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345723-2

SOCKET, DIP24, IC SOCKET

器件类别:连接器    插座   

厂商名称:TE Connectivity(泰科)

厂商官网:http://www.te.com

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器件参数
参数名称
属性值
厂商名称
TE Connectivity(泰科)
Reach Compliance Code
unknown
ECCN代码
EAR99
联系完成配合
GOLD (20)
联系完成终止
TIN LEAD OVER NICKEL
设备插槽类型
IC SOCKET
使用的设备类型
DIP24
外壳材料
PLASTIC
JESD-609代码
e0
制造商序列号
345723
触点数
24
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345723-2 Product Details
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345723-2
T E I nternal N umber: 3 4 5 7 2 3 - 2
Product Highlights:
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DIP Socket
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Number of Positions = 24
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Row-to-Row Spacing = 7.62 mm
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Through Hole C ontact Termination Type
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Mount Style = Vertical
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Product Line Information
Related Products:
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Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type
= DIP Socket
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Number of Positions
= 24
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Profile = Standard
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Frame Style
= Open
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Leg Style
= Straight
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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C ontact Resistance (m?) = 30
Termination Related Features:
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Termination Post Length (mm [in])
= 2.84 [0.112]
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Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
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Row-to-Row Spacing (mm [in])
= 7.62 [0.300]
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Mount Style
= Vertical
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C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
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C ontact Termination Type
= Through Hole
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C ontact Base Material
= Beryllium C opper
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C ontact Mating Area Plating Material
= Gold (20)
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C ontact Style
= Screw Machine
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Mating C ontact Type
= Inner Spring
Configuration Related Features:
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Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
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RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
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Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
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Temperature Range (?C ) = 105
Packaging Related Features:
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Packaging Method
= Tube
Other:
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Brand = AMP
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