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参数对比

与3D2D8G64UB2395-M-4A相近的元器件有：3D2D8G64UB2395-M-5C、3D2D8G64UB2395CN-5C、3D2D8G64UB2395IBH-4A、3D2D8G64UB2395IBH-5C、3D2D8G64UB2395MS-4A、3D2D8G64UB2395MS-8G、3D2D8G64UB2395MSP-8G、3D2D8G64UB2395MSY-6E。描述及对比如下：

型号	3D2D8G64UB2395-M-4A	3D2D8G64UB2395-M-5C	3D2D8G64UB2395CN-5C	3D2D8G64UB2395IBH-4A	3D2D8G64UB2395IBH-5C	3D2D8G64UB2395MS-4A	3D2D8G64UB2395MS-8G	3D2D8G64UB2395MSP-8G	3D2D8G64UB2395MSY-6E
描述	DRAM	DRAM	DDR DRAM, 128MX64, CMOS, PBGA208, BGA-208	DDR DRAM, 128MX64, CMOS, PBGA208, BGA-208	DDR DRAM, 128MX64, CMOS, PBGA208, BGA-208	DDR DRAM, 128MX64, CMOS, PBGA208, BGA-208	DDR DRAM, 128MX64, CMOS, PBGA208, BGA-208	DDR DRAM, 128MX64, CMOS, PBGA208, BGA-208	DDR DRAM, 128MX64, CMOS, PBGA208, BGA-208
Objectid	114189977	114189970	1383342566	1383342768	1383342540	1383342594	1383342592	1383342544	1383342652
包装说明	,	,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	-	-	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
其他特性	-	-	SELF REFRESH	SELF REFRESH	SELF REFRESH	SELF REFRESH	SELF REFRESH	SELF REFRESH	SELF REFRESH
JESD-30 代码	-	-	R-PBGA-B208	R-PBGA-B208	R-PBGA-B208	R-PBGA-B208	R-PBGA-B208	R-PBGA-B208	R-PBGA-B208
长度	-	-	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
内存密度	-	-	8589934592 bit	8589934592 bit	8589934592 bit	8589934592 bit	8589934592 bit	8589934592 bit	8589934592 bit
内存集成电路类型	-	-	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	-	-	64	64	64	64	64	64	64
功能数量	-	-	1	1	1	1	1	1	1
端口数量	-	-	1	1	1	1	1	1	1
端子数量	-	-	208	208	208	208	208	208	208
字数	-	-	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words
字数代码	-	-	128000000	128000000	128000000	128000000	128000000	128000000	128000000
工作模式	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	-	-	70 °C	85 °C	85 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-	-	-	-40 °C	-40 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	-	-	128MX64	128MX64	128MX64	128MX64	128MX64	128MX64	128MX64
封装主体材料	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	-	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	-	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
座面最大高度	-	-	4.25 mm	4.25 mm	4.25 mm	4.25 mm	4.25 mm	4.25 mm	4.25 mm
自我刷新	-	-	YES	YES	YES	YES	YES	YES	YES
最大供电电压 (Vsup)	-	-	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
最小供电电压 (Vsup)	-	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	-	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	-	-	YES	YES	YES	YES	YES	YES	YES
技术	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	-	-	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	-	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	-	-	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
端子位置	-	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	-	-	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm