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2199119-8

pci express / pci connectors .5pitch 3.2H key A emboss ngff minicard

器件类别:连接器   

厂商名称:All Sensors

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器件参数
参数名称
属性值
Manufacture
TE Connectivity
产品种类
Product Category
PCI Express / PCI Connectors
RoHS
Yes
位置数量
Number of Positions
67
安装角
Mounting Angle
Righ
安装风格
Mounting Style
SMD/SMT
外壳材料
Housing Material
Thermoplastic
触点材料
Contact Material
Copper Alloy
主体材料
Contact Plating
Gold
电流额定值
Current Rating
500 mA
绝缘电阻
Insulation Resistance
500 MOhms
系列
Packaging
Reel
工厂包装数量
Factory Pack Quantity
1200
电压额定值
Voltage Rating
50 V
文档预览
M2 NGFF Applications
ULTRABOOK
TABLET
SSD
SMART TV
The list goes on and on ...
Miniature in size.
Big in possibilities.
0.5MM PITCH WITH 67
POSITIONS & AVAILABLE
IN VARIOUS HEIGHTS
SUPPORTS HIGHER
DATA RATES IN A
DENSE FORM FACTOR
SAVES MORE THAN 20% PCB
REAL ESTATE COMPARED TO
PCIe MINI CARD
ENSURES PROPER
MATING WITH VARIOUS
MODULE CARDS
Quick Reference Guide
INNOVATIVE. INTELLIGENT. IN MINIATURE.
Meet the M.2
M.2 (NGFF)
NGFF connector, the new interface standard for
Connectors
tomorrow’s smaller, slimmer, smarter devices.
The M.2 (Next Generation Form Factor)
that meets
line
need
natural transition from the Mini Card and Half Mini Card to
M.2 is the only NGFF connector
product
the
is a
for faster data
rates and higher performance in a smaller
supports
a smaller form factor in both size and volume. It
form factor.
multiple function add-in cards / modules including: WiFi,
Tablets, notebooks,
Satellite
and gaming devices are just some of
Bluetooth, Global Navigation
ultrabooks
Systems, Near Field Communication, Hybrid Digital Radio, Wireless Gigabit
the applications
Alliance (WiGig), Wireless
that are
Area Network and Solid-State Storage Devices. It also adds functionality to PCIe Gen
Wide
supported by the pioneering M.2 product
Brought to the global market for the first time by TE Connectivity,
3, SATA 3, SATA I/O and USB 3. The new smaller form factor is suitable for applications in new thin platforms.
Visit
ngff.slim-solutions.com
today to find out more.
range – but the list goes on and on…
Features
• Available in various heights
• 0.5mm pitch with 67 positions
• Designed for both single and
double-sided modules
• Available in various keying
options for module cards
• Support PCI Express 3.0, USB 3.0,
& SATA 3.0
Benefits
• Wide product offering to meet
customers’ design needs
• Save more than 20% PCB
real estate compared to
PCIe Mini Card
• Reduces connector height
by 15%
• Ensures proper mating with
various module cards
• Supports higher data rates
Applications
• Notebooks, Ultrabooks &
Desktops
• Tablets
• Servers
• Portable Gaming Devices
• Devices that require SSDs
• Portable Mobile Devices
te.com/products/ngff
1
TE Connectivity
M.2 (NGFF) Connector
Ultrabook/
Notebook
Smart TV
GPS
Tablet
Server
Gaming
Device
SSD
Wireless Applications
• Wi-Fi
• WWAN (2G, 3G, 4G)
• Bluetooth
• WiGig
• GPS
• Solid State Storage Device (SSD)
• Global Navigation Satellite System (GNSS)
• Near Field Communication (NFC)
• Hybrid Digital Radio (HDR)
Host Interfaces
• PCIe, PCIe LP
• SSIC
• USB (2.0, HS, 3.0)
• SDIO
• UART
• PCM/ I2S
• I2C
• SATA
• DisplayPort
• Future variants of the above
te.com/products/ngff
2
TE Connectivity
M.2 (NGFF) Connector
Module Nomenclature
Example: Type 2242-D2-B-M
Used for double slot module cards. Note only single slot connectors are availale.
Type XX XX - XX - X - X*
Width (mm)
12
16
22
30
Length (mm)
16
26
30
38
42
60
80
110
S1
S2
S3
D1
D2
D3
D4
Component Max Ht. (mm)
T Max
1.2
1.35
1.5
1.2
1.35
1.5
1.5
B Max
0*
0*
0*
1.35
1.35
1.35
1.0
Key ID
A
B
C
D
E
F
G
H
J
K
L
M
Pin
8-15
12-19
16-23
20-27
24-31
28-35
39-46
43-50
47-54
51-58
55-62
59-66
Interface
PCIe X2/USB/I2C/DP X4
PCIe X2/SATA/USB/PCM/UIM/
SSIC/UART-12C
Reserved for Future Use
Reserved for Future Use
PCIe/USB/I2C/SDIO/UART/PCM
Reserved for Future Use
Future Memory Interface (FMI)
Reserved for Future Use
Reserved for Future Use
Reserved for Future Use
Reserved for Future Use
PCIe X4/SATA
* Only for dual slot cards.
M.2 (NGFF) Module Card Frequently Asked Questions
What type of applications use key A?
TE’s M.2 key A connectors are found in applications that use wireless connectivity including Wi-Fi, Bluetooth, NFC,
and / or WiGig. Module card types used include 1630, 2230 and 3030.
What type of applications use key B?
TE’s M.2 key B connectors are found in applications that use WWAN+GNSS or Solid State Storage Devices (SSD).
Module card types used include 3042, 2230, 2242, 2260, 2280 and 22110.
What type of applications use key E?
TE’s M.2 key E connectors are found in applications that use wireless connectivity including Wi-Fi, Bluetooth, NFC of
GNSS. Module card types used include 1630, 2230 and 3030.
What type of applications use key M?
TE’s M.2 key M connectors are found in applications that use Host I/Fs that are supported by either PCIe with up to
four lanes or SATA, as well as Solid State Storage Devices (SSD). Module card types used include 2242, 2260, 2280
and 22110.
te.com/products/ngff
3
TE Connectivity
M.2 (NGFF) Connector
Triple Insertion Module Method
• Step 1:
• Step 2:
• Step 3:
• Step 4:
Move the module against the housing’s chamber
Rotate the module to 25 degrees and insert it until the bottom of the
module surface reaches the ramp
Rotate the module to horizontal position by hand
Fix the module with a PCB screw to secure the module
Please refer to the application specification for a complete description of both the insertion and removal
method for modules. Note that midplane type product has a different method compared to the standard
top mount product.
Application Specification: 114-115006
M.2 (NGFF) Single vs. Double-Sided Modules
Limited Space Limits 2.25H
to Single-Sided Modules
Side #1
Side #1
(4.2H, 3.2H
and 1.80H)
(2.25H)
Side #2
Double-Sided Module
Single-Sided Module
The difference between single and dual-sided modules is functionality. All soldered down type module cards are
single-sided and do not have a pin layout. Single-sided modules are intended to be used in low profile applications.
There are two type of module cards, soldered down and connectorized. TE’s M.2 (NGFF) product line supports the
connectorized modules/ add-in cards.
te.com/products/ngff
4
TE Connectivity
M.2 (NGFF) Connector
Standard Product Portfolio
Four Heights
Standard Top Mount
2.25mm
4.2mm
3.2mm
Midplane (Offset) Mount
1.80mm
PN 2199133-X
Gold Plating
Key
A
2199125-X
2.25
2.15
1.08
0.63
No
B
E
M
A
2199119-X
3.2
3.1
1.94
1.48
Yes
B
E
M
A
2199230-X
4.2
4.1
2.94
2.48
Yes
B
E
M
A
2199133-X
Midplane
1.80
1.70
-
-
Yes
B
E
M
Gold Flash
-7
-1
-2
-13
-7
-1
-2
-13
-7
-1
-2
-13
-7
-1
-2
-10
15u”
-8
-3
-4
-14
-8
-3
-4
-15
-8
-3
-4
-15
-8
-3
-4
-11
30u”
-9
-5
-6
-15
-9
-5
-6
-16
-9
-5
-6
-16
-9
-5
-6
-12
All Dimensions in millimeters
PN 2199230-X
PN 2199119-X
PN 2199125-X
Base PN
Max.
Height
Nominal
Height
Dim. A
Dim. B
Dim. C
For Double
Sided
Moduleses
Dim. A:
Max. connector height
Dim. B:
Card Centerline to PCB
Dim. C:
Bottom of Card to PCB
Dim. B
Midplane Type = Offset Type
Note that the PN list will be extended in the future to support all key types designated by industry standards groups. Please visit the product landing
page for current information.
te.com/products/ngff
Dim. C
5
Dim. A
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