Data Sheet
June 2001
269-Type 14xx nm DFB Pump Laser Module
Description
The 269-type DFB pump laser module represents a
family of thermoelectrically cooled, high-power
lasers. These devices achieve stable wavelength
performance within the 1420 nm to 1510 nm range,
over the full operating temperature range. They are
designed as continuous-wave (CW) optical pump
sources for dense wavelength-division multiplexing
(DWDM) EDFA and Raman applications operating in
the C- and L-bands.
The 269-type DFB pump laser module is designed as a
continuous-wave (CW) optical pump source for erbium-doped
fiber amplifiers.
Features
s
s
Low relative intensity noise (RIN)
High-coupled rated output power up to 280 mW,
CW
Wide environmental range
Field-proven packaging technology
InGaAsP/InP high-power, strained multiple quan-
tum-well (MQW), distributed-feedback (DFB) laser
chip design
Internal optical isolator (optional)
Internal thermoelectric cooler (TEC)
InGaAs PIN photodetector back-facet monitor
Single-mode and polarization-maintaining fiber pig-
tails
Compact, 14-pin butterfly package
Industry compatible package and pinout
s
s
s
These new high-power DFB products represent a
breakthrough in 14xx nm pump laser technology by
integrating the beneficial characteristics of an exter-
nal FBG laser design (such as stimulated Brillouin
scattering suppression) with the superior relative-
intensity noise (RIN) performance of a DFB laser.
The combination of both characteristics is critical to
enable copropagating Raman pumping, which dis-
tributes gain over the first few kilometers of the trans-
mission fiber. The typical RIN value Agere Systems’
DFB lasers is –158 dB/Hz, a major improvement over
comparable external FBG-stabilized lasers with a
typical RIN of –125 dB/Hz. Integrating wavelength
stabilization into the chip improves the stabilization
over operating temperature and thereby eliminates
the need for an external FBG .
The laser modules incorporate a high-power, quan-
tum-well laser chip that achieves fiber powers up to
280 mW.
An integral thermoelectric cooler (TEC) stabilizes the
laser at room temperature and, combined with a her-
metic environment, allows the device to achieve
high-power operation over the extended temperature
range of 0 °C to 75 °C. An internal InGaAs PIN pho-
todiode, mounted behind the laser diode, functions
as the laser detector and monitors light emissions
from the rear facet of the laser.
The 269-type DFB module is offered in a 14-pin, her-
metic butterfly package.
s
s
s
s
s
s
Applications
s
Raman pump modules (RPM), copropagating and
counterpropagating
Erbium-doped fiber amplifiers (EDFA)
s
269-Type 14xx nm DFB Pump Laser Module
Data Sheet
June 2001
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Operating Case Temperature Range
Storage Case Temperature Range
Laser Forward Bias (TEC on):
P
O
= 120 mW—150 mW
P
O
= 160 mW—210 mW
P
O
= 220 mW—280 mW
Laser Reverse Voltage
Photodiode Reverse Voltage
TEC Current
TEC Voltage
Temperature Sensor Current
Laser Diode Operating Chip Temperature
Symbol
T
C
T
stg
I
F
Min
0
–40
—
—
—
—
—
—
—
—
—
Max
75
85
1000
1500
1900
2
20
2.2
5.0
5
40
Unit
°C
°C
mA
mA
mA
V
V
A
V
mA
°C
V
R
V
RMON
I
TEC
V
TEC
I
TS
T
LD
Handling Precautions
Electrostatic Discharge
CAUTION: This device is susceptible to damage as a result of electrostatic discharge (ESD). Take proper
precautions during both handling and testing. Follow guidelines such as
EIA
*
Standard
EIA
625.
Agere Systems Inc. employs a human-body model (HBM) for ESD-susceptibility testing and protection-design eval-
uation. ESD voltage thresholds are dependent on the critical parameters used to define the model. A standard
HBM (resistance = 1.5 kΩ, capacitance = 100 pF) is widely used and, therefore, can be used for comparison pur-
poses. The HBM ESD withstand voltage established for the 269-type laser pump module is ±500 V.
*
EIA
is a registered trademark of The Electronic Industries Association.
2
Agere Systems Inc.
Data Sheet
June 2001
269-Type 14xx nm DFB Pump Laser Module
Electrical/Optical Characteristics
Table 1. Electrical/Optical Characteristics
(All performance parameters are specified for I
F, OP
T
SET
= 25 °C,
,
T
CASE
~ 25 °C, unless otherwise specified.)
Parameter
Operating Optical Power
Wavelength:
Target Wavelength
Center Wavelength
RMS Spectral Width:
Single Mode
Multimode
BOL Operating Laser Forward Current:
P
O
= 120 mW
P
O
= 130 mW
P
O
= 140 mW
P
O
= 150 mW
BOL Operating Laser Forward Current:
P
O
= 160 mW
P
O
= 170 mW
P
O
= 180 mW
P
O
= 190 mW
P
O
= 200 mW
BOL Operating Laser Forward Current:
P
O
= 210 mW
P
O
= 220 mW
P
O
= 230 mW
P
O
= 240 mW
P
O
= 250 mW
P
O
= 260 mW
P
O
= 270 mW
P
O
= 280 mW
EOL Operating Laser Forward Current
EOL Laser Diode Forward Voltage
Module Optical Isolation
(optional feature)
Polarization Extinction Ratio
Relative Intensity Noise
Symbol
P
O
λt
λ
C
∆λ
Conditions
—
—
0 °C—70 °C
P
O
Min
120
1420
λt
– 1.0
—
—
I
F, OP BOL
—
—
—
—
I
F, OP BOL
—
—
—
—
—
I
F, OP BOL
—
—
—
—
—
—
—
—
—
I
F, OP
EOL
EOL Over
T
CASE RANGE
—
P
O
—
—
—
—
—
—
—
—
—
—
30
13
—
—
—
—
—
—
—
—
—
—
2.3
—
—
–158
850
900
950
1000
1000
1100
1100
1100
1.15 x
I
F, OP BOL
3.0
—
—
–150
mA
mA
mA
mA
mA
mA
mA
mA
mA
V
dB
dB
dB/Hz
—
—
—
—
—
—
—
—
—
—
650
700
700
750
800
mA
mA
mA
mA
mA
—
—
—
—
—
—
—
—
550
600
600
600
mA
mA
mA
mA
Typ
—
—
—
1.0
0.2
Max
280
1510
λt
+ 1.0
5.0
0.3
Unit
mW
nm
nm
MHz
nm
I
F, OP EOL
V
R
ISO
PER
RIN
Table 2. Monitor Photodiode Characteristics
(All test parameters are specified for I
F, OP,
T
SET
= 25 °C,
T
CASE
~ 25 °C unless otherwise specified.)
Parameter
Monitor Diode Current
Monitor Diode Dark Current
Symbol
I
BF
I
D
Conditions
—
V
R
= –5 V, I
F
= 0
Min
200
—
Max
2000
100
Unit
µA
nA
Agere Systems Inc.
3
269-Type 14xx nm DFB Pump Laser Module
Data Sheet
June 2001
Electrical/Optical Characteristics
(continued)
Table 3. TEC and Thermistor Characteristics
(All performance parameters are specified for I
F, OP,
T
SET
= 25 °C,
unless otherwise specified.)
Parameter
TEC Current:
P
O
= 120 mW
P
O
= 130 mW
P
O
= 140 mW
P
O
= 150 mW
TEC Current:
P
O
= 160 mW
P
O
= 170 mW
P
O
= 180 mW
P
O
= 190 mW
P
O
= 200 mW
TEC Current:
P
O
= 210 mW
P
O
= 220 mW
P
O
= 230 mW
P
O
= 240 mW
P
O
= 250 mW
P
O
= 260 mW
P
O
= 270 mW
P
O
= 280 mW
TEC Voltage:
P
O
= 120 mW
P
O
= 130 mW
P
O
= 140 mW
P
O
= 150 mW
TEC Voltage:
P
O
= 160 mW
P
O
= 170 mW
P
O
= 180 mW
P
O
= 190 mW
P
O
= 200 mW
TEC Voltage:
P
O
= 210 mW
P
O
= 220 mW
P
O
= 230 mW
P
O
= 240 mW
P
O
= 250 mW
P
O
= 260 mW
P
O
= 270 mW
P
O
= 280 mW
Thermistor Resistance
Themistor B Constant
Symbol
I
TEC
Conditions
T
SET
= 25 °C;
T
CASE
= 75 °C;
∆T
= 50 °C, EOL
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
9.5
3700
Max
1.6
1.6
1.6
1.6
1.7
1.7
1.7
1.7
1.7
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
3.5
3.5
3.5
3.5
3.7
3.7
3.7
3.7
3.7
4.2
4.2
4.2
4.2
4.2
4.2
4.2
4.2
10.5
4100
Unit
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
kΩ
K
I
TEC
T
SET
= 25 °C;
T
CASE
= 70 °C;
∆T
= 45 °C, EOL
I
TEC
T
SET
= 25 °C;
T
CASE
= 65 °C;
∆T
= 40 °C, EOL
V
TEC
T
SET
= 25 °C;
T
CASE
= 75 °C;
∆T
= 50 °C, EOL
V
TEC
T
SET
= 25 °C;
T
CASE
= 70 °C;
∆T
= 45 °C, EOL
V
TEC
T
SET
= 25 °C;
T
CASE
= 65 °C;
∆T
= 40 °C, EOL
R
THERM
B
25 °C Laser Diode
Set Temperature
—
4
Agere Systems Inc.
Data Sheet
June 2001
269-Type 14xx nm DFB Pump Laser Module
Mounting and Connections
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge.
Proper precautions should be taken
during both handling and testing.
The base of the laser module (see Outline Diagram)
should be maintained at or below 75 °C (maximum)
during operation. Interfaces between the laser module
base and heat sink must be clean, and the use of a
thermal filler may be necessary.
User Information
Table 4. Pin Information
Pin
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Connection
TE Cooler (+)*
Thermistor
Monitor Anode (–Bias)
Monitor Cathode (+Bias)
Thermistor
No Connect
No Connect
No Connect
No Connect
Laser Anode (+)
Laser Cathode (–)
No Connect
Package Ground
TEC Cooler (–)
Mounting Instructions
The minimum fiber bend radius is 1.0 in.
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm)
in size. The surface finish of the heat sink should be
better than 32
µin.
(0.8
µm),
and the surface flat-
ness must be better than 0.001 in. (25.4
µm).
Using
thermal conductive grease is optional; however,
thermal performance may be improved if conductive
grease is applied between the bottom flange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw hole locations (see
Outline Diagram). The Fillister head diameter must
not exceed 0.140 in. (3.55 mm). Do not apply more
than 1 in./lb. of torque to the screws.
* A positive input into this pin cools the laser.
Fiber Characteristics
s
Length of fiber pigtail:
— 1.75 m ± 0.25 m
Standard fiber:
— Cladding OD: 125
µm
± 2
µm
— Acrylate buffer OD: 250
µm
± 15
µm
— Cut off wavelength: <1320 nm
Polarization-maintaining fiber:
— PANDA
— Cut off wavelength: <1400 nm
— Acrylate buffer: 400
µm
s
s
7
6
5
4
3
2
1
+
–
TEC
TH 10 kΩ
ISOLATOR
(OPTIONAL)
+
8
9
10
–
11
12
13
14
1-675 (F).i
Figure 1. Circuit Schematic
Agere Systems Inc.
5
模拟与混合信号
