PL
IA
Features
■
■
■
■
■
Lead free
RoHS compliant*
Multiple resistors tied to a common node
Stable thin-film-on-silicon technology
Ultra-miniature packages to JEDEC
standards
*R
oH
S
CO
M
Models 2QSP-XX2 and 2NBS-XX2
are obsolete and not recommended
for new designs.
NT
Applications
■
■
■
Bus termination
Pull-up/pull-down
Ideal for space-constrained applications
Thin Film on Silicon 2QSP / 2NBS-XX2 Bussed Resistors
General Information
Package Schematic
Bussed Resistor networks are typically used in DC pull-up
and pull-down applications where system data or control lines
must be tied to a fixed potential. Fabricated with a Tantalum
Nitride and Nickel Chromium on Silicon process, these
resistors feature excellent stability, TCR and tracking
performance. Bussed Resistor Networks are available in a
range of miniature package types conforming to JEDEC
standards.
16
15
14
13
12
11
10
9
Electrical & Environmental Characteristics
Electrical Characteristics
Resistance Range
Tolerance:
Absolute
Ratio
TCR:
Absolute
Tracking
Operating Voltage
ESD
Environmental Characteristics
Operating Temperature
Storage Temperature
Power Rating per Resistor @ 70 °C
E
T
E
L
O
S
B
O
1
2
3
4
Symbol
R
5
6
7
8
Minimum
100
Nominal
Maximum
100 K
±5 %
±2 %
150
25
50
Unit
Ω
Ω
Ω
ppm/°C
ppm/°C
V
V
°C
°C
Watt
Watt
Watt
Watt
Watt
Watt
±0.5 %
±0.1 %
100
2K
-55
-65
TJ
Tstg
+125
+150
0.1
0.75
1.00
1.12
0.60
1.00
Power Rating per Package @ 70 °C:
QSOP:
16 Pin
20, 24 Pin
28 Pin
NBSOIC: 8 Pin
14, 16 Pin
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Mechanical Characteristics
QSOP Package Dimensions
A
.635
TYP.
(.025)
3.81 - 3.99
(.150 - .157)
Narrow-Body SOIC Package Dimensions
A
1.27
TYP.
(.050)
3.81 - 3.99
(.150 - .157)
PIN 1
1.35 - 1.75
(.053 - .069)
.10 - .25
(.004 - .010)
0-8
°
5.80 - 6.20
(.228 - .244)
E
T
E
L
O
S
B
O
.21 - .31
(.008 - .012)
PIN 1
0.36 - 0.46
(.014 - .018)
1.35 - 1.75
(.053 - .069)
.10 - .25
(.004 - .010)
0-8
°
.19 - .25
(.007 - .010)
.19 - .25
(.007 - .010)
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
.41 - 1.27
(.016 - .050)
Model
2QSP16
2QSP20
2QSP24
2QSP28
4.80
8.56
8.56
9.80
-
-
-
-
A
4.98 (.189
8.74 (.337
8.74 (.337
9.98 (.386
-
-
-
-
.196)
.344)
.344)
.393)
Model
2NBS08
2NBS14
2NBS16
A
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
QSOP Package Power Temperature Derating Curve
Narrow-Body SOIC Package Power Temperature Derating Curve
1.25
WATTS
1.0
.75
.50
.25
0
2QSP28
2QSP20, 2QSP24
2QSP16
1.0
WATTS
.8
.6
.4
.2
2NBS14, 2NBS16
2NBS08
25
125
150
AMBIENT TEMPERATURE (
°
C )
50
75
100
0
25
50
75
100
125
150
°
C )
AMBIENT TEMPERATURE (
Schematic
R2
R4
R6
R8
R10
R12
R14
R1
R3
R5
R7
R9
R11
R13
R15
8 PIN
14 PIN
16 PIN
20 PIN
24 PIN
28 PIN
Typical Part Marking
E
T
E
L
O
S
B
O
Standard Resistance Values
Resistance
(ohms)
100
120
220
270
330
390
470
510
680
R16
R18
R20
R22
R24
R26
R17
R19
R21
R23
R25
R27
Resistance
Code
101
121
221
271
331
391
471
511
681
102
152
202
222
272
332
472
512
103
203
273
473
513
753
823
104
1K
1.5 K
2K
2.2 K
2.7 K
3.3 K
4.7 K
5.1 K
10 K
20 K
27 K
47 K
Represents total content. Layout may vary.
PIN COUNT
MODEL
CIRCUIT
PIN 1 INDICATOR
(MOLDED INDENT)
MANUFACTURER'S
TRADEMARK
QSP16J
2-103
YYWW
GRADE
RESISTANCE
CODE
DATE CODE
51
75
82
100
K
K
K
K
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Dispensing
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).
A0
DIMENSIONS = MM (INCHES)
Package
QSOP
16 Pin
20, 24 Pin
28 Pin
NBSOIC
8 Pin
14 Pin
16 Pin
6.4 (0.252)
6.5 (0.256)
6.5 (0.256)
6.4 (0.252)
6.5 (0.256)
6.5 (0.256)
How To Order
Product Class
Thin-Film-on-Silicon
Standard Package Style
QSP = QSOP
NBS = Narrow-Body SOIC
Pin Count
QSP = 16, 20, 24, 28
NBS = 8, 14, 16
Dispensing
R = Reel
T = Tube
Standard Grade
Tolerance
J=
±5 %
G=
±2 %
F=
±1 %
Circuit
2 = Bussed
E
T
E
L
O
S
B
O
B0
K0
A0
B0
K0
Width
Pitch
No. of Pieces No. of Pieces
per 13 reel
per tube
3,500
3,500
3,500
3,500
3,500
3,500
98
56
49
98
56
49
5.2 (0.205)
9.0 (0.354)
10.3 (0.406)
9.0 (0.354)
9.0 (0.354)
9.0 (0.354)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
12 (0.472)
16 (0.630)
16 (0.630)
12 (0.472)
16 (0.630)
16 (0.630)
8 (0.315)
8 (0.315)
8 (0.315)
8 (0.315)
8 (0.315)
8 (0.315)
2 QSP 20 - T J 2 - 472 LF
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Resistance Value Code
1st two digits are significant,
3rd digit = number of zeros to follow to give resistance value in ohms.
Terminations
LF = 100 % Sn (lead free)
04/10
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
