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24C01CT-C/STG

128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8

器件类别:存储    存储   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
零件包装代码
TSSOP
包装说明
4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8
针数
8
Reach Compliance Code
compli
ECCN代码
EAR99
最大时钟频率 (fCLK)
0.4 MHz
数据保留时间-最小值
200
耐久性
1000000 Write/Erase Cycles
I2C控制字节
1010DDDR
JESD-30 代码
R-PDSO-G8
JESD-609代码
e3
长度
4.4 mm
内存密度
1024 bi
内存集成电路类型
EEPROM
内存宽度
8
湿度敏感等级
1
功能数量
1
端子数量
8
字数
128 words
字数代码
128
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
128X8
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行
SERIAL
峰值回流温度(摄氏度)
260
电源
2/5 V
认证状态
Not Qualified
座面最大高度
1.1 mm
串行总线类型
I2C
最大待机电流
0.00005 A
最大压摆率
0.003 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
3 mm
最长写入周期时间 (tWC)
1.5 ms
Base Number Matches
1
文档预览
24AA00/24LC00/24C00
24AA014/24LC014
24AA02/24LC02B
24AA024/24LC024
24AA04/24LC04B
24AA16/24LC16B
24AA64/24LC64
24AA256/24LC256/24FC256
24AA01/24LC01B
24C01C
24C02C
24AA025/24LC025
24AA08/24LC08B
24AA32A/24LC32A
24AA128/24LC128/24FC128
24AA512/24LC512/24FC512
I
2
C
Serial EEPROM Family Data Sheet
Features:
• 128-bit through 512 Kbit devices
• Single-supply with operation down to 1.8V for
24AAXX devices
• Low-power CMOS technology:
- 1 mA active current typical
- 1
μA
standby current typical (I-temp)
• 2-wire serial interface bus, I
2
C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (1.8V) and 400 kHz (≥ 2.5V) compatibility
• 1 MHz for 24FCXX products
• Self-timed write cycle (including auto-erase)
• Page write buffer
• Hardware write-protect available on most devices
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1 million erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP and MSOP packages
• 5-lead SOT-23 package (most 1-16 Kbit devices)
• 8-lead 2x3mm and 5x6mm DFN packages
available
• Available for extended temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Description:
The Microchip Technology Inc. 24CXX, 24LCXX,
24AAXX and 24FCXX (24XX*) devices are a family of
128-bit through 512 Kbit Electrically Erased PROMs.
The devices are organized in blocks of x8-bit memory
with 2-wire serial interfaces. Low voltage design
permits operation down to 1.8V (for 24AAXX devices),
with standby and active currents of only 1
μA
and 1
mA, respectively. Devices 1 Kbit and larger have page
write capability. Parts having functional address lines
allow connection of up to 8 devices on the same bus.
The 24XX family is available in the standard 8-pin
PDIP, surface mount SOIC, TSSOP and MSOP pack-
ages. Most 128-bit through 16 Kbit devices are also
available in the 5-lead SOT-23 package. DFN
packages (2x3mm or 5x6mm) are also available. All
packages are available in a Pb-free (Matte Tin) finish.
Package Types
(1)
PDIP/SOIC
A0
A1
A2
V
SS
1
2
3
4
8
7
6
5
V
CC
WP
(3)
SCL
SDA
A0
A1
A2
V
SS
TSSOP/MSOP
(2)
1
2
3
4
8
7
6
5
V
CC
WP
(3)
SCL
SDA
A0
A1
NC
NC
NC
A2
V
SS
1
2
3
4
5
6
7
TSSOP
14
13
12
11
10
9
8
V
CC
WP
NC
NC
NC
SCL
SDA
SOT-23-5
(24XX00)
SCL
V
SS
SDA
1
2
3
4
NC
5
V
CC
SOT-23-5
(all except 24XX00)
A0 1
SCL
V
SS
SDA
1
2
3
4
V
CC
5
WP
A1 2
A2 3
V
SS
4
DFN
8 V
CC
7 WP
(3)
6 SCL
5 SDA
Note 1:
Pins A0, A1, A2 and WP are not used by some
devices (no internal connections). See Table 1-1,
Device Selection Table, for details.
Pins A0 and A1 are no-connects for the 24XX128
and 24XX256 MSOP devices.
Pin 7 is “not used” for 24XX00, 24XX025 and
24C01C.
2:
3:
*24XX is used in this document as a generic part number for 24 series devices in this data sheet. 24XX64, for example,
represents all voltages of the 64 Kbit device.
©
2005 Microchip Technology Inc.
DS21930A-page 1
24AAXX/24LCXX/24FCXX
TABLE 1-1:
Part Number
128-bit devices
24AA00
24LC00
24C00
1 Kb devices
24AA01
24LC01B
24AA014
24LC014
24C01C
2 Kb devices
24AA02
24LC02B
24AA024
24LC024
24AA025
24LC025
24C02C
4 Kb devices
24AA04
24LC04B
8 Kb devices
24AA08
24LC08B
16 Kb devices
24AA16
24LC16B
32 Kb devices
24AA32A
24LC32A
64 Kb devices
24AA64
24LC64
1.8-5.5V
2.5-5.5V
400 kHz
(2)
400 kHz
32 bytes
Entire Array
A0, A1, A2
I
I, E
P, SN, SM, ST, MS, MC
1.8-5.5V
2.5-5.5V
400 kHz
(2)
400 kHz
32 bytes
Entire Array
A0, A1, A2
I
I, E
P, SN, SM, ST, MS, MC
1.8-5.5V
2.5-5.5V
400 kHz
(2)
400 kHz
16 bytes
Entire Array
None
I
I, E
P, SN, ST, MS, OT, MC
1.8-5.5V
2.5-5.5V
400 kHz
(2)
400 kHz
16 bytes
Entire Array
None
I
I, E
P, SN, ST, MS, OT, MC
1.8-5.5V
2.5-5.5V
400 kHz
(2)
400 kHz
16 bytes
Entire Array
None
I
I, E
P, SN, ST, MS, OT, MC
1.8-5.5V
2.5-5.5V
1.8-5.5V
2.5-5.5V
1.8-5.5V
2.5-5.5V
4.5-5.5V
400 kHz
(2)
400 kHz
400 kHz
(2)
400 kHz
400 kHz
(2)
400 kHz
400 kHz
8 bytes
16 bytes
16 bytes
16 bytes
Entire Array
Entire Array
None
Upper Half
of Array
None
A0, A1, A2
A0, A1, A2
A0, A1, A2
I
I, E
I
I
I
I
C, I, E
P, SN, ST, MC
P, SN, ST,MS, MC
P, SN, ST, MS, MC
P, SN, ST, MS, OT, MC
1.8-5.5V
2.5-5.5V
1.8-5.5V
2.5-5.5V
400 kHz
(2)
400 kHz
400 kHz
(2)
400 kHz
8 bytes
16 bytes
16 bytes
Entire Array
Entire Array
None
None
A0, A1, A2
A0, A1, A2
I
I, E
I
I
C, I, E
P, SN, ST, MC
P, SN, ST, MS, MC
P, SN, ST, MS, OT, MC
1.8-5.5V
2.5-5.5V
4.5-5.5V
400 kHz
(1)
400 kHz
(1)
400 kHz
None
None
C, I
C, I
C, I, E
P, SN, ST, OT, MC
DEVICE SELECTION TABLE
V
CC
Range
Max Clock
Frequency
Page
Size
Write-
Protect
Scheme
Functional
Address
Pins
Temp
Range
Packages
(5)
4.5V-5.5V 400 kHz
Note 1:
100 kHz for V
CC
<4.5V.
2:
100 kHz for V
CC
<2.5V.
3:
400 kHz for V
CC
<2.5V
4:
Pins A0 and A1 are no-connects for the 24XX128 and 24XX256 in the MSOP package.
5:
P = 8-PDIP, SN = 8-SOIC (150 mil JEDEC), ST = 8-TSSOP, OT = 5 or 6-SOT23, MC = 2x3mm DFN,
MS = 8-MSOP, SM = 8-SOIC (200 mil EIAJ), MF = 5x6mm DFN, ST14 = 14-TSSOP.
DS21930A-page 2
©
2005 Microchip Technology Inc.
24AAXX/24LCXX/24FCXX
TABLE 1-1:
Part Number
128 Kb devices
24AA128
24LC128
24FC128
256 Kb devices
24AA256
24LC256
24FC256
512 Kb devices
24AA512
24LC512
24FC512
1.8-5.5V
2.5-5.5V
400 kHz
(2)
400 kHz
128
bytes
Entire Array
A0, A1, A2
I
I, E
I
P, SM, MF, ST14
1.8-5.5V
2.5-5.5V
1.8-5.5V
400 kHz
(2)
400 kHz
1 MHz
(3)
64 bytes
Entire Array
A0, A1,
A2
(4)
I
I, E
I
P, SN, SM, ST, MS, MF,
ST14
1.8-5.5V
2.5-5.5V
1.8-5.5V
400 kHz
(2)
400 kHz
1 MHz
(3)
64 bytes
Entire Array
A0, A1,
A2
(4)
I
I, E
I
P, SN, SM, ST, MS, MF,
ST14
DEVICE SELECTION TABLE (CONTINUED)
V
CC
Range
Max Clock
Frequency
Page
Size
Write-
Protect
Scheme
Functional
Address
Pins
Temp
Range
Packages
(5)
1.8-5.5V
(3)
1 MHz
Note 1:
100 kHz for V
CC
<4.5V.
2:
100 kHz for V
CC
<2.5V.
3:
400 kHz for V
CC
<2.5V
4:
Pins A0 and A1 are no-connects for the 24XX128 and 24XX256 in the MSOP package.
5:
P = 8-PDIP, SN = 8-SOIC (150 mil JEDEC), ST = 8-TSSOP, OT = 5 or 6-SOT23, MC = 2x3mm DFN,
MS = 8-MSOP, SM = 8-SOIC (200 mil EIAJ), MF = 5x6mm DFN, ST14 = 14-TSSOP.
©
2005 Microchip Technology Inc.
DS21930A-page 3
24AAXX/24LCXX/24FCXX
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
V
CC
.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. V
SS
......................................................................................................... -0.6V to V
CC
+1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins
......................................................................................................................................................≥
4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 2-1:
DC CHARACTERISTICS
Electrical Characteristics:
Commercial (C): V
CC
= +1.8V to 5.5V T
A
= 0°C to +70°C
Industrial (I):
V
CC
= +1.8V to 5.5V T
A
= -40°C to +85°C
Automotive (E): V
CC
= +2.5V to 5.5V T
A
= -40°C to 125°C
Characteristic
A0, A1, A2, SCL, SDA and
WP pins:
High-level input voltage
Low-level input voltage
Hysteresis of Schmitt Trigger
inputs (SDA, SCL pins)
Low-level output voltage
Input leakage current
Output leakage current
Pin capacitance
(all inputs/outputs)
Min.
0.7 V
CC
0.05 V
CC
Max.
0.3 V
CC
0.2 V
CC
0.40
±1
±1
10
400
1
Units
V
V
V
V
V
μA
μA
pF
μA
mA
mA
mA
μA
V
CC
2.5V
V
CC
< 2.5V
(Note 1)
I
OL
= 3.0 mA @ V
CC
= 2.5V
V
IN
= V
SS
or V
CC
V
OUT
= V
SS
or V
CC
V
CC
= 5.0V
(Note 1)
T
A
= 25°C, F
CLK
= 1 MHz
24XX128, 256, 512: V
CC
= 5.5V,
SCL = 400 kHz
All except 24XX128, 256, 512:
V
CC
= 5.5V, SCL = 400 kHz
V
CC
= 5.5V, All except 24XX512
V
CC
= 5.5V, 24XX512
T
A
= -40°C to +85°C
SCL = SDA = V
CC
= 5.5V
A0, A1, A2, WP = V
SS
or V
CC
T
A
= -40°C to 125°C
SCL = SDA = V
CC
= 5.5V
A0, A1, A2, WP = V
SS
or V
CC
24C01C and 24C02C only
SCL = SDA = V
CC
= 5.5V
A0, A1, A2, WP = V
SS
or V
CC
Conditions
DC CHARACTERISTICS
Param.
No.
D1
D2
D3
D4
D5
D6
D7
D8
D9
Sym.
V
IH
V
IL
V
HYS
V
OL
I
LI
I
LO
C
IN
,
C
OUT
I
CC
Read Operating current
I
CC
Write
D10
I
CCS
Standby current
3
5
1
5
μA
50
μA
Note 1:
This parameter is periodically sampled and not 100% tested.
DS21930A-page 4
©
2005 Microchip Technology Inc.
24AAXX/24LCXX/24FCXX
TABLE 2-2:
AC CHARACTERISTICS – ALL EXCEPT 24XX00, 24C01C
AND 24C02C
Electrical Characteristics:
Industrial (I):
V
CC
= +1.8V to 5.5V T
A
= -40°C to +85°C
Automotive (E): V
CC
= +2.5V to 5.5V T
A
= -40°C to 125°C
Characteristic
Clock frequency
Min.
4000
600
600
500
4700
1300
1300
500
4000
600
600
250
4700
600
600
250
0
250
100
100
4000
600
600
250
4000
600
600
4700
1300
1300
Max.
100
400
400
1000
1000
300
300
300
100
Units
kHz
Conditions
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
<
2.5V 24FCXXX
2.5V
V
CC
5.5V 24FCXXX
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
<
2.5V 24FCXXX
2.5V
V
CC
5.5V 24FCXXX
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
<
2.5V 24FCXXX
2.5V
V
CC
5.5V 24FCXXX
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
5.5V 24FCXXX
All except 24FCXXX
1.8V
V
CC
5.5V 24FCXXX
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
<
2.5V 24FCXXX
2.5V
V
CC
5.5V 24FCXXX
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
<
2.5V 24FCXXX
2.5V
V
CC
5.5V 24FCXXX
(Note 2)
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
5.5V 24FCXXX
1.8 V
V
CC
<
2.5V
2.5 V
V
CC
5.5V
1.8V
V
CC
<
2.5V 24FCXXX
2.5 V
V
CC
5.5V 24FCXXX
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
5.5V 24FCXXX
1.8V
V
CC
<
2.5V
2.5V
V
CC
5.5V
1.8V
V
CC
5.5V 24FCXXX
AC CHARACTERISTICS
Param.
No.
1
Sym.
F
CLK
2
T
HIGH
Clock high time
ns
3
T
LOW
Clock low time
ns
4
T
R
SDA and SCL rise time
(Note 1)
SDA and SCL fall time
(Note 1)
ns
5
6
T
F
ns
ns
T
HD
:
STA
Start condition hold time
7
T
SU
:
STA
Start condition setup time
ns
8
9
T
HD
:
DAT
Data input hold time
T
SU
:
DAT
Data input setup time
ns
ns
10
T
SU
:
STO
Stop condition setup time
ns
11
T
SU
:
WP
WP setup time
ns
12
T
HD
:
WP
WP hold time
ns
Note 1:
Not 100% tested. C
B
= total capacitance of one bus line in pF.
2:
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3:
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site:
www.microchip.com.
4:
24FCXXX denotes the 24FC128, 24FC256 and 24FC512 devices.
©
2005 Microchip Technology Inc.
DS21930A-page 5
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