MECHANICAL:
MATERIALS:
HOUSING - THERMOPLASTIC PET POLYESTER FLAMMABILITY RATING UL 94V-0.
SHIELD - .010" THICK, C26800 BRASS PREPLATED WITH 30uINCH SEMI-BRIGHT NICKEL.
SOLDER TABS POST DIPPED WITH 100uINCH MIN SAC SOLDER.
MOD JACK CONTACTS - 0.0157" X 0.018" PHOSPHOR BRONZE, 50uINCH MIN OVERALL
NICKEL UNDERPLATE, WITH SELECT 50uINCH MIN HARD GOLD FINISH PLATE SOLDERTAILS
WITH 100uINCH MIN MATTE TIN AND/OR SAC SOLDER DIP.
LIGHT EMITTING DIODE(LED) - DIFFUSED EPOXY LENS, .020" x .020" CARBON STEEL
WIREFRAME LEADS PRE-PLATED WITH 80uINCH SILVER OVER 40uINCH NICKEL
UNDERPLATE OVER 40uINCH COPPER UNDERPLATE. POST-PLATED WITH 100uINCH MIN
MATTE TIN AND/OR SAC SOLDER DIP OR PURE TIN SOLDER DIP.
RJ45 JACK CAVITY CONFORMS TO FCC RULES AND REGULATIONS PART 68, SUB PART F.
MAGNETICS
-APPLICATION: 10/100/1000 BASE-T, EXTENDED TEMPERATURE
-IMPEDANCE: 100 OHMS
-TURNS RATIO (CHIP:CABLE): 1:1 ALL FOUR PAIRS
-OPEN CIRCUIT INDUCTANCE (OCL): 350uH MIN @100kHz, 0.1VRMS,
-ALL FOUR PAIRS BI-DIRECTIONAL
INSERTION LOSS (IL): 1.1dB MAX FROM 0.5MHz TO 100MHz
RETURN LOSS (RL): 18dB MIN FROM 0.5MHz TO 40MHz
12-20LOG(f/80)dB MIN FROM 40.1MHz TO 100MHz
CROSSTALK ATTENUATION: 35dB MIN FROM 0.5MHz TO 40MHz
33-20LOG(f/50)dB MIN FROM 40.1MHz TO 100MHz
COMMON MODE REJECTION RATIO (CMRR): 30dB MIN FROM 0.5MHz TO 100MHz
-ISOLATION VOLTAGE: COMPLIES WITH IEEE802.3 2002, PARA 40.6.1.1, ITEM b.
1840409-X
YYWWD
CHINA
1
10
LED IS DRIVEN WITH CONSTANT CURRENT AT APPROX 20mA.
LED COLOR: DOMINANT WAVELENGTH ( D): GREEN 568 nm TYP. at IF=20mA
FORWARD VOLTAGE (VF): GREEN 2.2V TYP. at IF=20mA
DOMINANT WAVELENGTH ( D): YELLOW 588 nm TYP. at IF=20mA
FORWARD VOLTAGE (VF): YELLOW 2.1V TYP. at IF=20mA
4G06ETP1 Series GIGABIT Magnetic Circuit
MD0-
MD1-
MD0+
MD1+
MD2+
MD2-
MD3+
MD3-
VCC
Pin Designations
THE MAGNETICS ARE SYMMETRIC, AND SUPPORT AUTO-MDI/MDIX.
TRP CONNECTOR LOGO, PART NUMBER, DATE CODE, COUNTRY OF ORIGIN AND AGENCY
APPROVAL MARKING IN APPROXIMATE LOCATION SHOWN.
1
3
5
7
9
2
4
6
8
10
C2
C3
C4
C5
SHIELD
C1
R4
R3
R2
R1
GND
THE PART IS RECOMMENDED FOR WAVE SOLDERING PROCESS, PREHEAT TEMPERATURE
D1
D2
D3
D4
Suggested Panel Cutout
Y
D1
G
TD0+ RJ-1
RJ-2
TD1+ RJ-3
TD2+ RJ-4
RJ-5
RJ-6
TD3+ RJ-7
LED1
RJ-8
D2
D3
G
LED2
D1
D3
Y
D4
Suggested PCB Layout
(Component Side)
LED2
TD0-
TD2-
TD1-
TD3-
LED1
D2
D4
stm32/stm8
