首页 > 器件类别 > 连接器 > 插座

3-HCIS175-01GG

IC Socket, PGA175, 175 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

器件类别:连接器    插座   

厂商名称:Advanced Interconnections Corp

下载文档
器件参数
参数名称
属性值
是否Rohs认证
不符合
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
1.0 OZ. AVG. INSERTION FORCE
主体宽度
1.5 inch
主体深度
0.165 inch
主体长度
1.5 inch
触点的结构
15X15
联系完成配合
AU ON NI
联系完成终止
Gold (Au) - with Nickel (Ni) barrier
触点材料
BE-CU
触点样式
RND PIN-SKT
设备插槽类型
IC SOCKET
使用的设备类型
PGA175
外壳材料
GLASS FILLED THERMOPLASTIC
JESD-609代码
e4
插接触点节距
0.1 inch
安装方式
STRAIGHT
触点数
175
最高工作温度
260 °C
最低工作温度
-60 °C
PCB接触模式
RECTANGULAR
PCB触点行间距
0.1 mm
端子节距
2.54 mm
端接类型
SOLDER
Base Number Matches
1
文档预览
Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Molded & FR-4 Low Insertion Force PGA Sockets
.100
(2.54)
.062
(1.57)
Molded
PC Board
FR-4
PC Board
Features:
• As low as 1 oz.(28.34 g) average insertion
force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% anti-
wicking of solder.
• Tapered entry for ease of insertion.
• To fit .100” (2.54 mm) grid.
• Easily customized to fit your application.
How To Order
1 oz. (28.34 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CIS - Standard Molded
HCIS - High Temp. Molded
FIS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
CIS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
How To Order
2.5 oz. (70.85 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CS - Standard Molded
HCS - High Temp. Molded
FS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Solder Preform:
63% Tin, 37% Lead
CS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Terminal Type
See next page
for terminal types
Sealant Options
RTV
Seal
Body Material:
CS/CIS -
Glass Filled Thermoplastic
Polyester (P.B.T.), U.L. Rated 94V-O,
-60˚C to 140˚C (-76˚F to 284˚F)
HCS/HCIS -
High Temp. Glass Filled
Thermoplastic (P.P.S.) , U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
FS/FIS -
FR-4 Fiberglass Epoxy Board,
U.L. Rated 94V-O, Index 140˚C (284˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Tape Sealed
To order: Add 3M to end of part #
Page 32
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Terminals for Molded & FR-4 Low Insertion Force PGA Sockets
Standard Quick Turn Terminal
Type -01
.072 Dia.
(1.83)
Type -04
.072 Dia.
(1.83)
Type -29
.072 Dia.
(1.83)
Type -51
.072 Dia.
(1.83)
Type -49
Not available in 1 oz.
.072 Dia.
(1.83)
.165
(4.19)
.120
(3.05)
.165
(4.19)
.130
(3.30)
.095
(2.41)
.125
(3.18)
.020 Dia.
(.51)
.028 Dia.
(.71)
.110
(2.79)
.170
(4.32)
.020 Dia.
(.51)
.020 Dia.
(.51)
.110
(2.79)
.028 Dia.
(.71)
.095
(2.41)
PGA
Quick turn delivery available on standard terminal types.
Additional terminal types available. See terminal section for detailed terminal information.
Solder Preform PGA Sockets - Intrusive Reflow Application
Solder Preform
PC Board
Features:
• Combines the labor of socket loading and
solder application into one operation.
• Eliminates the use of solder paste and
screening operation.
• Eliminates solder bridges and/or solder
shorts due to excess solder.
• Ensures a reliable solder joint with
controlled solder volume.
• Ideal for surface mount and mixed
technology applications.
• For custom solder preform terminal
applications consult factory.
• See previous page for material
specifications and how to order information.
Preform After
Solder Flow
Solder Preform Terminals
Type -150
.072 Dia.
(1.83)
Type -151
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.165
.165
(4.19)
(4.19)
Solder
Preform
.125
.125
(3.18)
(3.18)
.020 Dia.
(.51)
.130
(3.30)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.020 Dia.
(.51)
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 33
查看更多>
哪位朋友能推荐一款2v至5v稳压到3v的芯片。
哪位朋友能推荐一款2v至5v稳压到3v的芯片。还有推荐一款232接...
dinglitao stm32/stm8
TI MSP430F5529培训【学习有礼】第一期获奖信息公布!
活动详情: https://www.eeworld.com.cn/huodong/20130225T...
EEWORLD社区 微控制器 MCU
MSP430处女作 按键点亮LED 【LaunchPad】
//LED2受控于 用户按钮,按下灭,否则亮 #include \"msp430g2231.h\"...
fxyc87 微控制器 MCU
出一个Embedded LPC4088 Developer's Kit
上图!!!! 当时原价1600左右买的,现在由于需要升级拾音器,比较缺钱,想把这个尤物出了,基本没...
zgbkdlm 淘e淘
LM3S网络控制求助~~
小弟菜鸟一个,刚从老师那里搞来个LM3S6965的板子,想做个通过网页控制端口通断的路由器,但实在是...
gravity 微控制器 MCU
MPU姿态传感器INT、MOSI、MISO、SCK、NCS这五个脚的作用是?波形对不对
MPU姿态传感器INT、MOSI、MISO、SCK、NCS这五个脚的作用是?波形对不对 ...
QWE4562009 测试/测量
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消