型号
- 型号
- 关键词
| 型号 | 54ACT283FMQB | 54ACT283DMQB | 54ACT283LMQB |
|---|---|---|---|
| 描述 | ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CDFP16, CERAMIC, FP-16 | ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CDIP16, CERAMIC, DIP-16 | ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CQCC20, CERAMIC, LCC-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | compliant | compliant | unknown |
| 其他特性 | FULL ADDER; INTERNAL CARRY LOOKAHEAD | FULL ADDER; INTERNAL CARRY LOOKAHEAD | FULL ADDER; INTERNAL CARRY LOOKAHEAD |
| 系列 | ACT | ACT | ACT |
| JESD-30 代码 | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 9.6645 mm | 19.43 mm | 8.89 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR |
| 位数 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | QCCN |
| 封装等效代码 | FL16,.3 | DIP16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V |
| 传播延迟（tpd） | 17 ns | 17 ns | 17 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B |
| 座面最大高度 | 2.032 mm | 5.08 mm | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6.604 mm | 7.62 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 |
| 湿度敏感等级 | 1 | 1 | - |