Lead Free Solder
Page 1 of 2
Lead Free Solder Sn99
4901
99.3% tin and 0.7% copper
M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu (Tin/Copper) alloys
as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to
the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would
use normal solder.
If your products might enter Europe, you must ensure they are
RoHS compliant now. If your products are sold in California, you
must ensure they are compliant by January 1, 2007. Products
containing lead solder will not comply. To read more on this issue
visit our
RoHS Issue AppGuide
Features / Benefits
Lead free
Complies with RoHS
Exceeds the impurity requirements of J-Std-006
No Clean flux
21 Gauge, 0.032" diameters
Excellent wettability
Hard non-conductive residues
Flux Percentage
M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and
wire drawing machines to manufacture consistent solder. The introduction of flux core in
the wire extrusion process involves constant monitoring of flux percentage to ensure
minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is
2.0-4.0%.
Flux Core
A unique flux system was specifically used for high temperature lead free alloys. It
provides the fluxing activity levels that promote fast wetting action and maximum
wetting spread. Utilizing synthetically refined resin and very effective activator that wets
and spreads like an RA type. This special activator exhibits virtually no spattering.
Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation
therefore the residues do not need to be removed for typical applications. If residue
removal is desired, please visit the following link for a list of Flux Removers:
http://www.mgchemicals.com/products/fluxrem.html
Specifications
Test Method
Cu content
Specification
0.3-0.7 %
http://www.mgchemicals.com/products/4901.html
4/28/2010
Lead Free Solder
Sn content
Flux Classification
Copper Mirror
Silver Chromate
Corrosion
SIR JSTD-004,Pattern Down
SIR Bellcore (Telecordia)
Electromigration
Post Reflow Flux Residue
Acid Value
Flux Residue Dryness
Spitting of Flux-Cored Solder
Solder Spread
JSTD-004
IPC-TM-650 2.3.32
IPC-TM-650 2.3.33
IPC-TM-650 2.6.15
IPC-TM-650 2.6.3.3
Bellcore GR-78-CORE 13.1.3
Bellcore GR-78-CORE 13.1.4
TGA Analysis
IPC-TM-650 2.3.13
IPC-TM-650 2.4.47
IPC-TM-650 2.4.48
IPC-TM-650 2.4.46
Balance
REL0
No removal of copper film
Pass
Pass
2.33 x 10
11
ohms
6.12 x 10
11
ohms
Pass
55%
190-210
Pass
0.3%
130 mm
2
Page 2 of 2
Lead free/leaded solder
comparison
Melting Point
Wire Diameter
Std. Wire Gauge
Tolerance, in.
Hardness, Brinell
Coefficient of Thermal Expansion
Tensile Strength
Density
Electrical Resistivity
Electrical Conductivity
Yield Strength, psi
Total Elongation,%
Joint Shear Strength, at 0.1mm/min
20ºC
Creep Strength, N/mm
2
at
0.1mm/min 20ºC
Creep Strength, N/mm
2
at
0.1mm/min 100 C
Lead Free Solder (Sn/Cu)
227º C (441º F)
0.032” (0.81 mm)
21
+/- 0.002”
9HB
Pure Sn=23.5
3190 psi
7.31 g/cc
10 - 15 µohm-cm
13 %IACS
2180
39
23
8.6
2.1
Sn63/Pb37 (Leaded Solder)
183 º C (361.4 º F)
0.032” (0.81 mm)
21
+/- 0.002”
14HB
24.7
4442 psi
8.42 g/cc
14.5 µohm-cm
11.9 %IACS
3950
48
14
3.3
1
Available Sizes
Catalog Number
4901-112G
4901-227G
4901-454G
4901-2LB
Sizes Available
1/4 lb (113 g)
1/2 lb (227 g)
1 lb (454 g)
2 lb (907 g)
Description
Spool
Spool
Spool
Bar
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4/28/2010
