Series 511 Standard DIP Socket
w/Bifurcated Contacts & Solder Pin Tails
FEATURES
• Bifurcated Contacts with Solder Tail or Wire Wrap Pins
GENERAL SPECIFICATIONS
•
STANDARD BODY:
Black UL 94V-0 Glass-filled 4/6 Nylon
•
BIFURCATED CONTACTS:
Grade A Spring-tempered Phosphor Bronze per QQ-B-750
•
PIN PLATING:
50-130µ min. matte Sn per ASTM B545-97(2004)e1 over 50µ Ni per SAE AMS-
QQ-N-290B;
–OR–
50-130µ 90/10 Sn/Pb per MIL-T-10727 Type 1 over 50µ Ni per SAE AMS-
QQ-N-290B;
–OR–
10µ [0.25µ] min. Au per MIL-G-45204 over 50µ Ni per SAE AMS-QQ-N-290B
•
CONTACT CURRENT RATING:
1 amp
ORDERING INFORMATION
•
OPERATING TEMPERATURE:
-67°F to 221°F [-55°C to 105°C] Sn; -67°F to
XX-X 511-X XXX XX
257°F [-55°C 125°C] Au
•
INSERTION FORCE:
110g/pin average
Rails Option
•
WITHDRAWAL FORCE:
75g/pin average
WR = Without Rails
•
ACCEPTS LEADS:
Flat up to 0.014 thick x 0.020 wide [0.36 x 0.51], Round up to
Plating
0.020 [0.51] dia.
0 = Sn
•
LEAD LENGTHS:
accepts lengths from seating plane from 0.075-0.160 [1.91-
1 = Au
4.06]
0TL = Sn/Pb
MOUNTING CONSIDERATIONS
•
SUGGESTED PCB HOLE SIZE:
0.035 ±0.002 [0.89 ± 0.05] dia.
Termination
1 = Solder Pin Tail
Series
Row-to-Row Spacing
(Dim. “C”)
2 = 0.200 [5.08]
3 = 0.300 [7.62]
6 = 0.600 [15.24]
No. of Pins
(See Table)
Centers “C”
0.200 [5.08]
0.300 [7.62]
0.600 [15.24]
Width “D”
0.290 [7.36]
0.390 [9.90]
0.690 [17.54]
Available Sizes
8, 10
8, 14-20
8-24, 28-40, 48
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
FOR WIRE WRAP PINS, SEE DATA SHEETS 12005
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION: ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION.
SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE
FURNISHED, DEPENDING ON QUANTITY.
ARIES RESERVES THE RIGHT TO CHANGE PRODUCT GENERAL SPECIFICATIONS
WITHOUT NOTICE
PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE
CONSIDERED UNCONTROLLED
2609 Bartram Road
•
Bristol, PA 19007-6810 USA
TEL 215-781-9956
•
FAX 215-781-9845
WWW.ARIESELEC.COM
•
INFO@ARIESELEC.COM
12004
Rev. 5.3
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