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2317B-EP11-BGS1G

Heat Sink, Fin, Pin Fin Array, Omnidirect, Aluminum, Anodized, ROHS COMPLIANT

器件类别:热管理产品    耐热支撑装置   

厂商名称:Boyd Corporation

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器件参数
参数名称
属性值
厂商名称
Boyd Corporation
包装说明
ROHS COMPLIANT
Reach Compliance Code
unknown
主体材料
ALUMINUM
颜色
BLACK
构造
FIN
鳍板方向
OMNIDIRECT
面层
ANODIZED
高度
15.24 mm
长度
26.14 mm
轮廓
PIN FIN ARRAY
耐热支撑装置类型
HEAT SINK
宽度
20.47 mm
Base Number Matches
1
文档预览
5/21/12
2317B-EP11-BGS1G - heatsinks for BGA Devices
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BGA Heat Sinks
2317B-EP11-BGS1G
Pin Fin heat sink with BGS Clip attachment
RoHS:
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Call us: 1-855-32-AAVID
Email:
estore@aavid.com
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Features
BGS Clip saves board space by eliminating mounting holes
End plates firmly engage the device while springs apply mounting pressure
Pin Fin array allows omni-directional airflow to maximize heat dissipation
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Width: 26.10
Length: 20.50
Height: 15.20
Base Thickness: 3.81
Fin Thickness: Length 1.57, Width 1.70
# of Fins: Length 7, Width 7
Fin Tip to Tip: 0.00
Finish: Black Anodize
Thermal Performance
Natural Convection: 32.60
(based on a heatsink temperature rise of 75°C above ambient)
https://www.aavid.com/products/bga/2317b-ep11-bgs1g
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5/21/12
2317B-EP11-BGS1G - heatsinks for BGA Devices
Forced convection: 9.94
based on fully ducted airflow entering at 1.0 m/s (197 LFM).
Thermal Curve:
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Aavid will lead the electronics thermal management industry worldwide. We will be the first company customers call to enable their thermal designs anywhere in the world. We will respond with
extraordinary speed and will provide them with timely and cost-effective solutions because we understand their needs, their industry, and their culture. 2012 Aavid Thermalloy, LLC
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