D/ ROW VERTICAL SMT SOCKET LOW PROF.
2191 SERIES.
2.00 x 2.00 mm. (0.079 x 0.079”) pitch.
General Features
Electrical Features
Available in 4 through 80 circuits
Mates with pin header 2.00 mm. pitch 2026, 2027, 2028,
2029, 2075, 2076, 2160, 2037 and 2177 series
Accepts 0.50 mm. square pin
Dual Beam contact with different plating
Optional fixing post
Top / botton entry . Low profile 2.20 mm. high
Voltage rating: < 125V
Current rating: < 2 A
Contact resistance: < 20 mΩ
Dielectric withstanding voltage: 500 V AC/minute
Insulation resistance: >1000 MΩ
Capacitance: < 2pF at 1 KHz.
Materials
Insulator: Polyester nylon 6T UL 94 V-0
Contact: phosphor bronze
Operating temperature: -40ºC to +105ºC
RoHS compliant
Mechanical Features
Insertion force receptacle/plug: < 0,30 Kgf/pin
Unmating force receptacle/plug: > 0,02 Kgf/pin
Contact retention force to housing: > 0,300Kgf/pin
Durability: 50 cycles
Dimension Information
Ordering Information:
2191-
1
T-
2
XX-
3
P
4
E
5
1. Connector Series
2. (T) Contact Plating
B
±0.25
A
±0.20
2.00
Pin 0.15x0.50
T =
2.
Tin plated
T =
3.
Gold flash over nickel
Recommended Finish
T =
5.
15µ” gold over nickel
T =
6.
30µ” gold over nickel
T =
13.
Sel. gold flash over nickel overall
T =
15.
15µ" sel. gold over nickel overall
T =
16.
30µ" sel. gold over nickel overall
3. (XX) Number of circuits
(0.64)
0.90
2.00
Available in 4 through 80 circuits
4. (P) Fixing Options
ø0.800
C±
0.15
X
5 mm.
10 mm.
Nº Pines
03 a 25
26 a 40
0.90
P =
1.
Without fixing post
P =
2.
With fixing post
5. (E) Packing Options
E =
3.
Tube + Film
E =
4.
Reel + Film
E =
5.
Tube + Metallic Pad
E =
6.
Reel + Metallic Pad
4.00
Film
2.20±0.20
RECOMMENDED PCB LAYOUT
2.00
6.50±0.30
2.00
7.50
Metallic
Pad
ø0.90
DIMMENSIONS:
XX
A
½
2.00
2
1
(In mm.)
XX
B
½
2.00
2
XX
C
½
2.00
2
2
5.05
1.75
2.40
A-XX
FULL LINE CATALOGUE
FPGA/CPLD