Sn63Pb37 No Clean Solder Paste
4860P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4860P
Description
The 4860P
Sn63Pb37 No Clean Solder Paste
is made from a blend of high purity, non-recycled tin and lead
alloy powder blended with a no clean flux to form a paste. It is designed for surface mount applications
and provides high tack force and good wettability. The post soldering residues are transparent, non-
conductive, non-corrosive, and highly insulated. No clean means that residues are not harmful to
assemblies.
Applications & Usages
The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when
using an ultra-fine pitch stencils down to 0.3 mm.
Benefits and Features
•
•
•
•
•
•
•
Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B
Non-corrosive
Non-conductive residue
Halide free
Good wettability
Type 3 (45-25 µm)
C
OMPLIANCE
✓
Dobb Frank (DRC
conflict free)
✓
REACH (compliant)
RoHS (non-compliant)
Solder Alloy Composition
Properties
MAIN INGREDIENTS
Sn
Pb
Value
63.5 to 63.5%
36.5 to 37.5%
Properties
IMPURITIES
Sb
Ag
Bi
In
Cu
Au
As
Fe
Ni
Al
Zn
Cd
Value
a)
Because this product contains lead, it is not RoHS
compliant. The following RoHS exemptions are
applicable 7(b), 15, 24, 31, 33.
≤0.20%
Max
≤0.10%
Max
≤0.10% Max
≤0.10% Max
≤0.08%
Max
≤0.05% Max
≤0.03% Max
≤0.02% Max
≤0.01% Max
≤0.005%
Max
≤0.003%
Max
≤0.002%
Max
a) Exceeds the requirements of J-STD-006C and meets ASTM B 32.
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Date: 09 September 2017 / Ver. 2.05
Sn63Pb37 No Clean Solder Paste
4860P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4860P
Sn63/Pb37 Alloy Typical Literature Properties
Physical Properties
Color
Tensile Strength
Elongation
Hardness
Shear Strength
Electrical Properties
Volume Resistivity
Electrical Conductivity
b)
Thermal Properties
Melting Point, Solidus
Melting Point, Liquidus
Tip Temperature Upper Limit
Coefficient of Thermal Expansion (CTE)
Thermal Conductivity
Value
a)
Metallic grey
54 N/mm
2
[7 800 lb/in
2
]
37%
14 HB
37 N/mm
2
[5 400 lb/in
2
]
Value
14.5
Ωcm
11.9% IACS
Value
183 °C [361 °F]
183 °C [361 °F]
Do not exceed 260 °C [500 °F]
24.7 ppm/°C
50 W/(m·K)
c)
Note:
This table present typical literature values for 63/37 alloys.
a) N/mm
2
= mPa; lb/in
2
= psi;
b) International Annealed Copper Standard: 100% give 5.8 × 10
7
S/m.
c) Units conversions: ppm/°C =
m/(mK)
= in/in/°C × 10
-6
= unit/unit/°C × 10
-6
4860P Properties
Flux Properties
Flux Classification
Flux Type
Flux Activity
Halides %(wt)
Acid Number (mgKOH/g sample)
Copper Mirror
Corrosion Test
Surface Insulation Resistance (SIR)
Bellcore (Telecordia)
Electromigration
Post Reflow Flux Residue
Method
J-STD-004B
Value
REL0
Resin
Low
<0.05%
110
No removal of copper film
Pass
2.4 x 10
10
Ω
4.1 x 10
10
Ω
Pass
45%
IPC-TM-650 2.3.13
IPC-TM-650 2.3.32
IPC-TM-650 2.6.15
IPC-TM-650 2.6.3.3
Bellcore GR-78-CORE 13.1.3
Bellcore GR-78-CORE 13.1.4
TGA Analysis
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Date: 09 September 2017 / Ver. 2.05
Sn63Pb37 No Clean Solder Paste
4860P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4860P
Value
88%
400 ±10%
850-1 100
No bridges all spacings
"
0.20/0.20
"
Pass
85 g
90 g
92 g
Paste Properties
Metal Loading
Viscosity
Brookfield
(1)
, kcps
Malcom
(2)
, poise
Slump Test
25 °C, 0.63 vertical/horizontal
150 °C, 0.63 vertical/horizontal
25 °C, 0.33 vertical/horizontal
150 °C, 0.33 vertical/horizontal
Solder Ball Test
Tack
Initial
Tack retention @24 h
Tack retention @72 h
Method
IPC-TM-650 2.2.20
IPC-TM-650 2.4.34.3 modified
IPC-TM-650 2.4.34 modified
IPC-TM-650 2.4.35
"
"
"
IPC-TM-650 2.4.43
JIS Z 3284
"
"
Particle Size
The powder distribution complies with the J-STD-005 Type 3 (45-25 µm) particle size. Solder powder
distribution is measured utilizing laser diffraction, optical analysis and sieve analysis. Careful control of
solder powder manufacturing processes ensures the particles’ shape are 95% spherical minimum (aspect
ratio <1.5) and that the alloy contains a typical maximum oxide level of 80 ppm.
Pressure
The pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept in
the range of 105-176 g/cm [15-25 lb/in] according to the length of the blade. The external air pressure
supply should be maintained constant.
Solder Paste Application
Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the
paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in a
dispensing application depends on viscosity, which can be altered by temperature change. If solder paste
is purchased in syringes pre-mixing is not necessary due to the shear action produced from the
dispensing.
Reflow
Best results have been achieved when the 4860P is reflowed in a forced air convection oven with a
minimum of 8 zones (top and bottom).
The following is a recommended profile for a forced air convection reflow process. The melting
temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e.
density, thickness, etc.) determine the actual reflow profile.
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Sn63Pb37 No Clean Solder Paste
4860P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4860P
Preheat Zone—The
preheat zone, which is also referred to as the ramp zone, is used to elevate the
temperature of the PCB to the desired soak temperature. In the preheat zone, the rate of temperature rise
should not exceed 2.5 °C/s to avoid thermal chock stresses. The oven preheat zone normally occupies 25–
33% of the heated tunnel length.
The Soak Zone—normally
occupies 33–50% of the heated tunnel length. It exposes the PCB to a
relatively stable temperature that allows the components of different mass to reach a uniform
temperature. The soak zone also allows the flux to concentrate and the volatiles to escape from the paste.
The Reflow Zone—or
spike zone, elevates the temperature of the PCB assembly from the activation
temperature to the recommended peak temperature. The activation temperature is always slightly below
the alloy melting point, while the peak temperature is always above its melting point.
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Date: 09 September 2017 / Ver. 2.05
Sn63Pb37 No Clean Solder Paste
4860P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4860P
Cleaning
The 4860P is a no clean formulation therefore the residues do not need to be removed for typical
applications. If residue removal is desired, use MG 8241-T or 8241-W Isopropyl Alcohol Wipes.
Storage and Shelf Life
Store refrigerated between 2-10 °C [35-50 °F] to minimize solvent evaporation, flux separation, and
chemical activity. Storage of syringes is preferred in an upright position with tip down to prevent flux
separation and air entrapment. Use at room temperature, warm up can be achieved by removing from
refrigerator 3 hours before use, faster warm up can also be achieved by placing in a sealed container in a
water bath at near ambient temperature for 30 minutes.
Unopened Container 2–10 °C [35–50 °F] 24 months from date of manufacture.
Unopened Container 20–25 °C [68–77 °F] 12 months from date of manufacture.
Reusing Solder Paste
Reusing solder paste is not normally recommended because it typically generates more complications than
it is worth. If you do decide to reuse solder paste, keep the following pointers in mind:
•
•
•
Keep the paste tightly sealed and refrigerated when not in use.
Store syringes upright position with tip down to prevent flux separation and air entrapment.
Before reuse, check that the paste hasn’t separated or thickened relative to its usual state.
Working Environment
Solder paste performs best when used in a controlled environment. Maintaining ambient temperature of
between 20–25 °C [68-77 °F] at a relative humidity of 40–65% will ensure consistent performance and
maximum life of paste.
Cleaning Misprint Boards
In case of a misprinted board, the paste may be cleaned by hand using the MG 8241 Alcohol Wipes.
Stencil Cleaning
Periodic cleaning of the stencil during production is recommended to prevent unwanted deposits outside
the print areas. Insufficient stencil cleaning increases solder balling. After printing 5 to 10 boards, we
therefore recommend a dry wipe. And after every 15 to 25 boards, we recommend a wet wipe with MG
8241-T or 8241-W Alcohol Wipe. For fine pitch boards, the cleaning frequency generally needs to be
increased.
Disposal
The 4860P should be stored in a sealed container and disposed of in accordance with state & local
authority requirements.
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