NOTE:
1. MATERIAL,
HOUSING: HIGH TEMP PLASTIC, UL94-V0,BLACK
TERMINAL: COPPER ALLOY , SQ=0.40±0.03MM
2. FINISH:
TERMINAL: GOLD AT CONTACT,
G/F OVER 1um(40u")MIN Ni OVER ALL
3. SPEC.:
PRODUCT SPEC: GS-12-629
PACKING SPEC: GS-14-1420
4. THE HSG. WILL WITHSTAND EXPOSURE TO 260C
PEAK TEMP. FOR 5 SEC. IN A WAVE SOLDER APPLICATION
WITH A PCB.
5. PRODUCT NUMBERING:
20021612 - 0 0 0 XX X X LF
LEAD FREE
PLATING:
1:GOLD FLASH ALL OVER
4:0.25um(10U")GOLD AT CONTACT
8:0.76um(30U")GOLD AT CONTACT
9:1u" GOLD OVER 30u" PdNi AT CONTACT
PACKING
T: TUBE
PIN COUNT
SEE TABLE 1
PDS: Rev :C
STATUS:Released
Printed: Mar 02, 2012
