型号 | 3DSD2G32VS4484MSP-00 | 3DSD2G32VS4484MSY-00 | 3DSD2G32VS4484-IS-A75 | 3DSD2G32VS4484-CN-A75 | 3DSD2G32VS4484CN-00 | 3DSD2G32VS4484-IB-A75 | 3DSD2G32VS4484MS-00 | 3DSD2G32VS4484IBH-00 |
---|---|---|---|---|---|---|---|---|
描述 | Synchronous DRAM, 64MX32, CMOS, PDSO70, SOP-70 | Synchronous DRAM, 64MX32, CMOS, PDSO70, SOP-70 | DRAM | DRAM | Synchronous DRAM, 64MX32, CMOS, PDSO70, SOP-70 | DRAM | Synchronous DRAM, 64MX32, CMOS, PDSO70, SOP-70 | Synchronous DRAM, 64MX32, CMOS, PDSO70, SOP-70 |
包装说明 | SSOP, | SSOP, | , | , | SSOP, | , | SSOP, | SSOP, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | - | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | - | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-PDSO-G70 | R-PDSO-G70 | - | - | R-PDSO-G70 | - | R-PDSO-G70 | R-PDSO-G70 |
长度 | 24 mm | 24 mm | - | - | 24 mm | - | 24 mm | 24 mm |
内存密度 | 2147483648 bit | 2147483648 bit | - | - | 2147483648 bit | - | 2147483648 bit | 2147483648 bit |
内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | - | - | SYNCHRONOUS DRAM | - | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
内存宽度 | 32 | 32 | - | - | 32 | - | 32 | 32 |
功能数量 | 1 | 1 | - | - | 1 | - | 1 | 1 |
端口数量 | 1 | 1 | - | - | 1 | - | 1 | 1 |
端子数量 | 70 | 70 | - | - | 70 | - | 70 | 70 |
字数 | 67108864 words | 67108864 words | - | - | 67108864 words | - | 67108864 words | 67108864 words |
字数代码 | 64000000 | 64000000 | - | - | 64000000 | - | 64000000 | 64000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | - | - | 70 °C | - | 125 °C | 85 °C |
组织 | 64MX32 | 64MX32 | - | - | 64MX32 | - | 64MX32 | 64MX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | SSOP | - | - | SSOP | - | SSOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | - | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
座面最大高度 | 9.95 mm | 9.95 mm | - | - | 9.95 mm | - | 9.95 mm | 9.95 mm |
自我刷新 | YES | YES | - | - | YES | - | YES | YES |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | - | - | 3.6 V | - | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | - | - | 3 V | - | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | - | - | 3.3 V | - | 3.3 V | 3.3 V |
表面贴装 | YES | YES | - | - | YES | - | YES | YES |
技术 | CMOS | CMOS | - | - | CMOS | - | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | - | - | COMMERCIAL | - | MILITARY | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | - | - | GULL WING | - | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.635 mm | - | - | 0.635 mm | - | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | - | - | DUAL | - | DUAL | DUAL |
宽度 | 15 mm | 15 mm | - | - | 15 mm | - | 15 mm | 15 mm |