型号
- 型号
- 关键词
| 型号 | 3DEE2M08CS2097-MS-A00 | 3DEE2M08CS2097MSY-00 | 3DEE2M08CS2097MS-00 | 3DEE2M08CS2097MSP-00 | 3DEE2M08CS2097CN-00 | 3DEE2M08CS2097IBH-00 | 3DEE2M08CS2097-IB-A00 | 3DEE2M08CS2097-CN-A00 | 3DEE2M08CS2097-IS-A00 |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM | EEPROM, 256KX8, 150ns, Parallel, CMOS, PDSO40, SOP-40 | EEPROM, 256KX8, 150ns, Parallel, CMOS, PDSO40, SOP-40 | EEPROM, 256KX8, 150ns, Parallel, CMOS, PDSO40, SOP-40 | EEPROM, 256KX8, 150ns, Parallel, CMOS, PDSO40, SOP-40 | EEPROM, 256KX8, 150ns, Parallel, CMOS, PDSO40, SOP-40 | EEPROM | EEPROM | EEPROM |
| 包装说明 | , | SSOP, | SSOP, | SSOP, | SSOP, | SSOP, | , | , | , |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最长访问时间 | - | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | - | - | - |
| JESD-30 代码 | - | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | - | - | - |
| 长度 | - | 13.2 mm | 13.2 mm | 13.2 mm | 13.2 mm | 13.2 mm | - | - | - |
| 内存密度 | - | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | - | - | - |
| 内存集成电路类型 | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - | - | - |
| 内存宽度 | - | 8 | 8 | 8 | 8 | 8 | - | - | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 端子数量 | - | 40 | 40 | 40 | 40 | 40 | - | - | - |
| 字数 | - | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | - | - | - |
| 字数代码 | - | 256000 | 256000 | 256000 | 256000 | 256000 | - | - | - |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 70 °C | 85 °C | - | - | - |
| 组织 | - | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | - | - | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - |
| 封装代码 | - | SSOP | SSOP | SSOP | SSOP | SSOP | - | - | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - |
| 封装形式 | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | - | - |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | - | - |
| 编程电压 | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
| 座面最大高度 | - | 5.1 mm | 5.1 mm | 5.1 mm | 5.1 mm | 5.1 mm | - | - | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | - |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
| 表面贴装 | - | YES | YES | YES | YES | YES | - | - | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | COMMERCIAL | INDUSTRIAL | - | - | - |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | - | - |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | - | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - |
| 宽度 | - | 11.7 mm | 11.7 mm | 11.7 mm | 11.7 mm | 11.7 mm | - | - | - |