The Model 2DEA Series is well-suited for space constrained
designs where the requirements of international ESD standard
specification IEC 61000-4-2 must be met.
These highly integrated PN junction diode arrays are espe-
cially effective for use in PC notebooks and motherboards,
engineering workstations and portable battery-powered
devices such as PDAs and cellular phones.
Space savings, as compared to popular BA V99 SOT23
based implementations, can yield a 75 % reduction in
utilized board area. In addition, significant assembly cost
reductions and manufacturing integrity improvements can
be realized.
Two package options are available. Model 2DEA consists of
20 bi-directional diode pairs in a miniature 24-pin JEDEC
QSOP package. The 2DEB consists of 17 bi-directional
diode pairs in a traditional wide-body SOIC JEDEC package.
Electrical & Environmental Characteristics
Electrical Characteristics
Supply Voltage
Voltage @ any Channel
Channel Clamp Current (continuous)
Forward Voltage:
@If = 1 mA
@If = 12 mA
Leakage Current @ VSS<Vin<VDD = 12 V
Diode Capacitance
Environmental Characteristics
Operating Temperature
Storage Temperature
Diode Power Rating
ESD Performance Withstand*:
Contact Discharge
Air Discharge
TJ
Tstg
-55
-65
20
±8
±15
±9
±16
+125
+150
°C
°C
mW/diode
kV
kV
* Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence
the results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that
level. The Model 2DEA/DEB device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
6
003
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
Package Schematic
VDD
24 23
22
21 20
VSS
19 18 17 16 15 14 13
1
2
3
4
5
6 7
VSS
8
9
10 11
12
VDD
Symbol
VDD - VSS
Vin
IC
Vf
Minimum
-0.3
-0.3
Nominal
Maximum
12
VDD + 0.5
±15
Unit
V
V
mA
V
V
µA
pF
0.8
0.1
0.9
1.5
10
5
Applications
■
■
■
Parallel printer ports, communication ports
Hot-swappable designs
IC protection
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
Mechanical Characteristics
QSOP Package Dimensions
A
.635
TYP.
(.025)
3.81 - 3.99
(.150 - .157)
Wide-Body SOIC Package Dimensions
12.66 - 12.86
(.496 - .505)
1.27
TYP.
(0.50)
0.66
(.026)
REF
7.40 - 7.60
(.291 - .299)
PIN 1
0.38 - 0.48
(.014 - .016)
2.44 - 2.64
(.096 - .104)
PIN 1
.21 - .31
(.008 - .012)
1.35 - 1.75
(.053 - .069)
0.10 - 0.30
(.004 - .012)
.10 - .25
(.004 - .010)
0.23 - 0.32
(.0091 - .0125)
0-8
°
.19 - .25
(.007 - .010)
0-8°
10.11 - 10.51
(.398 - .414)
5.80 - 6.20
(.228 - .244)
.41 - 1.27
(.016 - .050)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-013.
Model
2QSP24
A
8.56 - 8.74 (.337 - .344)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
QSOP Package Power Temperature Derating Curve
1.25
WATTS
1.0
.75
.50
.25
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (
°
C )
2QSP24
Wide-Body SOIC Package Power Temperature Derating Curve
1.25
WATTS
1.0
.75
.50
.25
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (
°
C )
WBSOIC20
Standard Part Numbers
Part Number
(Tape & Reel)
2DEA-2-Q24R
2DEB-2-W20R
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Part Number
(Tubes)
2DEA-2-Q24T
2DEB-2-W20T
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
Dispensing
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).
A0
DIMENSIONS = MM (INCHES)
B0
K0
Package
QSOP
24 Pin
WBSOIC
20 Pin
How To Order
A0
6.5 (0.256)
13 (0.519)
B0
9.0 (0.354)
10.8 (0.425)
K0
2.1 (0.083)
2.8 (0.110)
Width
16 (0.630)
24 (0.945)
Pitch
8 (0.315)
8 (0.315)
No. of Pieces No. of Pieces
per 13 ” reel
per tube
3,500
3,500
56
37
2 DEA - 2 - Q 24 R __
Product Class
Thin-Film-on-Silicon
Product Function
ESD Protection Diode Array
DEA = 20 Lines
DEB = 17 Lines
Standard
Standard Package Style
Q=
QSOP
W = Wide-Body SOIC
Pin Count
Q = 24
W = 20
Dispensing
R = Reel
T = Tube
Terminations
LF = 100 % Sn (lead free)
Blank = Sn/Pb
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Typical Part Marking
Represents total content. Layout may vary.
PRODUCT
FUNCTION
PIN COUNT
PIN 1 INDICATOR
(MOLDED INDENT)
MANUFACTURER'S
TRADEMARK
DEA002
24Q
YYWW
PACKAGE STYLE
DATE CODE
04/05
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
单片机
