ProFLEX01 TRANSCEIVER MODULE
DATASHEET
Integrated Transceiver Modules for ZigBee / 802.15.4 (2.4 GHz)
Development Kit Available
FEATURES
100mW output power
Long range: 4000 feet
Miniature footprint: 0.9” x 1.63”
Integrated PCB F antenna or U.FL
connector for external antenna
Worldwide acceptance: FCC, IC and CE
Powerful Texas Instruments 256k MSP430
with 802.15.4 MAC or ZigBee Stack
LSR serial interface based on 802.15.4 MAC
Low power operation
RoHS compliant
Streamlined development with LSR design
services.
License options available to purchase
design or integrate design.
DESCRIPTION
The ProFLEX01 module is a high performance
2.4GHz IEEE 802.15.4 radio (CC2520 &
CC2591) and
microcontroller
(MSP430F5437) in a
cost effective, pre-
certified footprint.
The module comes
preloaded with the TI MAC-Stack that can be
used with the LSR host serial interface.
Full debug and programming capabilities are
included to develop custom applications. Easily
load the TI ZigBee stack or MAC onto the
module and create your own network.
Need to get to market quickly? Not an expert in
802.15.4 or ZigBee? Need a custom antenna?
Would you like to own the design? Would you
like a custom design? Not quite sure what you
need? Do you need help with your host board?
LS Research Design Services will be happy to
develop custom hardware or software, integrate
the design, or license the design so you can
manufacture yourself. Contact us at
sales@lsr.com or call us at 262-375-4400.
APPLICATIONS
Security
Lighting Control
HVAC Control
Sensor Networks
Medical
Smart Energy
ORDERING INFORMATION
Order Number
LS240-ZP-01-A10
LS240-ZP-01-A20
LSDEV-ZP01-A10
450-0011
450-0012
450-0023
Description
This number has been replaced with 450-0011
This number has been replaced with 450-0012
This number has been replaced with 450-0023
ProFLEX01 Module with PCB F antenna
ProFLEX01 Module with U.FL connector for external antenna
ProFLEX01 Development Kit
Table 1 Orderable ProFLEX01 Model Numbers
The information in this document is subject to change without notice.
330-0001-R3.0
Copyright © 2009-2012 LS Research, LLC
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ProFLEX01 TRANSCEIVER MODULE
DATASHEET
MODULE ACCESSORIES
Order Number
Description
001-0001
2.4 GHz Dipole Antenna with Reverse
Polarity SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead
Cable 105mm
The information in this document is subject to change without notice.
330-0001-R3.0
Copyright © 2009-2012 LS Research, LLC
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ProFLEX01 TRANSCEIVER MODULE
DATASHEET
BLOCK DIAGRAM
TMR/PWM
Analog
Serial I/O
MSP430F5437
(Microcontroller)
SPI
CC2520
(802.15.4 Radio)
CC2591
(PA/LNA)
Antenna
PGM/DBG
Figure 1 ProFLEX01 Module Block Diagram – High-Level
DEVELOPMENT KIT
The ProFLEX01 Development Kit can be used
out of the box to evaluate RF range
performance with the simple press of a button.
Users interested in further investigating the
performance and capabilities of the ProFLEX01
Module can use the ProFLEX01 Test Tool.
This PC-based software can demonstrate just
how easy it is to send & receive data, collect
performance data, change channels, power
levels, or addresses using the LSR Serial Host
Protocol with another microcontroller.
More advanced users can use the development
board to create and debug their own software
for the ProFLEX01 module using the 802.15.4
MAC or ZigBee stack from TI.
Part Number
450-0023
Description
ProFLEX01 Development
Kit with F-Antenna
Figure 2 ProFLEX01 Development Board
GPIO
Kit Contents
ProFLEX01 Development Board with
ProFLEX01 Series Transceiver Module with
F antenna (x2)
USB Cable (x2)
AA Batteries (x4)
Software & Technical Information CD
Quick Start Guide
The information in this document is subject to change without notice.
330-0001-R3.0
Copyright © 2009-2012 LS Research, LLC
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ProFLEX01 TRANSCEIVER MODULE
DATASHEET
TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 1
MODULE ACCESSORIES ................................................................................................... 2
BLOCK DIAGRAM ............................................................................................................... 3
DEVELOPMENT KIT............................................................................................................ 3
Kit Contents ................................................................................................................................................. 3
MODULE PINOUT AND PIN DESCRIPTIONS .................................................................... 6
MODULE OVERVIEW ........................................................................................................ 11
Microcontroller .......................................................................................................................................... 11
Radio .......................................................................................................................................................... 12
PA/LNA ....................................................................................................................................................... 14
Antenna Options ....................................................................................................................................... 14
MODES OF OPERATION .................................................................................................. 16
Host Microcontroller ................................................................................................................................. 16
Software Stacks ........................................................................................................................................ 17
DEVELOPMENT TOOLS ................................................................................................... 18
TI MSP-FET430UIF .................................................................................................................................... 18
IAR Embedded Workbench for MSP430 ................................................................................................. 18
ELECTRICAL SPECIFICATIONS ...................................................................................... 19
Absolute Maximum Ratings ..................................................................................................................... 19
Recommended Operating Conditions .................................................................................................... 19
General Characteristics ............................................................................................................................ 20
RF Characteristics .................................................................................................................................... 21
SOLDERING RECOMMENDATIONS ................................................................................ 24
Recommended Reflow Profile for Lead Free Solder ............................................................................. 24
CLEANING ......................................................................................................................... 25
OPTICAL INSPECTION ..................................................................................................... 25
The information in this document is subject to change without notice.
330-0001-R3.0
Copyright © 2009-2012 LS Research, LLC
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ProFLEX01 TRANSCEIVER MODULE
DATASHEET
REWORK ........................................................................................................................... 25
SHIPPING, HANDLING, AND STORAGE ......................................................................... 25
Shipping ..................................................................................................................................................... 25
Handling ..................................................................................................................................................... 25
Moisture Sensitivity Level (MSL) ............................................................................................................. 25
Storage ....................................................................................................................................................... 25
Repeating Reflow Soldering .................................................................................................................... 25
AGENCY STATEMENTS ................................................................................................... 26
Agency Certifications ............................................................................................................................... 26
Federal Communication Commission Interference Statement ............................................................ 26
Industry Canada Statements.................................................................................................................... 27
OEM Responsibilities to comply with FCC and Industry Canada Regulations .................................. 28
End Product Labeling ............................................................................................................................... 29
EUROPE ............................................................................................................................ 30
CE Notice ................................................................................................................................................... 30
Declaration of Conformity (DOC) ............................................................................................................ 30
MECHANICAL DATA......................................................................................................... 31
PCB Footprint ............................................................................................................................................ 31
General Module Dimensions .................................................................................................................... 32
COMPATIBILITY ................................................................................................................ 33
MODULE REVISION HISTORY ......................................................................................... 34
Rev B .......................................................................................................................................................... 34
Rev C .......................................................................................................................................................... 34
CONTACTING LS RESEARCH ......................................................................................... 35
The information in this document is subject to change without notice.
330-0001-R3.0
Copyright © 2009-2012 LS Research, LLC
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