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2198224-1

SFP+ Enhanced 1x2, PCI Heatsink

器件类别:连接器   

厂商名称:TE Connectivity(泰科)

厂商官网:http://www.te.com

器件标准:

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器件参数
参数名称
属性值
外形尺寸
SFP+
笼子类型
联动
包括的散热器
Connector System
缆到板
Sealable
连接器和端子端接到
印刷电路板
端口矩阵配置
1 x 2
端口数量
2
数据速率(最大值) (Gb/s)
16
散热器种类
插针
散热器高度类
PCI
散热器高度
4.2 mm [ .165 in ]
PCB 端接方法
通孔 - 免焊连接
PCB 安装方式
通孔免焊连接
连接器安装类型
板安装
笼子材料
镍银
PCB 厚度(建议)
1.5 mm [ .059 in ]
尾部长度
2.05 mm [ .081 in ]
工组温度范围
-55 – 105 °C [ -67 – 221 °F ]
适用于插拔式 I/O 产品
SFP+ SMT 连接器
插拔式 I/O 应用
SFP+ 增强型
Circuit Application
Signal
兼容的散热器
封装方法
托盘, 盒和托盘
EMI 遏制特性类型
弹性密封圈
包括的光管
文档预览
8
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
BY -
ALL RIGHTS RESERVED.
7
20
6
1
5
4
3
LOC
2
DIST
1
REVISIONS
P
LTR
DESCRIPTION
DATE
DWN
APVD
C
COPYRIGHT
20
PIN TYPE
HEAT SINK
2
MATERIAL:
CAGE ASSEMBLY: 0.25mm THICK NICKEL SILVER ALLOY
GASKET RETENTION PLATE: STAINLESS STEEL
EMI GASKET: PLATED FILLED SILICONE
HEATHSINK CLIP: STAINLESS STEEL
HEATSINK: ALUMINUM
FINISH:
HEATSINK: ELECTROLESS NICKEL
HEATSINK CLIP: PASSIVATE
DATUM AND BASIC DIMENSIONS ESTABLISHED BY CUSTOMER.
PADS AND VIAS CHASSIS GROUND.
10
GP
00
A
A1
RELEASED PER ECO-12-013192
RELEASED PER ECO-13-0014600
05SEP2012
12OCT2013
BMM
PP
MRS
SH
MINIMUM PC BOARD THICKNESS:
SINGLE SIDED: 1.5mm
3
4
11. CERTAIN MATING TRANCEIVERS MAY REQUIRE ADDITIONAL PCB THICKNESS
THAT WOULD NEED TO BE DETERMINED BY THE CUSTOMER.
12. PRODUCT COMPLIES WITH SPECIFICATION SFF-8433 IMPROVED PLUGGABLE
FORM FACTOR FOR SFP+ GANGED CAGES.
13
D
5. MATES WITH SFP MSA COMPLIANT RECIEVERS.
6. INTERPRETATION OF DATUM REFERENCE FRAME IN ACCORDANCE
WITH SECT 4.4.1.1 OR ASME Y14.5M-1994.
2198224-1,2,3,4
FINISHED ASSEMBLY
7
8
9
D
DIMENSION APPLIES PRIOR TO INSERTION OF SFP MODULE.
FIN TYPE
HEAT SINK
HOLE PATTERN REPEATS FOR EACH PORT, SPACING BETWEEN
PORTS IS 14.25mm.
REFERENCE APPLICATION SPEC. 114-13120, HOLE A, FOR RECOMMENDED
DRILL HOLE DIAMETER AND PLATING THICKNESS.
REFERENCE APPLICATION SPEC. 114-13120, HOLE B, FOR RECOMMENDED
DRILL HOLE DIAMETER AND PLATING THICKNESS.
2X 14 0.1
PORT OPENING
( 49.2 )
C
2198224-5,6,7,8
FINISHED ASSEMBLY
2X 8.95 0.15
PORT OPENING
( 9.7 )
A MAX
13
C
( 14.25 )
( 7.125 )
( 28.75 )
MEASURED ACROSS CAGE SIDES
34.25
MIN
8X R 0.3
MAX
( 2.05 ) TYP
38.9
0.3
GUIDE PINS
B
B
2X 10.4
( 1.5 ) MIN
10
PCB THICKNESS
+0.10
-0.14
TOP OF PCB
TO INSIDE OF
BEZEL CUTOUT
0.23
2X 29.7
RECOMMENDED BEZEL CUT-OUT
SINGLE SIDED APPLICATIONS
SCALE
4:1
A
( 35.4 )
2198224
MOUNTED ON PC BOARD
SHOWN THRU RECOMMENDED BEZEL
FIN TYPE
FIN TYPE
FIN TYPE
FIN TYPE
PIN TYPE
PIN TYPE
PIN TYPE
HEAT
SINK
PIN TYPE
DWN
CHK
DIMENSIONS:
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
22.5
18.1
15.5
22.5
18.1
15.5
13.2
A MAX
B. MATTHEWS
M. SCHMITT
M. SCHMITT
108-2364
12OCT2011
12OCT2011
12OCT2011
NETWORKING, SHORT
SAN
PCI
NETWORKING, TALL
2198224-8
2198224-7
2198224-6
2198224-5
2198224-4
2198224-3
2198224-2
2198224-1
PART
NUMBER
A
13.2
NETWORKING, SHORT
SAN
PCI
APPLICATION
NETWORKING, TALL
THIS DRAWING IS A CONTROLLED DOCUMENT.
TE Connectivity
NAME
mm
APVD
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
0.13
0.1
0.08
.05
.05
PRODUCT SPEC
APPLICATION SPEC
SFP+ ENHANCED 1X2 CAGE ASSEMBLY,
PRESS-FIT, EMI GASKET WITH HEATSINK
-
SIZE
CAGE CODE
DRAWING NO
1
WEIGHT
114-13120
1
4805 (3/11)
2
-
Customer Drawing
A1
00779
RESTRICTED TO
2198224
SCALE
5:1
SHEET
1
OF
2
REV
-
A1
8
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
BY -
ALL RIGHTS RESERVED.
7
20
6
5
4
3
LOC
2
DIST
1
REVISIONS
P
LTR
DESCRIPTION
DATE
DWN
APVD
C
COPYRIGHT
20
GP
2X
7
7
00
11.925
7
2X 12.25
2X 6.5
4X 2.875
3X 2
20X
12X (
0.95 )
0.5
0.03
-
SEE SHEET 1
-
-
-
2X
2X
7.125
2.325
18X
4
9
0.8
1.4
D
THIS AREA DENOTES COMPONENT
KEEP-OUT (TRACES ALLOWED)
PLATING REQUIRED
20X
2
0.05
4X
4.1
D
1.55
SEE DETAIL
0.05
F
D
1.55
0.05
4X
4.1
4X
32.1
2X
30
27.5
C
E
1
( 9.6 )
DETAIL
F
SCALE
10:1
22.5
2X
20
2X
17.8
15
2X
10
5
2X
26.8
2X
21.6
2X 2
4X
41.3
4X
25.9
C
3X
42.3
1.1
CROSS-HATCHED AREA
DENOTES EXPOSED
CHASSIS GROUND
B
2X
5
9.5
MAX
B
2X 12.05
G
DETAIL
SCALE
10:1
A
( 1.05 )
PLATING REQUIRED
4
8
2.5
MIN
SEE DETAIL
1
4X
14.25
G
4
14X
o2
1
7X (
1.05 )
4
8
PLATING REQUIRED
5X
28.5
CROSS-HATCHED AREA DENOTES
COMPONENT AND TRACE KEEP-OUT
(EXCEPT CHASSIS GROUND)
A
THIS DRAWING IS A CONTROLLED DOCUMENT.
DIMENSIONS:
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
DWN
CHK
3
BCS
A
C
3
B
RECOMMENDED PCB CONFIGURATION
WITH KEEP-OUT AREAS
SINGLE SIDED APPLICATIONS
SCALE
8:1
10
B. MATTHEWS
M. SCHMITT
M. SCHMITT
108-2364
12OCT2011
12OCT2011
12OCT2011
NAME
TE Connectivity
mm
APVD
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
0.13
0.1
0.08
.05
.05
PRODUCT SPEC
APPLICATION SPEC
SFP+ ENHANCED 1X2 CAGE ASSEMBLY,
PRESS-FIT, EMI GASKET WITH HEATSINK
-
SIZE
CAGE CODE
DRAWING NO
1
WEIGHT
114-13120
-
Customer Drawing
4805 (3/11)
A1
00779
RESTRICTED TO
2198224
SCALE
5:1
SHEET
2
OF
2
REV
-
A1
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参数对比
与2198224-1相近的元器件有:2198224-2、2198224-3、2198224-4。描述及对比如下:
型号 2198224-1 2198224-2 2198224-3 2198224-4
描述 SFP+ Enhanced 1x2, PCI Heatsink SFP+ Enhanced 1x2, SAN Heatsink SFP+ Enhanced 1x2, Networking Heatsink SFP+ Enhanced 1x2, Networking Heatsink
外形尺寸 SFP+ SFP+ SFP+ SFP+
笼子类型 联动 联动 联动 联动
包括的散热器
Connector System 缆到板 缆到板 缆到板 缆到板
Sealable
连接器和端子端接到 印刷电路板 印刷电路板 印刷电路板 印刷电路板
端口矩阵配置 1 x 2 1 x 2 1 x 2 1 x 2
端口数量 2 2 2 2
数据速率(最大值) (Gb/s) 16 16 16 16
散热器种类 插针 插针 插针 插针
散热器高度类 PCI SAN
散热器高度 4.2 mm [ .165 in ] 6.5 mm [ .256 in ] 9.1 mm [ .358 in ] 13.5 mm [ .531 in ]
PCB 端接方法 通孔 - 免焊连接 通孔 - 免焊连接 通孔 - 免焊连接 通孔 - 免焊连接
PCB 安装方式 通孔免焊连接 通孔免焊连接 通孔免焊连接 通孔免焊连接
连接器安装类型 板安装 板安装 板安装 板安装
笼子材料 镍银 镍银 镍银 镍银
PCB 厚度(建议) 1.5 mm [ .059 in ] 1.5 mm [ .059 in ] 1.5 mm [ .059 in ] 1.5 mm [ .059 in ]
尾部长度 2.05 mm [ .081 in ] 2.05 mm [ .081 in ] 2.05 mm [ .081 in ] 2.05 mm [ .081 in ]
工组温度范围 -55 – 105 °C [ -67 – 221 °F ] -55 – 105 °C [ -67 – 221 °F ] -55 – 105 °C [ -67 – 221 °F ] -55 – 105 °C [ -67 – 221 °F ]
适用于插拔式 I/O 产品 SFP+ SMT 连接器 SFP+ SMT 连接器 SFP+ SMT 连接器 SFP+ SMT 连接器
插拔式 I/O 应用 SFP+ 增强型 SFP+ 增强型 SFP+ 增强型 SFP+ 增强型
Circuit Application Signal Signal Signal Signal
兼容的散热器
封装方法 托盘, 盒和托盘 托盘, 盒和托盘 托盘, 盒和托盘 盒, 盒和托盘
EMI 遏制特性类型 弹性密封圈 弹性密封圈 弹性密封圈 弹性密封圈
包括的光管
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