型号
- 型号
- 关键词
Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDFP16, CERPACK-16
厂商名称：Fairchild
厂商官网：http://www.fairchildsemi.com/
下载文档| 型号 | 54F158AFM | YTW-46-07-T-Q-120-050 | 54F158ADM | 54F158AFMQB | 54F158ADMQB | 54F158ALM |
|---|---|---|---|---|---|---|
| 描述 | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDFP16, CERPACK-16 | Board Stacking Connector, 184 Contact(s), 4 Row(s), Male, Straight, Solder Terminal, ROHS COMPLIANT | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDIP16, CERAMIC, DIP-16 | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDFP16, CERPACK-16 | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDIP16, CERAMIC, DIP-16 | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CQCC20, CERAMIC, LCC-20 |
| 包装说明 | DFP, | ROHS COMPLIANT | CERAMIC, DIP-16 | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown |
| 端子节距 | 1.27 mm | 2 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 零件包装代码 | DFP | - | DIP | DFP | DIP | QLCC |
| 针数 | 16 | - | 16 | 16 | 16 | 20 |
| 系列 | F/FAST | - | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-GDFP-F16 | - | R-GDIP-T16 | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 |
| 长度 | 9.6645 mm | - | 19.43 mm | 9.6645 mm | 19.43 mm | 8.89 mm |
| 逻辑集成电路类型 | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | - | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | - | 2 | 2 | 2 | 2 |
| 输出次数 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | INVERTED | - | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | - | DIP | DFP | DIP | QCCN |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | - | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER |
| 传播延迟（tpd） | 8 ns | - | 8 ns | 8 ns | 8 ns | 8 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.032 mm | - | 5.08 mm | 2.032 mm | 5.08 mm | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | NO | YES | NO | YES |
| 技术 | TTL | - | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | - | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 6.604 mm | - | 7.62 mm | 6.604 mm | 7.62 mm | 8.89 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 | - |
| 是否无铅 | - | 不含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | - | 符合 | 不符合 | 不符合 | 不符合 | - |
| JESD-609代码 | - | e3 | e0 | e0 | e0 | - |
