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54F823LMQB

IC F/FAST SERIES, 9-BIT DRIVER, TRUE OUTPUT, CQCC28, CERAMIC, LCC-28, Bus Driver/Transceiver

器件类别:逻辑    逻辑   

厂商名称:National Semiconductor(TI )

厂商官网:http://www.ti.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
包装说明
QCCN, LCC28,.45SQ
Reach Compliance Code
unknown
ECCN代码
3A001.A.2.C
其他特性
WITH CLEAR AND CLOCK ENABLE
系列
F/FAST
JESD-30 代码
S-CQCC-N28
JESD-609代码
e0
长度
11.43 mm
负载电容(CL)
50 pF
逻辑集成电路类型
BUS DRIVER
最大频率@ Nom-Sup
60000000 Hz
最大I(ol)
0.02 A
位数
9
功能数量
1
端口数量
2
端子数量
28
最高工作温度
125 °C
最低工作温度
-55 °C
输出特性
3-STATE
输出极性
TRUE
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
QCCN
封装等效代码
LCC28,.45SQ
封装形状
SQUARE
封装形式
CHIP CARRIER
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
5 V
最大电源电流(ICC)
100 mA
Prop。Delay @ Nom-Sup
10.5 ns
传播延迟(tpd)
10.5 ns
认证状态
Not Qualified
筛选级别
MIL-STD-883 Class B
座面最大高度
1.905 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
TTL
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
NO LEAD
端子节距
2.54 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
触发器类型
POSITIVE EDGE
宽度
11.43 mm
Base Number Matches
1
文档预览
54F 74F823 9-Bit D-Type Flip-Flop
December 1994
54F 74F823
9-Bit D-Type Flip-Flop
General Description
The ’F823 is a 9-bit buffered register It features Clock En-
able and Clear which are ideal for parity bus interfacing in
high performance microprogramming systems
The ’F823 is functionally and pin compatible with AMD’s
Am29823
Features
Y
Y
Y
TRI-STATE outputs
Clock Enable and Clear
Direct replacement for AMD’s Am29823
Commercial
74F823SPC
Military
Package
Number
N24C
Package Description
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Ceramic Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead Cerpack
24-Lead Ceramic Chip Carrier Type C
54F823SDM (Note 2)
74F823SC (Note 1)
54F823FM (Note 2)
54F823LM (Note 2)
Note 1
Devices also available in 13 reel Use suffix
e
SCX
J24F
M24B
W24C
E28A
Note 2
Military grade device with environmental and burn-in processing Use suffix
e
SDMQB FMQB and LMQB
Logic Symbols
Connection Diagrams
Pin Assignment for
DIP SOIC and Flatpak
Pin Assignment
for LCC
TL F 9596–2
IEEE IEC
TL F 9596 – 4
TL F 9596 – 3
TL F 9596–1
TRI-STATE is a registered trademark of National Semiconductor Corporation
C
1995 National Semiconductor Corporation
TL F 9596
RRD-B30M75 Printed in U S A
Unit Loading Fan Out
54F 74F
Pin Names
Description
UL
HIGH LOW
10 10
10 10
10 10
10 20
10 10
150 40 (33 3)
Input I
IH
I
IL
Output I
OH
I
OL
20
mA
b
0 6 mA
20
mA
b
0 6 mA
20
mA
b
0 6 mA
20
mA
b
1 2 mA
20
mA
b
0 6 mA
b
3 mA 24 mA (20 mA)
D
0
–D
8
OE
CLR
CP
EN
O
0
– O
8
Data Inputs
Output Enable Input
Clear
Clock Input
Clock Enable
TRI-STATE Outputs
2
Functional Description
The ’F823 device consists of nine D-type edge-triggered
flip-flops It has TRI-STATE true outputs and is organized in
broadside pinning The buffered Clock (CP) and buffered
Output Enable (OE) are common to all flip-flops The flip-
flops will store the state of their individual D inputs that meet
the setup and hold times requirements on the LOW-to-HIGH
CP transition With the OE LOW the contents of the flip-
flops are available at the outputs When the OE is HIGH the
outputs go to the high impedance state Operation of the
OE input does not affect the state of the flip-flops In addi-
tion to the Clock and Output Enable pins the ’F823 has
Clear (CLR) and Clock Enable (EN) pins
When the CLR is LOW and the OE is LOW the outputs are
LOW When CLR is HIGH data can be entered into the flip-
flops When EN is LOW data on the inputs is transferred to
the outputs on the LOW to HIGH clock transition When the
EN is HIGH the outputs do not change state regardless of
the data or clock inputs transitions This device is ideal for
parity bus interfacing in high performance systems
Function Table
Inputs
OE
H
H
H
L
H
L
H
H
L
L
L
L
CLR
H
H
H
H
L
L
H
H
H
H
H
H
EN
L
L
H
H
X
X
L
L
L
L
L
L
CP
H
L
X
X
X
X
L
L
L
L
H
L
D
X
X
X
X
X
X
H
H
L
H
X
X
Internal
Q
NC
NC
NC
NC
H
H
H
L
H
L
NC
NC
Output
O
Z
Z
Z
NC
Z
L
Z
Z
L
H
NC
NC
Hold
Hold
Hold
Hold
Clear
Clear
Load
Load
Data Available
Data Available
No Change in Data
No Change in Data
Function
L
e
LOW Voltage Level
H
e
HIGH Voltage Level
X
e
Immaterial
Z
e
High Impedance
L
e
LOW-to-HIGH Transition
NC
e
No Change
Logic Diagram
TL F 9596 – 5
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays
3
Absolute Maximum Ratings
(Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Storage Temperature
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
V
CC
Pin Potential to
Ground Pin
b
65 C to
a
150 C
b
55 C to
a
125 C
b
55 C to
a
175 C
b
55 C to
a
150 C
b
0 5V to
a
7 0V
Note 1
Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired Functional operation under
these conditions is not implied
Note 2
Either voltage limit or current limit is sufficient to protect inputs
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
Supply Voltage
Military
Commercial
b
55 C to
a
125 C
0 C to
a
70 C
a
4 5V to
a
5 5V
a
4 5V to
a
5 5V
b
0 5V to
a
7 0V
Input Voltage (Note 2)
b
30 mA to
a
5 0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
b
0 5V to V
CC
Standard Output
b
0 5V to
a
5 5V
TRI-STATE Output
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
DC Electrical Characteristics
Symbol
V
IH
V
IL
V
CD
V
OH
Output HIGH
Voltage
Parameter
Min
Input HIGH Voltage
Input LOW Voltage
Input Clamp Diode Voltage
54F 10% V
CC
54F 10% V
CC
74F 10% V
CC
74F 10% V
CC
74F 5% V
CC
74F 5% V
CC
54F 10% V
CC
74F 10% V
CC
54F
74F
54F
74F
54F
74F
74F
74F
4 75
3 75
b
0 6
b
1 2
54F 74F
Typ
Max
Units
V
08
b
1 2
V
CC
Conditions
Recognized as a HIGH Signal
Recognized as a LOW Signal
20
V
V
Min
I
IN
e b
18 mA
I
OH
I
OH
I
OH
I
OH
I
OH
I
OH
e
e
e
e
e
e
b
1 mA
b
3 mA
b
1 mA
b
3 mA
b
1 mA
b
3 mA
25
24
25
24
27
27
05
05
20 0
50
100
70
250
50
V
Min
V
OL
I
IH
I
BVI
I
CEX
V
ID
I
OD
I
IL
I
OZH
I
OZL
I
OS
I
ZZ
I
CCZ
Output LOW
Voltage
Input HIGH
Current
Input HIGH Current
Breakdown Test
Output HIGH
Leakage Current
Input Leakage
Test
Output Leakage
Circuit Current
Input LOW
Current
V
mA
mA
mA
V
mA
mA
mA
mA
mA
mA
mA
mA
Min
Max
Max
Max
00
00
Max
Max
Max
Max
Max
0 0V
Max
I
OL
e
20 mA
I
OL
e
24 mA
V
IN
e
2 7V
V
IN
e
7 0V
V
OUT
e
V
CC
I
ID
e
1 9
mA
All Other Pins Grounded
V
IOD
e
150 mV
All Other Pins Grounded
V
IN
e
0 5V (OE CLR EN)
V
IN
e
0 5V (CP)
V
OUT
e
2 7V
V
OUT
e
0 5V
V
OUT
e
0V
V
OUT
e
5 25V
V
O
e
HIGH Z
Output Leakage Current
Output Leakage Current
Output Short-Circuit Current
Buss Drainage Test
Power Supply Current
75
b
60
50
b
50
b
150
500
100
4
AC Electrical Characteristics
74F
Symbol
Parameter
Min
f
max
t
PLH
t
PHL
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
Maximum Clock Frequency
Propagation Delay
CP to O
n
Propagation Delay
CLR to O
n
Output Enable Time
OE to O
n
Output Disable Time
OE to O
n
100
20
20
40
20
20
15
15
T
A
e a
25 C
V
CC
e a
5 0V
C
L
e
50 pF
Typ
160
56
52
71
58
55
29
27
95
95
12 0
10 5
10 5
70
70
Max
54F
T
A
V
CC
e
Mil
C
L
e
50 pF
Min
60
20
20
40
20
20
10
10
10 5
10 5
13 0
13 0
13 0
75
75
Max
74F
T
A
V
CC
e
Com
C
L
e
50 pF
Min
70
20
20
40
20
20
15
15
10 5
10 5
13 0
11 5
11 5
75
75
Max
MHz
ns
ns
Units
ns
AC Operating Requirements
74F
Symbol
Parameter
T
A
e a
25 C
V
CC
e a
5 0V
Min
t
s
(H)
t
s
(L)
t
h
(H)
t
h
(L)
t
s
(H)
t
s
(L)
t
h
(H)
t
h
(L)
t
w
(H)
t
w
(L)
t
w
(L)
t
rec
Setup Time HIGH or LOW
D
n
to CP
Hold Time HIGH or LOW
D
n
to CP
Setup Time HIGH or LOW
EN to CP
Hold Time HIGH or LOW
EN to CP
CP Pulse Width
HIGH or LOW
CLR Pulse Width LOW
CLR Recovery Time
25
25
25
25
45
25
20
0
50
50
50
50
Max
54F
T
A
V
CC
e
Mil
Min
40
40
25
25
50
30
30
10
60
60
50
50
Max
74F
T
A
V
CC
e
Com
Min
30
30
25
25
50
30
20
0
60
60
50
50
ns
ns
ns
Max
Units
ns
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
Temperature Range Family
74F
e
Commercial
54F
e
Military
Device Type
Package Code
SP
e
Slim Plastic DIP
SD
e
Slim Ceramic DIP
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline (SOIC)
823
S
C
X
Special Variations
QB
e
Military grade device with
environmental and burn-in
processing
Temperature Range
C
e
Commercial (0 C to
a
70 C)
M
e
Military (
b
55 C to
a
125 C)
5
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