Commercial Chip - C0G
16Vdc to 10kVdc
A range of commercial MLC chip capacitors in Ultra stable EIA
Class I C0G, or NP0, dielectric. C0G chips are used in precision
circuitry requiring Class I stability and exhibit linear temperature
coefficient, low loss and stable electrical properties with time,
voltage and frequency.
Designed for surface mount application with nickel barrier
terminations making them suitable for solder wave and reflow
solder board attachment as well as vapor phase attachment for
part sizes 2225 or smaller. Silver-palladium terminations are also
available for hybrid use with conductive epoxy.
Standard EIA case sizes and available C/V values are listed
below - special sizes, thicknesses and other voltage ratings are
available; please contact the sales office for information.
Capacitance and voltage selection for popular chip sizes
Size
Min cap.
Tmax
inches:
mm:
0402 0504 0603 0805 1005 1206 1210 1515
0R3
0.024
0.61
1808
5R0
0.065
1.63
1812
100
0.065
1.63
1825
150
0.080
2.03
0R5
0.044
1.12
0R3
0.035
0.89
0R5
0.054
1.37
0R5
0.054
1.37
3R0
0.064
1.63
5R0
0.065
1.63
3R0
0.130
3.02
5R0
0.080*
2.03
100
0.100*
2.54
150
0.140*
3.56
16V
25V
50V
100V
200V
250V
300V
400V
500V
600V
800V
†
1kV
†
1.5kV
†
2kV
†
3kV
†
4kV
†
5kV
†
6kV
†
7kV
†
8kV
†
9kV
†
10kV
†
†
271
221
181
181
101
560
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
222
182
152
152
821
561
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
152
122
102
102
561
331
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
562
472
392
392
182
152
821
821
821
681
681
471
•
•
•
•
•
•
•
•
•
•
822
682
562
562
272
222
122
122
122
102
102
391
•
•
•
•
•
•
•
•
•
•
153
123
123
103
562
392
272
182
182
152
152
102
561
391
•
•
•
•
•
•
•
•
273
273
223
183
103
822
472
472
392
332
332
222
122
821
•
•
•
•
•
•
•
•
473
393
333
333
223
223
153
103
822
682
682
562
392
272
122
681
•
•
•
•
•
•
393
333
223
153
103
682
472
472
472
392
392
222
122
821
391
221
•
•
•
•
•
•
393
333
273
223
153
103
562
472
472
472
472
332
182
122
471
271
•
•
•
•
•
•
563
563
393
273
183
153
103
103
103
822
822
472
272
182
821
471
•
•
•
•
•
•
563
563
393
393
273
223
153
123
123
103
103
822
472
272
122
821
•
•
•
•
•
•
104
104
104
683
473
393
223
223
223
183
183
103
562
272
122
681
391
•
•
•
•
•
104
104
104
823
683
563
473
333
273
183
183
153
103
562
222
122
821
•
•
•
•
•
Units rated above 800V may require conformal coating to preclude arcing over chip surface
16
| Phone: +1.661.295.5920 | www.novacap.com
Commercial Chip - C0G
16Vdc to 10kVdc
l
l
l
l
l
For dielectric characteristics see page 4.
For dimensions see page 12.
For termination options see pages 3 & 15.
For capacitance tolerances available see page 15.
For ordering information see page 15.
Note:
Maximum capacitance values are shown below as 3 digit
code: 2 significant figures followed by the no. of zeros
e.g. 183 = 18,000pF. R denotes decimal e.g. 2R7 = 2.7pF.
Capacitance and voltage selection for popular chip sizes
2020
270
0.180
4.57
2221
270
0.080
2.03
2225
270
0.080
2.03
2520
390
0.180
4.57
3333
390
0.250
6.35
3530
390
0.250
6.35
4040
390
0.300
7.62
4540
390
0.300
7.62
5440
390
0.300
7.62
5550
390
0.300
7.62
6560
560
0.300
7.62
7565
101
0.300
7.62
Size
Min cap.
:inches
:mm
270
0.150*
3.81
Tmax
683
683
683
563
563
473
393
333
273
153
153
103
822
472
222
122
821
•
•
•
•
•
104
104
104
683
473
393
223
223
223
183
183
103
562
272
122
681
391
•
•
•
•
•
124
124
124
823
563
473
273
273
273
273
273
153
822
392
182
102
561
•
•
•
•
•
124
124
124
104
823
683
563
393
333
273
273
223
153
822
332
182
122
•
•
•
•
•
104
104
104
823
683
563
473
393
393
223
183
123
103
562
272
152
102
•
•
•
•
•
184
184
154
124
104
104
823
563
473
393
333
273
183
153
822
332
222
182
•
•
•
•
184
184
184
154
124
124
104
823
683
393
333
273
223
153
103
562
332
182
122
102
821
681
334
334
274
224
184
184
154
124
104
823
563
563
393
273
183
123
682
392
272
222
152
122
334
334
334
274
224
204
184
154
124
823
683
563
393
333
223
123
822
392
272
222
182
152
394
394
394
274
274
224
224
184
154
104
823
683
393
333
223
123
822
472
332
272
182
152
394
394
394
274
274
224
224
184
184
154
124
104
563
473
333
183
123
562
472
332
272
222
684
684
684
474
474
394
394
334
274
224
184
154
823
683
473
273
183
103
682
562
392
332
824
824
824
564
564
474
474
394
334
274
224
184
124
104
683
393
223
123
822
682
472
392
16V
25V
50V
100V
200V
250V
300V
400V
500V
600V
800V
†
1kV
†
1.5kV
†
2kV
†
3kV
†
4kV
†
5kV
†
6kV
†
7kV
†
8kV
†
9kV
†
10kV
†
* Denotes non standard chip thickness.
Order code needs to have an ’X’ inserted together with the dimension in inches e.g. X080 where dimension is 0.080”
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17
Chip Ordering Information
High Reliability
Testing
High Reliability
Test Criteria
- HB
Positive
Class
X5R VTC
II
E/G W
P
Termination
Capacitance
Capacitance
Tolerance
Packaging
T
M
Special
Thickness
Case Size
Dielectric
XX
1206
N
472
J
101
N
X050
H
Capacitance Code
1st two digits are
significant, third
digit denotes
number of zeros,
R = decimal
Examples:
1R0 = 1.0pF
120 = 12pF
471 = 470pF
102 = 1,000pF
273 = 0.027µF
474 = 0.47µF
105 = 1.0µF
Special Thickness
None Standard thickness
as per Novacap
catalog specifications
X
Denotes a special
thickness other than
standard. Specify in
inches if required.
(As shown above
X
= 0.050”)
Packaging
None
Bulk
T
W
Tape & Reel
Waffle Pack
Marking
None
Unmarked
Marked
*
Marking not
available on
sizes < 0603
High Reliability
Testing
None
Standard product
H
H
High Reliability Testing
High Temp Screening
Dielectric Codes
N
M
F
D
K
R
Y
Z
B
C
X
S
E
G
W
RN
RB
BB
BW
C0G/NP0
C0G/NP0
C0G/NP0
C0G/NP0
R3L
R2D
Y5V
Z5U
X7R
X7R
BX
X8R
Class II
Class II
X5R
Lead free X7R
X7R BME
X5R BME
Ultra Stable
Ultra Stable Magnetic Free
High Temp. (up to 160ºC)
High Temp. (up to 200ºC)
Ultra Stable
Pulse Energy
General Purpose
General Purpose
Stable
Stable Magnetic Free
MIL
High Temp. (up to 150ºC)
High Temp. (up to 200ºC)
High Temp. (up to 160ºC)
Stable
Stable
Stable
Stable
{
Hi-Reliability
Testing Criteria
HB
MIL-PRF-55681 Group A
HV
MIL-PRF-49467 Group A
HS
MIL-PRF-123 Group A
Termination Codes
Voltage Code
1st two digits are significant,
third digit denotes number of
zeros. For example:
160 =
101 =
501 =
102 =
502 =
103 =
16 Volts
100 Volts
500 Volts
1,000 Volts
5,000 Volts
10,000 Volts
P
PR
K
N
Y
NG
C
D
B
E
S
Palladium Silver
Palladium Silver*
Solderable Palladium Silver*
Nickel Barrier*
Nickel Barrier
Nickel Barrier Gold Flash*
FlexiCap™/Nickel Barrier*
FlexiCap™/Nickel Barrier
Copper Barrier*
Copper Barrier
Silver*
100% tin
90% tin, 10% lead
100% tin
90% tin, 10% lead
100% tin
90% tin, 10% lead
*
Indicates RoHS terminations
Lead free C0G/NP0 Ultra Stable
Capacitance Tolerance Codes
Code Tolerance
*
Not RF series
C0G/NP0
N
Cap. Value
< 10pF
Y5V
R3L
R2D Z5U
X7R
B
C
BX X8R
X
S
M
•
•
•
•
•
•
•
F/D
K
•
•
R
Y/Z
B
±0.10pF
±0.25pF
±0.50pF
±1%
±2%
±5%
±10%
±20%
+80% -20%
+100% -0%
•
•
•
•
•
•
•
•
•
•
Prefix Definitions
None
RF
LS
ES
ST
SM
CR
RC
Standard chip
Improved ESR Capacitor
Y
3
Certified Safety Capacitor
Y Certified Safety Capacitor
2
C
D
p. 23
p. 42 - 43
p. 42 - 43
p. 48 - 53
p. 48 - 53
p. 54
p. 58 - 61
F
G
J
K
M
Z
P
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•*
•
•
•*
•*
•
•
•
•*
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Stacked Capacitor Assembly
Stacked Hi-Rel Capacitor Assembly
Cap-Rack Capacitor Array
Bleed Resistor
www.novacap.com | Phone: +1.661.295.5920 |
15
Marking
M
Voltage
Prefix
Technical Summary
W
Technical Information
Novacap provides application notes throughout this catalog
as a guide to chip selection and attachment methods. Refer
to the Novacap Technical Brochure found at www.novacap.
com for more details. This technical information includes
the nature of capacitance, dielectric properties, electrical
properties, classes of dielectrics, ferroelectric behavior, test
standards, and high reliability test plans. Please do not
hesitate to contact the sales office for any product or technical
assistance.
Capacitor Size
Size availability is based primarily on capacitance values and
voltage rating. Smaller units are generally less expensive.
Because mass affects the thermal shock susceptibility of chip
capacitors, size selection should consider the soldering method
used to attach the chip to the board. Sizes 1812 and smaller
can be wave, vapor phase, or reflow soldered. Larger units
require reflow soldering.
Chip Selection
Multilayer capacitors (MLC) are categorized by dielectric
performance with temperature. The Temperature Coefficient
of Capacitance describes the variance of capacitance value
with temperature. The choice of components is therefore
largely determined by the temperature stability required of the
device and the size necessary for the desired capacitance value
and voltage rating.
Packaging
Units are available reeled, in waffle pack, or bulk packaged.
Bar coded labels are standard for reeled and bulk packaging.
Primary Dielectric Types
T
MB
C0G/NP0:
Ultra stable Class I dielectric, with negligible dependence of
capacitance on temperature, voltage, frequency, and time.
Used in circuitry requiring very stable performance.
X7R:
Stable Class II dielectric, with predictable change in properties
across a temperature range of -55°C to +125°C. Used as
blocking, decoupling, bypassing, and frequency discriminating
elements. This dielectric is ferroelectric and provides higher
capacitance than Class I materials.
BX:
The military specification for ceramic chip capacitors (MIL-
PRF-55681) defines a mid-K stable dielectric designated as BX.
The BX specification has voltage temperature limits in addition
to temperature limits of capacitance. The BX dielectric is
limited to ±15% maximum change in capacitance between
25°C and -55°C or +125°C and also has a voltage restriction
of +15% / -25% maximum change in capacitance between
25°C and -55°C or +125°C at rated voltage.
Z5U/Y5V:
General purpose Class III dielectrics with higher dielectric
constant and greater variation of properties over temperature
and voltage. Very high capacitance per volume is attainable
for general purpose applications where stability over a wide
temperature range is not critical.
FlexiCap™/Nickel Barrier
100% tin
FlexiCap™/Nickel Barrier
90/10% tin/lead
Dielectric
Termination
Combinations
Nickel Barrier
90/10% tin/lead
Palladium Silver
Palladium Silver
Solderable
Palladium Silver
Nickel Barrier
100% tin
Nickel Barrier
Gold flash
Termination Material
Copper Barrier
90/10% tin/lead
Solderable Silver
RoHS
S
•
•
•
We recommend the following
termination types:
Solder Attachment:
N
Nickel Barrier, 100% matte
tin plated - RoHS
C
FlexiCap™ with Nickel
Barrier, 100% tin plated - RoHS
Y
Nickel Barrier, tin-lead plated
D
FlexiCap™ Nickel Barrier,
tin-lead plated
B
Copper Barrier 100% matte
tin plated - RoHS
E
Copper Barrier, tin-lead
plated
K
Solderable Palladium Silver -
RoHS
(suitable for conductive epoxy attach)
S
Solderable Silver - RoHS
Palladium Silver
Dielectric
C0G/NP0
R3L
X7R
X7R BME
X5R BME
BX
Y5V
Z5U
C0G/NP0 (
Mag free
)
X7R (
Mag free
)
X8R
C0G/NP0 (160ºC)
C0G/NP0 (200ºC)
Class II (160ºC)
Class II (200ºC)
Pulse Power
R2D
Code
N/RN
K
B/RB
BB
BW
X
Y
Z
M
C
S
F
D
G
E
P
R
P
•
•
•
•
RoHS RoHS RoHS
PR
K
N
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Y
•
•
•
•
•
•
RoHS RoHS
NG
C
•
•
•
•
•
•
•
•
•
•
•
•
D
•
•
•
RoHS
B
Copper Barrier
100% tin
•
•
E
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Conductive Epoxy attachment:
P
PR
Palladium Silver - RoHS
NG
Nickel Barrier Gold Flash -
RoHS
(suitable for soldering attach)
www.novacap.com | Phone: +1.661.295.5920 |
3
Dielectric Characteristics
C0G/NP0 (N) Ultra Stable and RoHS 2013 (RN) type
Operating temperature range:
Temperature coefficient:
Dissipation factor:
Insulation resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
0 ±30 ppm/ºC
0.1% max @ 25ºC
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
1MHz for Capacitance <100pF
DC
ppm
TEMPERATURE COEFFICIENT
UPPER LIMIT
50
% CAPACITANCE CHANGE
25
0
TYPICAL
-25
LOWER LIMIT
-50
-55
-25
0
25
50
75
100
125
TEMPERATURE °C
C0G/NP0 (M) Ultra Stable Non Magnetic
Operating temperature range:
Temperature coefficient:
Dissipation factor:
Insulation resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
0 ±30 ppm/ºC
0.1% max @ 25ºC
>1000WF or >10000WF
whichever is less
>100WF or >1000WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
1MHz for Capacitance <100pF
DC
ppm
TEMPERATURE COEFFICIENT
UPPER LIMIT
50
% CAPACITANCE CHANGE
25
0
TYPICAL
-25
LOWER LIMIT
-50
-55
-25
0
25
50
75
100
125
TEMPERATURE °C
C0G/NP0 (F) Ultra Stable High Temperature (up to 160ºC)
Operating temperature range:
Temperature coefficient:
Dissipation factor:
Insulation resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
@25ºC:
@160ºC:
<200V:
201-500V:
>500V:
-55°C to 160°C
0 ±30 ppm/ºC
0.1% max @ 25ºC
>100GW or >1000WF
whichever is less
>1GW or >10WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
1MHz for Capacitance <100pF
DC
ppm
TEMPERATURE COEFFICIENT
40
% CAPACITANCE CHANGE
20
0
-20
-40
-55
-25
0
25
50
75
100
125
150
TEMPERATURE °C
C0G/NP0 (D) Ultra Stable High Temperature (up to 200ºC)
Operating temperature range:
Temp. coefficient <200ºC:
Dissipation factor @ 25ºC:
Insulation resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
@25ºC:
@200ºC:
<200V:
201-500V:
>500V:
-55°C to 200°C
0 ±30 ppm/ºC
0.1% Max.
>100GW or >1000WF
whichever is less
>1GW or >10WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
1MHz for capacitance <100pF
DC
ppm
TEMPERATURE COEFFICIENT
40
% CAPACITANCE CHANGE
20
0
-20
-40
-55
-25
0
25
50
75
100
125
150
175
200
TEMPERATURE °C
4
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