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24AA08B-E/MC

IC,SERIAL EEPROM,1KX8,CMOS,LLCC,8PIN,PLASTIC

器件类别:存储    存储   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
Reach Compliance Code
compli
数据保留时间-最小值
200
耐久性
1000000 Write/Erase Cycles
I2C控制字节
1010XMMR
JESD-30 代码
R-PDSO-N8
JESD-609代码
e3
内存密度
8192 bi
内存集成电路类型
EEPROM CARD
内存宽度
8
湿度敏感等级
1
端子数量
8
字数
1024 words
字数代码
1000
最高工作温度
125 °C
最低工作温度
-40 °C
组织
1KX8
封装主体材料
PLASTIC/EPOXY
封装代码
SON
封装等效代码
SOLCC8,.11,20
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
SERIAL
峰值回流温度(摄氏度)
225
电源
3/5 V
编程电压
2.7 V
认证状态
Not Qualified
串行总线类型
I2C
最大待机电流
0.000001 A
最大压摆率
0.003 mA
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
MATTE TIN
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
写保护
HARDWARE
文档预览
24AA08/24LC08B
8K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA08
24LC08B
Note 1:
V
CC
Range
1.7-5.5
2.5-5.5
Max. Clock
Frequency
400 kHz
(1)
400 kHz
Temp.
Ranges
I
I, E
Description:
The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Electrically Erasable PROM. The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1
μA
and 1 mA,
respectively. The 24XX08 also has a page write
capability for up to 16 bytes of data. The 24XX08 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN and MSOP packages, and is
also available in the 5-lead SOT-23 package. All
packages are Pb-free and RoHS compliant.
100 kHz for V
CC
<2.5V
Features:
• Single supply with operation down to 1.7V for
24AA08 devices, 2.5V for 24LC08B devices
• Low-power CMOS technology:
- Read current 1 mA, typical
- Standby current 1
μA,
typical
• 2-wire serial interface, I
2
C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• Page write time 3 ms, typical
• Self-timed erase/write cycle
• 16-byte page write buffer
• Hardware write-protect
• ESD protection >4,000V
• More than 1 million erase/write cycles
• Data retention >200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, MSOP and 5-lead SOT-23
• Pb-free and RoHS compliant
• Temperature ranges:
- Industrial (I):
-40°C to +85°C
- Automotive (E): -40°C to +125°C
Block Diagram
WP
HV
Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SCL
YDEC
SDA
V
CC
V
SS
Sense Amp.
R/W Control
Package Types
PDIP, MSOP
A0
A1
A2
V
SS
1
2
3
4
SOT-23-5
SCL
Vss
SDA
Note:
1
2
3
4
Vcc
5
WP
A0 1
A1 2
A2 3
V
SS
4
8
7
6
5
V
CC
WP
SCL
A0
A1
A2
SOIC, TSSOP
1
2
3
4
DFN
8 V
CC
7 WP
6 SCL
5 SDA
8
7
6
5
V
CC
WP
SCL
SDA
SDA V
SS
*24XX08 is used in this document as a generic part
number for the 24AA08/24LC08B devices.
Pins A0, A1 and A2 are not used by the 24XX08. (No
internal connections).
©
2007 Microchip Technology Inc.
DS21710G-page 1
24AA08/24LC08B
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
V
CC
.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. V
SS
......................................................................................................... -0.3V to V
CC
+1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins
......................................................................................................................................................≥
4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
V
CC
= +1.7V to +5.5V
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
DC CHARACTERISTICS
Param.
Symbol
No.
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
V
IH
V
IL
V
HYS
V
OL
I
LI
I
LO
C
IN
,
C
OUT
I
CC
read
I
CCS
Standby current
Characteristic
WP, SCL and SDA pins
High-level input voltage
Low-level input voltage
Hysteresis of Schmitt
Trigger inputs
Low-level output voltage
Input leakage current
Output leakage current
Pin capacitance
(all inputs/outputs)
Typ.
0.1
0.05
0.01
Max.
0.3 V
CC
0.40
±1
±1
10
3
1
1
5
Units
V
V
V
V
μA
μA
pF
mA
mA
μ
A
μA
(Note)
Conditions
0.7 V
CC
0.05 V
CC
I
OL
= 3.0 mA, V
CC
= 2.5V
V
IN
= .1V to V
CC
V
OUT
= .1V to V
CC
V
CC
= 5.0V
(Note)
T
A
= 25°C, F
CLK
= 1 MHz
V
CC
= 5.5V, SCL = 400 kHz
Industrial
Automotive
SDA = SCL = V
CC
WP = V
SS
I
CC
write
Operating current
Note:
This parameter is periodically sampled and not 100% tested.
DS21710G-page 2
©
2007 Microchip Technology Inc.
24AA08/24LC08B
TABLE 1-2:
AC CHARACTERISTICS
V
CC
= +1.7V to +5.5V
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E):
T
A
= -40°C to +125°C
Min.
600
4000
1300
4700
600
4000
600
4700
0
100
250
600
4000
1300
4700
Typ.
Max.
400
100
300
1000
300
900
3500
Units
kHz
ns
ns
ns
Conditions
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
2.5V
V
CC
5.5V
(Note 1)
1.7V
V
CC
<
2.5V
(24AA08)
(Note 1)
(Note 1)
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
(Note 2)
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
AC CHARACTERISTICS
Param.
Symbol
No.
1
2
3
4
F
CLK
T
HIGH
Characteristic
Clock frequency
Clock high time
Clock low time
SDA and SCL rise time
(Note 1)
SDA and SCL fall time
Start condition hold time
Start condition setup
time
Data input hold time
Data input setup time
Stop condition setup
time
Output valid from clock
(Note 2)
Bus free time: Time the
bus must be free before
a new transmission can
start
Output fall time from V
IH
minimum to V
IL
maximum
Input filter spike
suppression
(SDA and SCL pins)
Write cycle time (byte or
page)
Endurance
T
LOW
T
R
5
6
7
8
9
10
11
12
T
F
T
HD
:
STA
T
SU
:
STA
T
HD
:
DAT
T
SU
:
DAT
T
SU
:
STO
T
AA
T
BUF
ns
ns
ns
ns
ns
ns
ns
ns
13
T
OF
20+0.1C
B
250
250
50
ns
2.5V
V
CC
5.5V
1.7V
V
CC
<
2.5V
(24AA08)
(Notes 1 and 3)
14
T
SP
ns
15
16
Note 1:
2:
3:
4:
T
WC
1M
5
ms
cycles 25°C,
(Note 4)
Not 100% tested. C
B
= total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined T
SP
and V
HYS
specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a
T
I
specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
©
2007 Microchip Technology Inc.
DS21710G-page 3
24AA08/24LC08B
FIGURE 1-1:
BUS TIMING DATA
5
3
SCL
7
SDA
IN
6
14
11
SDA
OUT
12
8
9
10
4
2
FIGURE 1-2:
BUS TIMING START/STOP
D4
SCL
7
SDA
6
10
Start
Stop
DS21710G-page 4
©
2007 Microchip Technology Inc.
24AA08/24LC08B
2.0
FUNCTIONAL DESCRIPTION
3.4
Data Valid (D)
The 24XX08 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX08 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited, although only the last sixteen
will be stored when doing a write operation. When an
overwrite does occur it will replace data in a first-in first-
out (FIFO) fashion.
3.0
BUS CHARACTERISTICS
The following
bus protocol
has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 3-1).
3.5
Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Note:
The 24XX08 does not generate any
Acknowledge bits if an internal program-
ming cycle is in progress.
3.1
Bus Not Busy (A)
Both data and clock lines remain high.
3.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
3.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
The device that acknowledges, has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX08) will leave the data line
high to enable the master to generate the Stop
condition.
FIGURE 3-1:
(A)
SCL
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(D)
(D)
(C)
(A)
SDA
Start
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
©
2007 Microchip Technology Inc.
DS21710G-page 5
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参数对比
与24AA08B-E/MC相近的元器件有:24LC08BHT-I/MC、24AA08B-I/MC、24AA08B-I/OT。描述及对比如下:
型号 24AA08B-E/MC 24LC08BHT-I/MC 24AA08B-I/MC 24AA08B-I/OT
描述 IC,SERIAL EEPROM,1KX8,CMOS,LLCC,8PIN,PLASTIC eeprom 8K 1K X 8 2.5V ser EE ind 1/2 array WP IC,SERIAL EEPROM,1KX8,CMOS,LLCC,8PIN,PLASTIC IC,SERIAL EEPROM,1KX8,CMOS,TSOP,5PIN,PLASTIC
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
是否无铅 不含铅 - 不含铅 不含铅
是否Rohs认证 符合 - 符合 符合
Reach Compliance Code compli - compli compli
数据保留时间-最小值 200 - 200 200
耐久性 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 1010XMMR - 1010XMMR 1010XMMR
JESD-30 代码 R-PDSO-N8 - R-PDSO-N8 R-PDSO-G5
JESD-609代码 e3 - e3 e3
内存密度 8192 bi - 8192 bi 8192 bi
内存集成电路类型 EEPROM CARD - EEPROM CARD EEPROM CARD
内存宽度 8 - 8 8
湿度敏感等级 1 - 1 1
端子数量 8 - 8 5
字数 1024 words - 1024 words 1024 words
字数代码 1000 - 1000 1000
最高工作温度 125 °C - 85 °C 85 °C
最低工作温度 -40 °C - -40 °C -40 °C
组织 1KX8 - 1KX8 1KX8
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SON - SON TSOP
封装等效代码 SOLCC8,.11,20 - SOLCC8,.11,20 TSOP5/6,.11,37
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
并行/串行 SERIAL - SERIAL SERIAL
峰值回流温度(摄氏度) 225 - 225 225
电源 3/5 V - 3/5 V 3/5 V
编程电压 2.7 V - 2.7 V 2.7 V
认证状态 Not Qualified - Not Qualified Not Qualified
串行总线类型 I2C - I2C I2C
最大待机电流 0.000001 A - 0.000001 A 0.000001 A
最大压摆率 0.003 mA - 0.003 mA 0.003 mA
表面贴装 YES - YES YES
技术 CMOS - CMOS CMOS
温度等级 AUTOMOTIVE - INDUSTRIAL INDUSTRIAL
端子面层 MATTE TIN - MATTE TIN Matte Tin (Sn)
端子形式 NO LEAD - NO LEAD GULL WING
端子节距 0.5 mm - 0.5 mm 0.95 mm
端子位置 DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
写保护 HARDWARE - HARDWARE HARDWARE
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