位置数量
Number of Positions
96
Contact Current Rating (Max) (A)
.75
端子接触部电镀厚度
.76 µm [ 29.92 µin ]
PCB 端子端接区域电镀厚度
.76 – 1.52 µm [ 30 – 60 µin ]
Centerline (Pitch)
1.9 mm [ .075 in ]
PCB Hole Diameter
.46 mm [ .018 in ]
工组温度范围
-55 – 85 °C [ -67 – 185 °F ]
Circuit Application
Signal