4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4902P
Description
The 4902P
Sn42Bi57Ag1 Low Temperature Solder Paste
is made for low temperature applications. It
spreads and adheres well to a variety of materials and provides excellent soldering results and
appearance. This uniform paste dispenses evenly and resists solder beading and bright spots.
Applications & Usages
The solder paste is designed to is used for LEDs and telecommunication assemblies.
Benefits and Features
•
•
•
•
•
•
•
•
Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B for ROM1
Particle size Type 3 (with 80% min. between 25-45 µm)
No-clean
Excellent 12 mil (0.30 mm) fine pitch printing capability
Long operational life—non-slumping
Good wettability
Halogen free
C
OMPLIANCE
✓
Dobb-Frank (DRC
conflict free)
✓
REACH (compliant)
✓
RoHS (compliant)
Sn42Bi57Ag1 Alloy Typical Literature Properties
Physical Properties
Color
Density
Electrical Properties
Volume Resistivity
Electrical Conductivity
a)
Value
Silvery-white metal
8.6 g/cm
3
Value
34.5
Ωcm
4.5% IACS
a) International Annealed Copper Standard: 100% give 5.8 × 10
7
S/m.
Thermal Properties
Melting Point, Solidus
Melting Point, Liquidus
Tip Temperature Upper Limit
Value
138 °C [280 °F]
138 °C [280 °F]
Do not exceed 425 °C [800 °F]
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Date: 13 November 2017 / Ver. 1.02
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4902P
Solder Alloy Composition
Properties
MAIN INGREDIENTS
Sn
Bi
Ag
Value
41.5 to 42.5%
57.5 to 58.5%
0.9% to 1.1%
Properties
IMPURITIES
a)
Sb
In
Cu
Pb
Au
As
Fe
Ni
Al
Zn
Cd
J-STD-006C
≤0.20% Max
≤0.10% Max
≤0.08%
Max
≤0.07%
Max
≤0.03% Max
≤0.05%
Max
≤0.02% Max
≤0.01% Max
≤0.005% Max
≤0.003% Max
≤0.002% Max
a) Exceeds the requirements of J-STD-006C and meets ASTM B 32.
Particle Size
The powder distribution complies with the J-STD-005 Type 3 (with 80% min. between 25-45 µm) particle
sizes.
Storage and Shelf Life
Unopened Container 12 months from date of manufacture. Store syringes in an upright position with tip
down to prevent flux separation and air entrapment.
Bring the paste to room temperature prior to use. To warm the refrigerated paste, let the unopened
container stand for 4 hours at ambient temperature before use. For faster warm up, place the sealed
container in a water bath at ambient temperature for 30 minutes.
Optional—Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux
separation, and chemical activity.
Reusing Solder Paste
Reusing solder paste is not normally recommended because it typically generates more complications than
it is worth. If you do decide to reuse solder paste, keep the following pointers in mind:
•
•
•
Keep the paste tightly sealed and refrigerated when not in use.
Store syringes upright position with tip down to prevent flux separation and air entrapment.
Before reuse, check that the paste hasn’t separated or thickened relative to its usual state.
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Date: 13 November 2017 / Ver. 1.02
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4902P
Properties of Flux
Flux Properties
Flux Classification
Flux Type
Flux Activity
Halides %(wt)
Acid Value (mgKOH/g sample)
Copper Mirror
Electromigration @96 h
@596 h
Corrosion Test
Surface Insulation Resistance (SIR) @96 h
Surface Insulation Resistance (SIR) @168 h
Method
J-STD-004B
IPC-TM-650 2.3.28.1
IPC-TM-650 2.3.13
IPC-TM-650 2.3.32
IPC-TM-650 2.6.14.1
JIS Z 3284
IPC-TM-650 2.6.15
IPC-TM-650 2.6.3.7
JIS Z 3284
Value
ROM1
Rosin
Moderate
≤0.15%
142
No penetration
4 x 10
9
4 x 10
9
Pass
Minor corrosion
≥2
x 10
9
Ω
Pass
Paste Properties
Flux Content
Viscosity @10 rpm/min
Adhesive Force @8 h
Collapsibility
Method
IPC-TM-650
IPC-TM-650
IPC-TM-650
JIS Z 3284
IPC-TM-650
2.4.2.3
2.4.34.2
2.4.34.4
2.4.34.4
Value
11%
153 000 cP
139 gf
131 gf
Pass
Note:
The force in grams is denoted with the unit gf.
Pressure
The pressure applied in the syringe should be kept at a minimum, with a dispensing pressure of
0.05–0.06 MPa (7 to 9 lb/in
2
) and a dispensing frequency of 6 to a 120 times/min.
Solder Paste Application
Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the
paste enough time to reach thermal equilibrium with the environment. The flow rate of paste in a
dispensing application depends on viscosity, which can be altered by temperature change. If solder paste
is purchased in syringes, pre-mixing is not necessary due to the shear action produced from the
dispensing.
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Date: 13 November 2017 / Ver. 1.02
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4902P
Reflow
The following is a recommended profile for a forced air convection reflow process. The melting
temperature of the solder, the heat resistance of the components, and the characteristics of the PCB
(i.e. density, thickness, etc.) determine the actual reflow profile.
200
180
160
140
120
100
80
60
40
20
0
0
50
100
150
200
250
Peak Temperature 160–180
˚C
Temperature (˚C)
Reflow time
60–90 s
Soak Temp.
110–139
˚C
Preheat
≤1˚C/s
time (s)
The Preheat Zone,
which is also referred to as the ramp zone, is used to elevate the temperature of the
PCB to the desired soak temperature. In the preheat zone, the rate of temperature rise should not exceed
2.5 °C/s to avoid thermal chock stresses. The oven preheat zone normally occupies 25–33% of the heated
tunnel length.
The Soak Zone
normally occupies 33–50% of the heated tunnel length. It exposes the PCB to a relatively
stable temperature that allows the components of different mass to reach a uniform temperature. The
soak zone also allows the flux to concentrate and the volatiles to escape from the paste.
The Reflow Zone,
or spike zone, elevates the temperature of the PCB assembly from the activation
temperature to the recommended peak temperature. The activation temperature is always slightly below
the alloy melting point, while the peak temperature is always above its melting point.
Cleaning
The 4902P is a no clean formulation; therefore, the residues do not need to be removed for typical
applications. For spot residue removal, you may use MG 8241-T or 8241-W Isopropyl Alcohol Wipes.
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Date: 13 November 2017 / Ver. 1.02
4902P Technical Data Sheet
Sn42Bi57Ag1 Low Temperature Solder Paste
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4902P
Working Environment
Solder paste performs best when used in a controlled environment. Maintaining ambient temperature of
between 22–28 °C [72-82 °F] at a relative humidity of 40–60% will ensure consistent performance and
maximum life of paste. Do not let the print temperature exceed 32 °C [89 °F].
Cleaning Misprint Boards
In case of a misprinted board, the paste may be cleaned by hand using the MG 8241 Alcohol Wipes.
Stencil Cleaning
Periodic cleaning of the stencil during production is recommended to prevent unwanted deposits outside
the print areas. Insufficient stencil cleaning increases solder balling. After printing 5 to 10 boards, we
therefore recommend a dry wipe. And after every 15 to 25 boards, we recommend a wet wipe with MG
8241-T or 8241-W Alcohol Wipe. For fine pitch boards, the cleaning frequency generally needs to be
increased.
Disposal
The 4902P should be stored in a sealed container and disposed of in accordance with state & local
authority requirements.
Health and Safety
Please see the 4902P
Sn42Bi57Ag1 Low Temperature Solder Paste
Safety Data Sheet
(SDS) for more
details on transportation, storage, handling and other security guidelines.
Environmental Impact:
Very toxic to aquatic life with long lasting effects.
This product meets the European Directive
2011/65/EU Annex II (ROHS);
recasting 2002/95/EC.
Health and Safety:
This product may cause serious eye irritation. It is widely used in the packing and
food industry.
HMIS® RATING
HEALTH:
FLAMMABILITY:
PHYSICAL HAZARD:
PERSONAL PROTECTION:
Approximate HMIS and NFPA Risk Ratings Legend:
0 (Low or none); 1 (Slight); 2 (Moderate); 3 (Serious); 4 (Severe)
NFPA® 704 CODES
*
1
0
0
0
1
1
0
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