In order to meet the user need of miniaturization and high performance of mobile communication
equipment, we have developed the fillet-less surface mounted tantalum chip capacitor which is
considered for not only miniaturization / low profile but also mounting area.
Tantalum chip capacitors are used in digital mobile communication equipment, such as mobile
phone and PHS, and mobile AV equipment, such as digital video camera, digital still camera and mini-
disk player. The tantalum chip capacitors corresponding fillet-less surface mounting will contribute to
the micro-miniaturizing and higher performance of these mobile multimedia equipment.
FEATURES
1. Original face-down terminal structure makes possible of the miniaturization of components and
also mounting area because land dimensions can be designed almost the same size as the
terminal. Also, as it can form micro fillet, checking at mounting is possible.
2. In addition to the 1608 and 2012 size, 3216L and 3528L size are added to the series. These
correspond to a wide range capacitance of 4.7-220µF.
3. Standardized the height of the product to 1.1 mm (low profile) for all 2012 size to 3528L size.
4. The most suitable for high performance miniaturized mobile equipment such as DVC, DSC,
mobile phone, and PHS.
5. Type 251’s M case (face-down terminal, 1608 size) and S case (face-down terminal, 2012 size)
are registered products with JEITA / Electronic Devices Registration Center’s registration
system of surface-mount devices.
6. Lead free products.
CHARACTERISTICS
ITEM
Failure rate level
Operating temperature
Rated voltage
Capacitance range
Capacitance tolerance
CHARACTERISTICS
1%/1000h (M)
-55 ~ +125°C (voltage derating when exceeding +85°C)
When +125°C, 2/3✕RV
4-6.3-10 VDC
4.7 ~ 220
µF
±20%(M)
CATALOG NUMBERS AND RATINGS
Catalog number (
1
)
251 M 4001 226 M _
1
251 M 4001 476 M _
1
251 M 4001 107 M _
1
251 M 4001 227 M _
1
251 M 6301 106 M _
1
251 M 6301 226 M _
1
251 M 6301 336 M _
1
251 M 6301 476 M _
1
251 M 6301 107 M _
1
251 M 6301 157 M _
1
251 M 1002 475 M _
1
251 M 1002 106 M _
1
251 M 1002 156 M _
1
251 M 1002 226 M _
1
251 M 1002 476 M _
1
251 M 1002 686 M _
1
Rated
Voltage
VDC
4
4
4
4
6.3
6.3
6.3
6.3
6.3
6.3
10
10
10
10
10
10
Table-1
Surge voltage
Case
Max dissipation factor ESR
Capacitance Tolerance Code Max DC Lct.
µA
VDC
Ω
±%
µF
(
2
) 20°C 85°C 125°C -55°C 20°C 85°C 125°C 100kHz
85°C 125°C
3
22
22 0.30 0.106 0.30 0.30 4
20
4.6
M
0.9
18
47
47 0.30 0.15 0.30 0.30 4
20
S
1.9
38
100 20
A
4
80 100 0.30 0.15 0.30 0.03 2
220 20
B
8.8 176 220 0.30 0.15 0.30 0.03 1
10
7.9 0.15 0.08 0.15 0.15 8
7.2 4.8
20
M
0.6
6
22
17 0.16 0.08 0.16 0.16 4
20
S
1.4
14
33
26 0.30 0.15 0.30 0.30 4
20
S
2.1
21
47
37 0.20 0.10 0.20 0.20 2
20
A
3.0
30
100 20
79 0.20 0.10 0.20 0.20 1
B
6.3
63
150 20
B
9.5
95 118 0.30 0.15 0.30 0.30 1
6.3 0.12 0.06 0.12 0.12 10
11.5 7.6 4.7
20
M
0.5
5
10
13 0.16 0.08 0.16 0.16 4
20
S
1
10
15
19 0.16 0.08 0.16 0.16 4
20
S
1.5
15
22
28 0.20 0.10 0.20 0.20 2
20
A
2.2
22
47
59 0.20 0.10 0.20 0.20 1
20
B
4.7
47
68
85 0.20 0.10 0.20 0.20 1
20
B
6.8
68
///
/////
/////
///
/////
/////
(1) _
1
: No code for single item. Put code “R” for taping specification.
(2) A and B Case are under development.
DIMENSIONS
L
W
Case
Size
T
M
P
1
P
2
P
1
S
A
B
C
1608
2012
3216L
3528L
1.6
2.0
3.2
3.5
0.85
1.25
1.6
2.8
0.8
1.1
1.1
1.1
0.5
0.5
0.8
0.8
0.65
1.05
1.65
1.95
0.75
0.9
1.2
2.2
(mm)
Case
Code
L±0.1
W±0.1
T±0.1
P
1
±0.1
P
2
±0.1
C±0.1
FREQUENCY CHARACTERISTICS
Capacitance
change
Phase angle
1000
Impedance
Impedance&ESR(Ω)
100
10
ESR
1
0.1
0.001
0.01
0.1
1
10
100
Frequency(kHz)
1,000
10,000
100,000 1,000,000
TEMPERATURE CHARACTERISTICS
251M 6.3VDC-10µF M-case
12
10
8
6
Capacitance
change(%)
4
2
0
-2
-4
-6
-8
-60
-40
-20
0
20
40
60
Temperature (°C)
80
100
120
Leakage current (µA)
10
100
MAX
Xbar
MIN
1
0.1
Dissipation factor
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0.01
0.001
-40
-20
0
20
40
60
Temperature (°C)
80
100
120
-60
0 20 40 60 80 100 120
Temperature (°C)
Phase angle(deg)
20%
0%
-20%
-40%
-60%
-80%
-100%
251M 6.3VDC-10µF M-case
20
0
-20
-40
-60
-80
-100
Capacitance
change(%)
PERFORMANCE AND TEST METHOD
NO
1
2
3
4
TEST ITEM
Leakage Current (µA)
Capacitance
Dissipation Factor
Characteristics Step 1
at High and
Low
Temperature
Step 2
PERFORMANCE
Shall not exceed 0.01CV or 0.5 whichever
is greater
Shall be within tolerance of the nominal
value specified.
Shall not exceed the value in Table 1.
TEST METHOD
Applied voltage: Rated voltage for 5
minutes
Frequency: 120Hz
±20%
Voltage: 0.5Vrms+1.5-2VDC
Temperature: 20±2°C
Leakage Current (µA) Shall not exceed the value in No 1.
Capacitance
Shall be within tolerance of the nominal value specified.
Dissipation Factor Shall not exceed the value in Table 1.
Capacitance
Dissipation Factor
Within -15/+0% of the value in Step 1.
Shall not exceed the value in Table 1.
Temperature: -55±3°C
Temperature: 20±2°C
Step 3 Leakage Current (µA) Shall not exceed the value in No 1.
Capacitance
Within
±2%
of the value in Step 1.
Dissipation Factor Shall not exceed the value in Table 1.
Step 4 Leakage Current (µA) Shall not exceed 0.1CV or 5 whichever is greater.
Temperature: 85±2°C
For rated voltage 4V or less, shall not exceed 0.2CV.
Capacitance
Within -0/+10% of the value in Step 1.
Dissipation Factor Shall not exceed the value in Table 1.
Step 5 Leakage Current (µA) Shall not exceed 0.125CV or 6.3 whichever is greater. Temperature: 125±2°C
For rated voltage 4V or less, shall not exceed 0.25CV. Voltage: 125°C voltage derating
Capacitance
Within -0/+15% of the value in Step 1.
Dissipation Factor Shall not exceed the value in Table 1.
Step 6 Leakage Current (µA) Shall not exceed the value in No 1.
Capacitance
Within
±2%
of the value in Step 1.
Dissipation Factor Shall not exceed the value in Table 1.
Temperature: 20±2°C
5
Surge
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Shall not exceed the value in No 1.
Within
±15%
of the value before the test.
Shall not exceed the value in Table 1.
There shall be no evidence of mechanical
damage.
No exfoliation between lead terminal and
board.
Temperature, Applied voltage: half of the samples each
•85±2°C, rated voltage×1.15
•125±2°C, 2/3×rated voltage×1.15
Series protective resistance: 1000Ω
Discharge resistance: 1000Ω
Samples are mounted with the following conditions.
•Indirect heating method (reflow)
•Temperature: 240±10°C/Time: 10seconds or less
Applied pressure: 5N
Duration: 10±1seconds
6
Shear (formerly adhesion) Test
7
8
Substrate Bending
Test
Vibration
Initial value to remain steady during measurement. Bend: 1mm
Capacitance
Visual Examination There shall be no evidence of mechanical damage.
Initial value to remain steady during
measurement.
Visual Examination There shall be no evidence of mechanical
damage.
Capacitance
Frequency range: 10-55Hz
Total swing width:1.5mm
Vibration direction: 3 directions with
mutually right-angled.
Duration: 2 hours in each of these mutually
perpendicular directions (total of 6 hours)
Mounting: Solder terminal to the printed board
9
Shock (specified pulse)
There shall be no intermittent contact of 0.5ms Peak acceleration: 490m/s
2
or greater, short, or open. Nor shall there be Duration: 11ms
any spark discharge, insulation breakdown, or Wave form: Half-sine
evidence of mechanical damage.
Solder shall stick well on the terminal. (No
pinhole, damp, and solder repel)
Solder temperature: 235±5°C
Dipping time: 2±0.5seconds
Dipping depth: Capacitor terminal shall be
dipped into melted solder
IR Reflow
Preheat: 130-160°C, approx. 60seconds
Reflow: 200°C, <60seconds max 260°C
Number of reflow: 2
Step 1: -55±3°C 30±3minutes
Step 2: 25 (-5/+10)
°C,
3minutes or less
Step 3: 125±2°C, 30±3minutes
Step 4: 25 (-5/+10)
°C,
3minutes or less
Number of cycle: 5
10
Solderability
11
Resistance to
Soldering Heat
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Shall not exceed the value in No 1
Within
±15%
of the value before the test.
Shall not exceed the value in Table 1.
There shall be no evidence of mechanical damage.
Shall not exceed 2 times value shown in No 1.
Within
±15%
of the value before the test.
Shall not exceed 150% of the value in Table 1.
There shall be no evidence of mechanical
damage.
12
Rapid Change of
Temperature
13
Damp heat,
Steady state
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
Shall not exceed 2 times value shown in No 1. Temperature: 40±2°C
Within
±15%
of the value before the test.
Moisture: 90-95%R.H.
Shall not exceed 150% of the value in Table 1. Duration: 500 (-0/+24) hours
There shall be no evidence of mechanical
damage. Marking shall be clear.
Shall not exceed 2 times value shown in No 1.
Within
±15%
of the value before the test.
Shall not exceed 150% of the value in Table 1.
There shall be no evidence of mechanical
damage. Marking shall be clear.
Temperature, applied voltage:
85±2°C, DC rated voltage or
125±3°C, 2/3×rated voltage
Duration: 2000 (-0/+72) hours
Series resistance: do not exceed 3Ω
14
Endurance
Leakage Current (µA)
Capacitance
Dissipation Factor
Visual Examination
ORDERING INFORMATION
251
TYPE
M
FAILURE
RATE
Marking
4001
6301
1002
6301
RATED
VOLTAGE
Capacitance
4.7µF
10µF
15µF
22µF
33µF
47µF
68µF
100µF
150µF
220µF
106
CAPACITANCE
M
CAPACITANCE
TOLERANCE
Code
φ180
Reel
R
R
STYLE OF
REELED PACKAGE
(Taping Specification)
Rated voltage
4VDC
6.3VDC
10VDC
Marking
475
106
156
226
336
476
686
107
157
227
Anode notation
Feed hole side: -
MARKING
[M Case (1608)]
Rated voltage (
1
)
[S Case (2012)]
Capacitance (
2
)
Rated voltage (
1
)
Polarity (anode notation)
[B Case (3528L)]
Manufacturing date code
Capacitance
(
3
)
Capacitance (
3
)
Manufacturing date code
Rated voltage
Polarity (anode notation)
Polarity (anode notation)
(1)
Rated voltage VDC
4
G
6.3
J
10
A
Rated voltage code
Polarity (anode notation)
[A Case (3216L)]
(2)
Rated capacitance
µF
Rated capacitance code
1
A
1.5 2.2 3.3 4.7 6.8
E
J
N
S
W
_
Mark of rated capacitance except above: _(1/10), (×10)
(e.g. J indicates 0.22 (J(2.2)×1/10))
(3)Refer “ORDERING INFORMATION”
RECOMMENDED PAD DIMENSIONS
Case
Size
Case
Code
1608
2012
3216L
3528L
a
0.50min
0.50min
0.80min
0.80min
b
0.65
0.8
1.1
2.1
c
0.65
1.05
1.65
1.95
(mm)
Mask thickness
100µm
100µm
100µm
100µm
b
M
S
A
c
a
B
In order to increase the self alignment effect for appropriate soldering, it is recommended that land be almost the same size as terminal of capacitor,
and space between lands (c) nearly equal to the space between terminals or slightly smaller.
