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http://www.tekcon.com
http://www.tekcon.com.tw
3592 Series
DIMM Socket
1.27 mm Pitch, Forming Type
Ordering Information
3592
-
X X X
-
XX X
Contact Plating
A - Gold Flash all area
0 - Gold Flash/Tin
1 - 10
µ"
Gold/Tin
2 - 20
µ"
Gold/Tin
3 - 30
µ"
Gold/Tin
4 - 3
µ"
Gold/Tin
5 - 15
µ"
Gold/Tin
8 - Tin
Voltage Key
3 - apply 3.3 V module
5 - apply 5 V module
Function Key (DRAM Key)
1-offset Left Key. (SDRAM)
2-offset Centered Key(DRAM)
3-offset Right Key (Unbuffered DRAM)
Housing Material
1 - LCP, Black
2 - LCP, Ivory
5 - Ny66, Black
6 - Ny66, Ivory
7 - PBT, Black
8 - PBT, Ivory
With Post Position
51- with A,B,C Metal Clip
52- with B,C,D Metal Clip
Specification
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Materials:
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Housing & Latch:
High Temperature Glass Fiber Reinforced
Thermoplastic, UL94V-0.
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Contact:
Copper Alloy.
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Plating:
Gold Flash on Contact Area and Tin/
Lead on Solder Tail.
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Electrical:
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Insulation Resistance:
10,000 MΩ Minimum.
s
Dielectric Withstanding Voltage:
1000 VAC R.M.S.
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Voltage Rating:
500V.
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Current Rating:
1 AMP.
s
Contact Resistance:
30 mΩ Maximum.
s
Capacitance:
1 PF (Max.) at 1Mhz between
randomly selected adjacent contacts.
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Mechanical
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Durability:
25 cycles Minimum.
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Contact Engaging Force:
1.390N Maximum,
Pair Contact.
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Contact Retention Force:
500 g Minimum,
per Contact.
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Accept Standard JEDEC Modules:
0.05 +/- 0.004
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Enviromental
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Temperature: -558C to +1058C
Dimensions
TEKCON Electronics Corporation
11-1
