coefficient
of Capacitance describes the variance of capacitance value with
temperature. The choice of components is therefore largely
determined by the temperature stability required of the device
and the size necessary for the desired capacitance value and
voltage rating.
Packaging
Units are available reeled, in waffle pack, or bulk packaged. Bar
coded labels are standard for reeled and bulk packaging.
Primary Dielectric Types
T
MB
C0G/NP0:
Ultra stable Class I dielectric, with negligible dependence of
capacitance on temperature, voltage, frequency, and time. Used
in circuitry requiring very stable performance.
X7R:
Stable Class II dielectric, with predictable change in properties
across a temperature range of -55°C to +125°C. Used as
blocking, decoupling, bypassing, and frequency discriminating
elements. This dielectric is ferroelectric and provides higher
capacitance than Class I materials.
BX:
The military specification for ceramic chip capacitors (MIL-
PRF-55681) defines a mid-K stable dielectric designated as BX.
The BX specification has voltage temperature limits in addition
to temperature limits of capacitance. The BX dielectric is limited
to ±15% maximum change in capacitance between 25°C and
-55°C or +125°C and also has a voltage restriction of +15%
/ -25% maximum change in capacitance between 25°C and
-55°C or +125°C at rated voltage.
Z5U/Y5V:
General purpose Class III dielectrics with higher dielectric
constant and greater variation of properties over temperature
and voltage. Very high capacitance per volume is attainable
for general purpose applications where stability over a wide
temperature range is not critical.
FlexiCap™/Nickel Barrier
100% tin
FlexiCap™/Nickel Barrier
90/10% tin/lead
Dielectric
Termination
Combinations
Nickel Barrier
90/10% tin/lead
Palladium Silver
Palladium Silver
Solderable
Palladium Silver
Nickel Barrier
100% tin
Nickel Barrier
Gold flash
Termination Material
Copper Barrier
90/10% tin/lead
Solderable Silver
We recommend the following
termination types:
Solder Attachment:
N
Nickel Barrier, 100% matte tin
plated - RoHS
C
FlexiCap™ with Nickel Barrier,
100% tin plated - RoHS
Y
Nickel Barrier, tin-lead plated
D
FlexiCap™ Nickel Barrier, tin-lead
plated
B
Copper Barrier 100% matte tin
plated - RoHS
E
Copper Barrier, tin-lead plated
K
Solderable Palladium Silver -
RoHS
S
Solderable Silver - RoHS
Palladium Silver
Dielectric
Code
N/RN
C0G/NP0
K
R3L
B/RB
X7R
W
X5R
X
BX
Y
Y5V
Z
Z5U
M
C0G/NP0 (
Mag free
)
C
X7R (
Mag free
)
S
X8R
F
C0G/NP0 (160ºC)
D
C0G/NP0 (200ºC)
G
Class II (160ºC)
E
Class II (200ºC)
P
Pulse Power
R
R2D
P
•
•
•
•
•
•
•
•
•
•
•
RoHS RoHS RoHS
PR
K
N
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Y
•
•
•
•
•
•
•
RoHS RoHS
NG
C
•
•
•
•
•
•
•
•
•
•
•
D
•
•
•
•
•
•
RoHS
B
Copper Barrier
100% tin
E
RoHS
S
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Conductive Epoxy attachment:
P
PR
Palladium Silver - RoHS
NG
Nickel Barrier Gold Flash,
also suitable for soldering
attachment - RoHS
Phone: +1.661.295.5920 | www.novacap.com
3
Dielectric Characteristics
C0G/NP0 (N) Ultra Stable and RoHS 2013 (RN) type
Operating temperature range:
Temperature coefficient:
Dissipation factor:
Insulation resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
0 ±30 ppm/ºC
0.1% max @ 25ºC
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
1MHz for Capacitance <100pF
∆C
ppm
TEMPERATURE COEFFICIENT
UPPER LIMIT
50
% CAPACITANCE CHANGE
25
0
TYPICAL
-25
LOWER LIMIT
-50
-55
-25
0
25
50
75
100
125
TEMPERATURE °C
C0G/NP0 (M) Ultra Stable Non Magnetic
Operating temperature range:
Temperature coefficient:
Dissipation factor:
Insulation resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
0 ±30 ppm/ºC
0.1% max @ 25ºC
>1000WF or >10000WF
whichever is less
>100WF or >1000WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
1MHz for Capacitance <100pF
∆C
ppm
TEMPERATURE COEFFICIENT
UPPER LIMIT
50
% CAPACITANCE CHANGE
25
0
TYPICAL
-25
LOWER LIMIT
-50
-55
-25
0
25
50
75
100
125
TEMPERATURE °C
C0G/NP0 (F) Ultra Stable High Temperature (up to 160ºC)
Operating temperature range:
Temperature coefficient:
Dissipation factor:
Insulation resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
@25ºC:
@160ºC:
<200V:
201-500V:
>500V:
-55°C to 160°C
0 ±30 ppm/ºC
0.1% max @ 25ºC
>100GW or >1000WF
whichever is less
>1GW or >10WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
1MHz for Capacitance <100pF
∆C
ppm
TEMPERATURE COEFFICIENT
40
% CAPACITANCE CHANGE
20
0
-20
-40
-55
-25
0
25
50
75
100
125
150
TEMPERATURE °C
C0G/NP0 (D) Ultra Stable High Temperature (up to 200ºC)
Operating temperature range:
Temp. coefficient <200ºC:
Dissipation factor @ 25ºC:
Insulation resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
@25ºC:
@200ºC:
<200V:
201-500V:
>500V:
-55°C to 200°C
0 ±30 ppm/ºC
0.1% Max.
>100GW or >1000WF
whichever is less
>1GW or >10WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
1MHz for capacitance <100pF
∆C
ppm
TEMPERATURE COEFFICIENT
40
% CAPACITANCE CHANGE
20
0
-20
-40
-55
-25
0
25
50
75
100
125
150
175
200
TEMPERATURE °C
4
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嵌入式系统
