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25AA160D-E/MS

电可擦除可编程只读存储器 16K, 2K X 8 32B PAGE 1.8V SER EE EXT

器件类别:存储    存储   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
Reach Compliance Code
compliant
Factory Lead Time
29 weeks
数据保留时间-最小值
200
耐久性
1000000 Write/Erase Cycles
JESD-30 代码
R-PDSO-G8
JESD-609代码
e3
内存密度
16384 bit
内存集成电路类型
EEPROM
内存宽度
8
端子数量
8
字数
2048 words
字数代码
2000
最高工作温度
125 °C
最低工作温度
-40 °C
组织
2KX8
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP8,.19
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行
SERIAL
电源
2/5 V
认证状态
Not Qualified
串行总线类型
SPI
最大待机电流
0.000001 A
最大压摆率
0.005 mA
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
Matte Tin (Sn) - annealed
端子形式
GULL WING
端子节距
0.635 mm
端子位置
DUAL
写保护
HARDWARE/SOFTWARE
文档预览
25AA160C/D, 25LC160C/D
16K SPI Bus Serial EEPROM
Device Selection Table
Part Number
25LC160C
25AA160C
25LC160D
25AA160D
V
CC
Range
2.5-5.5V
1.8-5.5V
2.5-5.5V
1.8-5.5V
Page Size
16 Byte
16 Byte
32 Byte
32 Byte
Temp. Ranges
I,E
I
I,E
I, E
Packages
P, SN, ST, MS, MN
P, SN, ST, MS, MN
P, SN, ST, MS, MN
P, SN, ST, MS, MN
Features:
• Max. Clock 10 MHz
• Low-Power CMOS Technology:
- Max. write current: 5 mA at 5.5V
- Read current: 5 mA at 5.5V, 10 MHz
- Standby current: 5 uA at 5.5V
• 2048 x 8-bit Organization
• 16-Byte Page (‘C’ version devices)
• 32-Byte Page (‘D’ version devices)
• Self-Timed Erase and Write Cycles (5 ms max.)
• Block Write Protection:
- Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
• Sequential Read
• High Reliability:
- Endurance: > 1M erase/write cycles
- Data retention: > 200 years
- ESD protection: > 4000V
• Temperature Ranges Supported:
- Industrial (I):
-40C to +85C
- Automotive (E):
-40°C to +125°C
• Pb-Free and RoHS Compliant
Description:
The Microchip Technology Inc. 25AA160C/D,
25LC160C/D (25XX160C/D
*
) are 16 Kbit Serial
Electrically Erasable PROMs. The memory is accessed
via a simple Serial Peripheral Interface (SPI)
compatible serial bus. The bus signals required are a
clock input (SCK) plus separate data in (SI) and data
out (SO) lines. Access to the device is controlled
through a Chip Select (CS) input.
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused, transi-
tions on its inputs will be ignored, with the exception of
Chip Select, allowing the host to service higher priority
interrupts.
The 25XX160C/D is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead MSOP, TSSOP, and 2x3
TDFN. All packages are Pb-free and RoHS compliant.
Package Types (not to scale)
TSSOP/MSOP
(ST, MS)
CS
SO
WP
V
SS
1
2
3
4
8
7
6
5
V
CC
HOLD
SCK
SI
PDIP/SOIC
(P, SN)
CS
SO
WP
V
SS
1
2
3
4
8
7
6
5
V
CC
HOLD
SCK
SI
TDFN
(MN)
CS 1
SO 2
WP 3
8
7
6
5
V
CC
HOLD
SCK
V
SS
4
SI
*
25XX160C/D
is used in this document as a generic part
number for the 25AA160C/D, 25LC160C/D devices.
2009-2013 Microchip Technology Inc.
DS22150B-page 1
25XX160C/D
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
V
CC
.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. V
SS
.......................................................................................................... -0.6V to V
CC
+1.0V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias ...............................................................................................................-40°C to 125°C
ESD protection on all pins ..........................................................................................................................................4 kV
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
Automotive (E):
Min.
0.7 V
CC
-0.3
-0.3
V
CC
-0.5
T
A
= -40°C to +85°C
T
A
= -40°C to +125°C
Max.
V
CC
+1
0.3 V
CC
0.2 V
CC
0.4
0.2
±1
±1
7
Units
V
V
V
V
V
V
A
A
pF
V
CC
2.7V
V
CC
< 2.7V
I
OL
= 2.1 mA
I
OL
= 1.0 mA, V
CC
< 2.5V
I
OH
= -400
A
CS = V
CC
, V
IN
= V
SS OR
V
CC
CS = V
CC
, V
OUT
= V
SS OR
V
CC
T
A
= 25°C, CLK = 1.0 MHz,
V
CC
= 5.0V
(Note)
V
CC
= 5.5V; F
CLK
= 10.0 MHz;
SO = Open
V
CC
= 2.5V; F
CLK
= 5.0 MHz;
SO = Open
V
CC
= 5.5V
V
CC
= 2.5V
CS = V
CC
= 5.5V, Inputs tied to V
CC
or
V
SS
, +125°C
CS = V
CC
= 5.5V, Inputs tied to V
CC
or
V
SS
, +85°C
V
CC
= 1.8V to 5.5V
V
CC
= 1.8V to 5.5V
Test Conditions
DC CHARACTERISTICS
Param.
No.
D001
D002
D003
D004
D005
D006
D007
D008
D009
Sym.
V
IH1
V
IL1
V
IL2
V
OL1
V
OL2
V
OH
I
LI
I
LO
C
INT
Characteristic
High-level input
voltage
Low-level input
voltage
Low-level output
voltage
High-level output
voltage
Input leakage current
Output leakage
current
Internal Capacitance
(all inputs and
outputs)
D010
I
CC
Read
Operating Current
Standby Current
5
2.5
5
3
5
1
mA
mA
mA
mA
A
A
D011
D012
I
CC
Write
I
CCS
Note:
This parameter is periodically sampled and not 100% tested.
DS22150B-page 2
2009-2013 Microchip Technology Inc.
25XX160C/D
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
50
100
150
100
200
250
50
10
20
30
20
40
50
50
100
150
50
100
150
50
50
0
20
40
80
Max.
10
5
3
2
2
50
100
160
40
80
160
Units
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
CC
= 1.8V to 5.5V
V
CC
= 1.8V to 5.5V
Test Conditions
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
(Note
1)
(Note
1)
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
(Note
1)
4.5V
V
CC
5.5V
(Note
1)
2.5V
V
CC
4.5V
(Note
1)
1.8V
V
CC
2.5V
(Note
1)
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
AC CHARACTERISTICS
Param.
Sym.
No.
1
F
CLK
Characteristic
Clock Frequency
2
T
CSS
CS Setup Time
3
T
CSH
CS Hold Time
4
5
T
CSD
Tsu
CS Disable Time
Data Setup Time
6
T
HD
Data Hold Time
7
8
9
T
R
T
F
T
HI
CLK Rise Time
CLK Fall Time
Clock High Time
10
T
LO
Clock Low Time
11
12
13
T
CLD
T
CLE
T
V
Clock Delay Time
Clock Enable Time
Output Valid from Clock
Low
Output Hold Time
Output Disable Time
14
15
T
HO
T
DIS
16
T
HS
HOLD Setup Time
Note 1:
This parameter is periodically sampled and not 100% tested.
2:
T
WC
begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle
is complete.
3:
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from our web site:
www.microchip.com.
2009-2013 Microchip Technology Inc.
DS22150B-page 3
25XX160C/D
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
20
40
80
30
60
160
30
60
160
1M
Max.
5
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
V
CC
= 1.8V to 5.5V
V
CC
= 1.8V to 5.5V
Test Conditions
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
4.5V
V
CC
5.5V
(Note
1)
2.5V
V
CC
4.5V
(Note
1)
1.8V
V
CC
2.5V
(Note
1)
4.5V
V
CC
5.5V
2.5V
V
CC
4.5V
1.8V
V
CC
2.5V
(Note
2)
AC CHARACTERISTICS
Param.
Sym.
No.
17
T
HH
Characteristic
HOLD Hold Time
18
T
HZ
HOLD Low to Output
High-Z
HOLD High to Output
Valid
Internal Write Cycle Time
Endurance
19
T
HV
20
21
T
WC
E/W 25°C, V
CC
= 5.5V
(Note
3)
Cycles
Note 1:
This parameter is periodically sampled and not 100% tested.
2:
T
WC
begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle
is complete.
3:
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from our web site:
www.microchip.com.
TABLE 1-3:
AC Waveform:
V
LO
= 0.2V
AC TEST CONDITIONS
(Note 1)
(Note 2)
0.5 V
CC
0.5 V
CC
V
HI
= V
CC
- 0.2V
V
HI
= 4.0V
C
L
= 50 pF
Timing Measurement Reference Level
Input
Output
Note 1:
For V
CC
4.0V
2:
For V
CC
> 4.0V
DS22150B-page 4
2009-2013 Microchip Technology Inc.
25XX160C/D
FIGURE 1-1:
CS
16
SCK
18
SO
n+2
n+1
n
High-Impedance
19
n
5
n
n-1
n-1
17
16
17
HOLD TIMING
Don’t Care
SI
HOLD
n+2
n+1
n
FIGURE 1-2:
SERIAL INPUT TIMING
4
CS
2
Mode
1,1
SCK Mode
0,0
5
SI
6
LSB in
7
8
3
12
11
MSB in
SO
High-Impedance
FIGURE 1-3:
SERIAL OUTPUT TIMING
CS
9
SCK
13
SO
MSB out
Don’t Care
14
15
ISB out
10
3
Mode
1,1
Mode
0,0
SI
2009-2013 Microchip Technology Inc.
DS22150B-page 5
查看更多>
参数对比
与25AA160D-E/MS相近的元器件有:25AA160D-E/ST。描述及对比如下:
型号 25AA160D-E/MS 25AA160D-E/ST
描述 电可擦除可编程只读存储器 16K, 2K X 8 32B PAGE 1.8V SER EE EXT 电可擦除可编程只读存储器 16K, 2K X 8 32B PAGE 1.8V SER EE EXT
是否Rohs认证 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技)
Reach Compliance Code compliant compliant
Factory Lead Time 29 weeks 6 weeks
数据保留时间-最小值 200 200
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e3 e3
内存密度 16384 bit 16384 bit
内存集成电路类型 EEPROM EEPROM
内存宽度 8 8
端子数量 8 8
字数 2048 words 2048 words
字数代码 2000 2000
最高工作温度 125 °C 125 °C
最低工作温度 -40 °C -40 °C
组织 2KX8 2KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP
封装等效代码 TSSOP8,.19 TSSOP8,.25
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 SERIAL SERIAL
电源 2/5 V 2/5 V
认证状态 Not Qualified Not Qualified
串行总线类型 SPI SPI
最大待机电流 0.000001 A 0.000001 A
最大压摆率 0.005 mA 0.005 mA
表面贴装 YES YES
技术 CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 GULL WING GULL WING
端子节距 0.635 mm 0.635 mm
端子位置 DUAL DUAL
写保护 HARDWARE/SOFTWARE HARDWARE/SOFTWARE
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