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2SK2391FT

MOSFET MOSFET N-Ch 100V 20A Rdson 0.085 Ohm

器件类别:半导体    分立半导体   

厂商名称:Toshiba(东芝)

厂商官网:http://toshiba-semicon-storage.com/

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
Toshiba(东芝)
产品种类
Product Category
MOSFET
RoHS
Details
技术
Technology
Si
安装风格
Mounting Style
Through Hole
封装 / 箱体
Package / Case
TO-220FP-3
Number of Channels
1 Channel
Transistor Polarity
N-Channel
Vds - Drain-Source Breakdown Voltage
100 V
Id - Continuous Drain Current
20 A
Rds On - Drain-Source Resistance
85 mOhms
Vgs - Gate-Source Voltage
20 V
最小工作温度
Minimum Operating Temperature
- 55 C
最大工作温度
Maximum Operating Temperature
+ 150 C
Configuration
Single
Channel Mode
Enhancement
高度
Height
15 mm
长度
Length
10 mm
Transistor Type
1 N-Channel
宽度
Width
4.5 mm
Fall Time
50 ns
Pd-功率耗散
Pd - Power Dissipation
35 W
Rise Time
20 ns
工厂包装数量
Factory Pack Quantity
50
单位重量
Unit Weight
0.211644 oz
文档预览
2SK2391
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (L
−π−MOSV)
2
2SK2391
Chopper Regulator, DC−DC Converter and Motor Drive
Applications
4-V gate drive
Low drain−source ON-resistance
High forward transfer admittance
Low leakage current
Enhancement mode
: R
DS (ON)
= 66 mΩ (typ.)
: |Y
fs
| = 16 S (typ.)
Unit: mm
: I
DSS
= 100
μA
(max) (V
DS
= 100 V)
: V
th
= 0.8 to 2.0 V (V
DS
= 10 V, I
D
= 1 mA)
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics
Drain−source voltage
Drain−gate voltage (R
GS
= 20 kΩ)
Gate−source voltage
Drain current
DC
(Note 1)
Symbol
V
DSS
V
DGR
V
GSS
I
D
I
DP
P
D
E
AS
I
AR
E
AR
T
ch
T
stg
Rating
100
100
±20
20
80
35
208
20
3.5
150
−55
to 150
Unit
V
V
V
A
A
W
mJ
A
mJ
°C
°C
Pulse (Note 1)
Drain power dissipation (Tc = 25°C)
Single pulse avalanche energy
(Note 2)
Avalanche current
Repetitive avalanche energy (Note 3)
Channel temperature
Storage temperature range
JEDEC
JEITA
TOSHIBA
SC-67
2-10R1B
Weight: 1.9 g (typ.)
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and
Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Thermal resistance, channel to case
Thermal resistance, channel to
ambient
Symbol
R
th (ch−c)
R
th (ch−a)
Max
3.57
62.5
Unit
°C / W
°C / W
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2: V
DD
= 25 V, T
ch
= 25°C (initial), L = 840
μH,
R
G
= 25
Ω,
I
AR
= 20 A
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device.
Please handle with caution.
1
2010-01-31
2SK2391
Electrical Characteristics
(Ta = 25°C)
Characteristics
Gate leakage current
Drain cut−off current
Drain−source breakdown voltage
Gate threshold voltage
Drain−source ON-resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Symbol
I
GSS
I
DSS
V
(BR) DSS
V
th
R
DS (ON)
|Y
fs
|
C
iss
C
rss
C
oss
t
r
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
Test Condition
V
GS
= ±16 V, V
DS
= 0 V
V
DS
= 100 V, V
GS
= 0 V
I
D
= 10 mA, V
GS
= 0 V
V
DS
= 10 V, I
D
= 1 mA
V
GS
= 4 V, I
D
= 10 A
V
GS
= 10 V, I
D
= 10 A
V
DS
= 10 V, I
D
= 10 A
Min
100
0.8
8
Typ.
0.09
0.068
16
1100
180
400
20
Max
±10
100
2.0
0.13
0.085
pF
Unit
μA
μA
V
V
S
Turn−on time
Switching time
Fall time
t
on
30
ns
t
f
50
Turn−off time
Total gate charge (Gate−source
plus gate−drain)
Gate−source charge
Gate−drain (“miller”) charge
t
off
Q
g
Q
gs
Q
gd
V
DD
80 V, V
GS
= 10 V, I
D
= 27 A
140
50
34
16
nC
Source−Drain Ratings and Characteristics
(Ta = 25°C)
Characteristics
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
Symbol
I
DR
I
DRP
V
DSF
t
rr
Q
rr
Test Condition
I
DR
= 20 A, V
GS
= 0 V
I
DR
= 20 A, V
GS
= 0 V, dI
DR
/ dt = 50 A /
μs
Min
Typ.
155
0.31
Max
20
80
−1.7
Unit
A
A
V
ns
μC
Marking
Note 4: A line under a Lot No. identifies the indication of product
Labels.
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
K2391
Part No. (or abbreviation code)
Lot No.
Note 4
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament
and of the Council of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
2
2010-01-31
2SK2391
3
2010-01-31
2SK2391
4
2010-01-31
2SK2391
R
G
= 25
V
DD
= 25 V, L = 840
μH
EAS
=
1
B VDSS
L
I
2
⋅ ⎜
2
B VDSS
VDD
5
2010-01-31
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