型号
- 型号
- 关键词
NAND Gate, LS Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14
厂商官网：https://www.rocelec.com/
下载文档| 型号 | 54LS00DMQB | 54LS00FMQB | 54LS00LMQB |
|---|---|---|---|
| 描述 | NAND Gate, LS Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, LS Series, 4-Func, 2-Input, TTL, CDFP14, CERAMIC, FP-14 | NAND Gate, LS Series, 4-Func, 2-Input, TTL, CQCC14, CERAMIC, LCC-14 |
| 零件包装代码 | DIP | DFP | LCC |
| 包装说明 | DIP, | DFP, | QCCN, |
| 针数 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown |
| 系列 | LS | LS | LS |
| JESD-30 代码 | R-GDIP-T14 | R-GDFP-F14 | S-CQCC-N14 |
| 长度 | 19.43 mm | 9.5885 mm | 8.89 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER |
| 传播延迟（tpd） | 15 ns | 15 ns | 15 ns |
| 座面最大高度 | 5.08 mm | 2.032 mm | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES |
| 技术 | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | 6.2865 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 |