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参数对比

与3DSR16M08CS4218MSY-12相近的元器件有：3DSR16M08CS4218MSP-12、3DSR16M08CS4218CN-20、3DSR16M08CS4218CN-15、3DSR16M08CS4218IBH-20、3DSR16M08CS4218MSY-15、3DSR16M08CS4218MSP-15、3DSR16M08CS4218MS-12、3DSR16M08CS4218IBH-15、3DSR16M08CS4218-MS-A15。描述及对比如下：

型号	3DSR16M08CS4218MSY-12	3DSR16M08CS4218MSP-12	3DSR16M08CS4218CN-20	3DSR16M08CS4218CN-15	3DSR16M08CS4218IBH-20	3DSR16M08CS4218MSY-15	3DSR16M08CS4218MSP-15	3DSR16M08CS4218MS-12	3DSR16M08CS4218IBH-15	3DSR16M08CS4218-MS-A15
描述	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	Standard SRAM, 2MX8, CMOS, PDSO44, 0.80 MM PITCH, SOP-44	SRAM
包装说明	SSOP,	SSOP,	SSOP,	SSOP,	SSOP,	SSOP,	SSOP,	SSOP,	SSOP,	,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Base Number Matches	1	1	1	1	1	1	1	1	1	1
JESD-30 代码	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	-
长度	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	-
内存密度	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	-
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-
内存宽度	8	8	8	8	8	8	8	8	8	-
功能数量	1	1	1	1	1	1	1	1	1	-
端子数量	44	44	44	44	44	44	44	44	44	-
字数	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	-
字数代码	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000	-
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
最高工作温度	125 °C	125 °C	70 °C	70 °C	85 °C	125 °C	125 °C	125 °C	85 °C	-
最低工作温度	-55 °C	-55 °C	-	-	-40 °C	-55 °C	-55 °C	-55 °C	-40 °C	-
组织	2MX8	2MX8	2MX8	2MX8	2MX8	2MX8	2MX8	2MX8	2MX8	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装代码	SSOP	SSOP	SSOP	SSOP	SSOP	SSOP	SSOP	SSOP	SSOP	-
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
封装形式	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	-
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-
座面最大高度	7.75 mm	7.75 mm	7.75 mm	7.75 mm	7.75 mm	7.75 mm	7.75 mm	7.75 mm	7.75 mm	-
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	-
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
温度等级	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	INDUSTRIAL	MILITARY	MILITARY	MILITARY	INDUSTRIAL	-
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	-
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	-
宽度	10.95 mm	10.95 mm	10.95 mm	10.95 mm	10.95 mm	10.95 mm	10.95 mm	10.95 mm	10.95 mm	-