Wire Wound Chip Inductors
Features
1. Coil body of ceramic material.
2. Rugged inductance even in high frequencies.
3. Tight tolerances.
4 .Low DC resistance.
5. Operating temperature range –40°C to +85°C.
6. Lead Free (RoHS Compliance).
PAGE
1/3
——E-Series
0603C(1608)/5526
Applications
1. Antenna amplifier.
2. Mobile phones (GSM etc.)
3. Global Positioning Systems (GPS)
4. Digital cameras.
5. HDD (Hard Disk Drivers) etc.
Ordering Information
5526
(1)
270
(2)
*
(3)
452
(1) Series
- 5526 Size 0603C(1608), Ceramic body
(3) Inductance Tolerance
2 : ±10%
3 : ±5%
4 : ±2%
(2) Inductance Value
example: 27x10
X
=27x10
0
=27(nH)
Shape and Dimensions (mm)
Pad Layout Recommendation
Electrode: AgPd/Ni/Sn
*All specifications are subject to change without notice.
Wire Wound Chip Inductors
Electrical Parameters
L
[nH]
5526 016 *4 52
5526 018 *4 52
5526 033 *4 52
5526 036 *4 52
5526 039 *4 52
5526 043 *4 52
5526 047 *4 52
5526 051 *4 52
5526 056 *4 52
5526 068 *4 52
5526 075 *4 52
5526 082 *4 52
5526 087 *4 52
5526 095 *4 52
5526 100 *4 52
5526 110 *4 52
5526 120 *4 52
5526 150 *4 52
5526 160 *4 52
5526 180 *4 52
5526 220 *4 52
5526 240 *4 52
5526 270 *4 52
5526 300 *4 52
5526 330 *4 52
5526 360 *4 52
5526 390 *4 52
5526 430 *4 52
5526 470 *4 52
5526 560 *4 52
5526 680 *4 52
5526 720 *4 52
5526 820 *4 52
5526 101 *4 52
5526 111 *4 52
5526 121 *4 52
5526 151 *4 52
5526 181 *4 52
5526 221 *4 52
5526 271 *4 52
5526 331 *4 52
5526 391 *4 52
1,6
1,8
3,3
3,6
3,9
4,3
4,7
5,1
5,6
6,8
7,5
8,2
8,7
9,5
10,0
11,0
12,0
15,0
16,0
18,0
22,0
24,0
27,0
30,0
33,0
36,0
39,0
43,0
47,0
56,0
68,0
72,0
82,0
100,0
110,0
120,0
150,0
180,0
220,0
270,0
330,0
390,0
24,0
16,0
25,0
22,0
22,0
22,0
20,0
20,0
25,0
27,0
28,0
28,0
28,0
28,0
31,0
33,0
35,0
35,0
34,0
35,0
38,0
37,0
40,0
37,0
38,0
38,0
40,0
39,0
38,0
38,0
37,0
34,0
34,0
34,0
32,0
32,0
28,0
25,0
25,0
24,0
25,0
25,0
PAGE
2/3
——E-Series
0603C(1608)/5526
Order No.
Q
min
f
L, Q
[MHz]
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
150
150
150
150
150
150
100
100
100
100
100
Q
typ.
@ 900 MHz
38
42
62
53
59
62
57
49
71
70
65
68
72
73
74
78
82
81
84
80
84
81
82
83
72
77
73
78
65
66
58
64
58
52
54
52
39
38
38
31
27
19
f
res, min
[MHz]
12500
12500
10000
5900
6900
5900
5800
5700
6000
5800
4800
4600
4600
5400
4800
4000
4000
4000
3300
3100
3000
2650
2800
2250
2300
2080
2200
2000
2000
1900
1700
1700
1700
1400
1350
1300
990
990
900
900
800
700
R
DC, max
[Ω]
0,030
0,045
0,050
0,063
0,080
0,063
0,130
0,140
0,100
0,110
0,106
0,110
0,109
0,135
0,130
0,107
0,130
0,170
0,134
0,170
0,190
0,190
0,220
0,187
0,260
0,250
0,250
0,280
0,280
0,340
0,340
0,490
0,540
0,580
0,720
0,720
0,920
1,650
2,100
2,300
4,300
5,700
I
DC, max
[mA]
700
700
700
700
700
700
700
700
700
700
700
700
700
700
700
700
700
700
700
700
700
700
600
600
600
600
600
600
600
600
600
400
400
400
300
300
280
240
200
170
140
130
Tol.
[%]
5/10
5/10
5/10
5/10
5/10
5/10
5/10
5/10
5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
5/10
2/5/10
2/5/10
2/5/10
2/5/10
5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
2/5/10
※
Packing Unit: 3,000 pcs. each
*All specifications are subject to change without notice.
Wire Wound Chip Inductors
Electrical Characteristic Curves
Typical Q vs Frequency
160
140
120
100
Q Factor
80
60
40
20
0
1
Typical L vs Frequency
260
240
220
200
180
160
140
120
100
80
60
40
20
0
1
10
100
Frequency (MHz)
1000
10000
120.0nH
68.0nH
33.0nH
22.0nH
3.9nH
PAGE
3/3
——E-Series
0603C(1608)/5526
Inductance (nH)
120.0nH
68.0nH
33.0nH
22.0nH
3.9nH
10
100
Frequency (MHz)
1000
10000
Test Equipment
Inductance and Quality Factor
RF LCR Meter:
Test Fixture:
Agilent 4287 A
Agilent 16193 A or equivalent
Resonant Frequency
Network Analyzer:
R
DC
Measured at 25 °C ambient temperature
Digital Multimeter:
Agilent 34420A or equivalent
Agilent 8720 ES or equivalent
Max. Permissible Direct Current:At 25 °C ambient temperature permissible temperature rise:20 K
*All specifications are subject to change without notice.
嵌入式系统
