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1N5952BUR-1D

Zener Diode, 130V V(Z), 1%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2

器件类别:分立半导体    二极管   

厂商名称:Microsemi

厂商官网:https://www.microsemi.com

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Microsemi
零件包装代码
DO-213AB
包装说明
O-LELF-R2
针数
2
Reach Compliance Code
compliant
ECCN代码
EAR99
Is Samacsys
N
其他特性
METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接
ISOLATED
配置
SINGLE
二极管元件材料
SILICON
二极管类型
ZENER DIODE
JEDEC-95代码
DO-213AB
JESD-30 代码
O-LELF-R2
JESD-609代码
e0
湿度敏感等级
1
元件数量
1
端子数量
2
封装主体材料
GLASS
封装形状
ROUND
封装形式
LONG FORM
峰值回流温度(摄氏度)
NOT SPECIFIED
极性
UNIDIRECTIONAL
最大功率耗散
1.25 W
认证状态
Not Qualified
标称参考电压
130 V
表面贴装
YES
技术
ZENER
端子面层
TIN LEAD
端子形式
WRAP AROUND
端子位置
END
处于峰值回流温度下的最长时间
NOT SPECIFIED
最大电压容差
1%
工作测试电流
2.9 mA
Base Number Matches
1
文档预览
1N5913BUR-1 thru 1N5956BUR-1
(or MLL5913B thru MLL5956B)
SCOTTSDALE DIVISION
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.5 WATT ZENERS
DESCRIPTION
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB
package is similar in electrical features to the JEDEC registered 1N5913B
thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection
for applications of high density and low parasitic requirements. Due to its
glass hermetic qualities and metallurgically enhanced internal contacts, it
may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as
described in Features below. Zener voltage tolerance options are identified
by part number suffix including tight-tolerance. A variety of other Zener
product offerings and packages are available by Microsemi to meet higher
or lower power and test current applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
FEATURES
Electrically similar to the JEDEC registered 1N5913B
thru 1N5956B zener series
Zener voltages available 3.3V to 200V
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers, e.g. MX1N5913BUR-1,
MV1N5923CUR-1, MSP1N5952DUR-1, etc.
Surface mount equivalents also available as
SMBJ5913B to SMBJ5956B, SMBG5913B to
SMBG5956B, SMAJ5913B to SMAJ5956B, or as
1PMT5913B to 1PMT5956B (see separate data
sheets)
Plastic body axial-leaded Zener equivalents are also
available as 1N5913BP to 1N5956BP (see separate
data sheet)
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 3.3 to 200 V
Leadless package for surface mounting
Ideal for high density mounting
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
Standard voltage tolerances are +/- 5% with B suffix
and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to +175
º
C
Thermal Resistance: 40
º
C/W junction to end cap, or
120
º
C/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
Steady-State Power: 1.50 watts at T
EC
< 115
o
C, or
1.25 watts at T
A
= 25
º
C when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed DO-213AB glass MELF
package
TERMINALS: End caps, tin-lead plated solderable
per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N5913BUR-1−1N5956BUR-1
Copyright
2005
1-04-2005 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
1N5913BUR-1 thru 1N5956BUR-1
(or MLL5913B thru MLL5956B)
SCOTTSDALE DIVISION
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.5 WATT ZENERS
ELECTRICAL CHARACTERISTICS @
T
EC
= 25
o
C unless otherwise noted*
MICROSEMI
PART
NUMBER
(Note 1 &4)
ZENER
VOLTAGE
V
Z
(Note 2)
Volts
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
TEST
CURRENT
I
ZT
DYNAMIC
IMPEDANCE
Z
ZT
(Note 3)
Ohms
10
9.0
7.5
6.0
5.0
4.0
2.0
2.0
2.5
3.0
3.5
4.0
4.5
5.5
6.5
7.0
9.0
10
12
14
17.5
19
23
28
33
38
45
53
67
70
86
100
120
140
160
200
250
300
380
450
600
700
900
1200
KNEE
CURRENT
I
ZK
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
KNEE
IMPEDANCE
Z
ZK
(Note 3)
Ohms
500
500
500
500
500
350
250
200
200
400
400
500
500
550
550
550
600
600
650
650
650
700
700
750
800
850
900
950
1000
1100
1300
1500
1700
2000
2500
3000
3100
4000
4500
5000
6000
6500
7000
8000
REVERSE
CURRENT
I
R
µAdc
100
75
25
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
REVERSE
VOLTAGE
V
R
Volts
1.0
1.0
1.0
1.0
1.5
2.0
3.0
4.0
5.2
6.0
6.5
7.0
8.0
8.4
9.1
9.9
11.4
12.2
13.7
15.2
16.7
18.2
20.6
22.8
25.1
27.4
29.7
32.7
35.8
38.8
42.6
47.1
51.2
56.0
62.2
69.2
76.0
83.6
91.2
98.9
114.0
121.6
136.8
152.0
MAX. DC
CURRENT
I
ZM
mA
454
416
384
348
319
294
267
241
220
200
182
164
150
136
125
115
100
93
83
75
68
62
55
50
45
41
38
34
31
29
26
24
22
20
18
16
15
13
12
11
10
9
8
7
WWW .
Microsemi
.C
OM
mA
1N5913BUR-1
113.6
1N5914BUR-1
104.2
1N5915BUR-1
96.1
1N5916BUR-1
87.2
1N5917BUR-1
79.8
1N5918BUR-1
73.5
1N5919BUR-1
66.9
1N5920BUR-1
60.5
1N5921BUR-1
55.1
1N5922BUR-1
50.0
1N5923BUR-1
45.7
1N5924BUR-1
41.2
1N5925BUR-1
37.5
1N5926BUR-1
34.1
1N5927BUR-1
31.2
1N5928BUR-1
28.8
1N5929BUR-1
25.0
1N5930BUR-1
23.4
1N5931BUR-1
20.8
1N5932BUR-1
18.7
1N5933BUR-1
17.0
1N5934BUR-1
15.6
1N5935BUR-1
13.9
1N5936BUR-1
12.5
1N5937BUR-1
11.4
1N5938BUR-1
10.4
1N5939BUR-1
9.6
1N5940BUR-1
8.7
1N5941BUR-1
8.0
1N5942BUR-1
7.3
1N5943BUR-1
6.7
1N5944BUR-1
6.0
1N5945BUR-1
5.5
1N5946BUR-1
5.0
1N5947BUR-1
4.6
1N5948BUR-1
4.1
1N5949BUR-1
3.7
1N5950BUR-1
3.4
1N5951BUR-1
3.1
1N5952BUR-1
2.9
1N5953BUR-1
2.5
1N5954BUR-1
2.3
1N5955BUR-1
2.1
1N5956BUR-1
1.9
o
*
T
EC
Maintained at 30 C, V
F
= 1.2V max @ I
F
= 200 mA (all types).
NOTE 1:
1N5913BUR-1−1N5956BUR-1
No suffix indicates a +/-20% tolerance on nominal
V
Z
. The suffix A denotes +/-10%, the standard suffix B denotes +/-5%, C denotes +/-2%, and
D denotes +/-1% tolerance.
Zener voltage (V
Z
) is measured at end cap temperatures T
EC
= 30
o
C. Voltage measurement to be performed 90 seconds after application of dc
current.
The zener impedance is derived from the 60 Hz ac voltage, which results when an ac current having an rms value equal to 10% of the dc zener
current (I
ZT
or I
ZK
) is superimposed on I
ZT
or I
ZK
.
This product series has also been previously identified as the MLL5913B thru MLL5956B series that included the enhanced metallurgical bond.
This alternate name may still be used.
NOTE 2:
NOTE 3:
NOTE 4:
Copyright
2005
1-04-2005 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2
1N5913BUR-1 thru 1N5956BUR-1
(or MLL5913B thru MLL5956B)
SCOTTSDALE DIVISION
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.5 WATT ZENERS
GRAPHS
WWW .
Microsemi
.C
OM
STEADY-STATE POWER DERATING
P
D
Power Dissipation (WATTS)
T
EC
T
A
Temperature (
o
C
)
FIGURE 1
Power Derating Curve Where T
EC
is End Cap Temp
and T
A
is Ambient Temperature on FR4 PC board.
FIGURE 2
PACKAGE DIMENSIONS
1N5913BUR-1−1N5956BUR-1
DIM
A
B
C
INCHES
MIN
MAX
0.094
0.105
0.189
0.205
0.016
0.022
MILLIMETERS
MIN
MAX
2.39
2.66
4.80
5.20
0.41
0.55
PAD LAYOUT
A
B
C
INCHES
.276
0.070
0.110
mm
7.00
1.8
2.8
Page 3
Copyright
2005
1-04-2005 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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