This one-part, epoxy-based, free-flowing powder cures
at elevated temperatures to a rigid, non-burning
syntactic foam
ECCOSTOCK
®
FFP is extremely light weight and
provides physical support as well as thermal insulation
without increasing the weight or dielectric constant
ECCOSTOCK
®
FFP exhibits minimum shrinkage during
cure, exerting minimum stress on delicate components
Cured material can be easily removed with tools
enabling access to repair or replace components
Since cured ECCOSTOCK
®
FFP is porous, an application
of an epoxy coating will reduce moisture absorption
Shelf life is 6 months if stored in a cool dry place out of
direct sunlight at 21 °C (70 °F)
Typical Properties
White Powder
-85 to 347
(-65 to 175)
240 (15)
1000 (150)
1.25
0.005
64
Temperature Range, °F (°C)
Density, kg/m
3
(lb/ft
3
)
Compression Strength, kPa (psi)
Dielectric Constant @ 8.6 GHz
Loss Tangent @ 8.6 GHz
Dielectric Strength, volts/mil
Thermal Conductivity,
(cal)(cm)/(sec)(cm
2
)(°C)
(BTU)(in)/(hr)(ft
2
)(°F)
Volume Resistivity, ohm-cm
1.20 x 10
-4
0.35
3.49 x 10
11
Applications
•
•
ECCOSTOCK
®
FFP is designed to infiltrate densely
populated electronic packages, readily filling available
volumes around components. It been used to stabilize
crystal oscillators as well as other delicate components
that need to be held in place or thermally protected.
ECCOSTOCK
®
FFP has also found its way into
machinery operating in high vibration environments to
keep electrical components from shaking apart
Instructions For Use
•
•
Availability
•
ECCOSTOCK
®
FFP is readily available in pints, quarts,
gallons, and 5 gallon containers.
Pint and quart
containers are also available in squeeze bottles for
ease in application
•
•
•
•
Refer to the MSDS for full safety information before
opening the container. Measures should be taken to
avoid any contact with the skin and eyes, and a dust
mask or respirator should be used to avoid inhaling
the product.
Mix the ECCOSTOCK
®
FFP in the shipping container
by lightly tumbling or shaking before use, as some
components may separate during shipping and
storage
In a well ventilated area, carefully pour the
ECCOSTOCK
®
FFP from a small paper cup or dispense
from a squeeze bottle into the device being filled
Light to moderate vibration is recommended to
maximize packing of the ECCOSTOCK
®
FFP
ECCOSTOCK
®
FFP bonds well to itself and most other
substrates. Butcher’s Wax or a silicone mold release
is recommended in applications where removal from a
mold is necessary
Elevated temperature curing of the ECCOSTOCK
®
FFP
is required. Select one of the following recommended
curing times and temperatures below:
Cure Times and Temperatures
24 hours at 212°F (100°C)
4 hours at 248°F (120°C)
2 hours at 302°F (150°C)
EMERSON & CUMING MICROWAVE PRODUCTS, INC., 28 York Avenue, Randolph, MA 02368 / Telephone (781) 961-9600. Use of Information and Material: Values shown are based on testing of laboratory test specimens and represent data that
falls within normal range of the material. These values are not intended for use in establishing maximum, minimum or ranges of values for specification purposes. Any determination of the suitability of the material for any purpose
contemplated by the user and the manner of such use is the responsibility of the user. The user should determine that the material meets the needs of the user's product and use. We hope that the information given here will be helpful. It is
based on data and knowledge considered to be true and accurate and is offered for the user's consideration, investigation and verification but we do not warrant the results to be obtained. Please read all statements, recommendations or
suggestions in conjunction with our conditions of sale INCLUDING THOSE LIMITING WARRANTIES AND REMEDIES, which apply to all goods supplied by us. We assume no responsibility for the use of these statements, recommendations or
suggestions nor do we intend them as a recommendation for any use, which would infringe any patent or copyright. Emerson & Cuming Microwave Products Inc.
