型号
- 型号
- 关键词
Board to Board & Mezzanine Connectors 200P 6.0MM HT RECP 15 GOLD W/CAP
器件类别：连接器
厂商名称：FCI / Amphenol
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| 型号 | 55724-001 | 55724-201 | 55724-101LF | 55724-101 |
|---|---|---|---|---|
| 描述 | Board to Board & Mezzanine Connectors 200P 6.0MM HT RECP 15 GOLD W/CAP | Board to Board & Mezzanine Connectors MEG-ARRAY 200P RECP 6MM TELCORDIA CAP | Board to Board & Mezzanine Connectors 200P PLUG | Board to Board & Mezzanine Connectors MEG-ARRAY CENTERLINE RECEPT |
| Product Attribute | Attribute Value | Attribute Value | Attribute Value | Attribute Value |
| 制造商 Manufacturer |
FCI / Amphenol | FCI / Amphenol | FCI / Amphenol | FCI / Amphenol |
| 产品种类 Product Category |
Board to Board & Mezzanine Connectors | Board to Board & Mezzanine Connectors | Board to Board & Mezzanine Connectors | Board to Board & Mezzanine Connectors |
| 产品 Product |
Receptacles | Receptacles | Receptacles | Receptacles |
| 位置数量 Number of Positions |
200 Position | 200 Position | 200 Position | 200 Position |
| 电流额定值 Current Rating |
450 mA | 450 mA | 450 mA | 450 mA |
| 电压额定值 Voltage Rating |
200 V | 200 V | 200 V | 200 V |
| 主体材料 Contact Plating |
Gold | Gold | Gold | Gold |
| 外壳材料 Housing Material |
Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) |
| 触点材料 Contact Material |
Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy |
| 绝缘电阻 Insulation Resistance |
1000 MOhms | 1000 MOhms | 1000 MOhms | 1000 MOhms |
| 最大工作温度 Maximum Operating Temperature |
+ 85 C | + 85 C | + 85 C | + 85 C |
| 最小工作温度 Minimum Operating Temperature |
- 40 C | - 40 C | - 40 C | - 40 C |
| Stack Height | 12 mm | 12 mm | 12 mm | 6 mm |
| 工厂包装数量 Factory Pack Quantity |
200 | 200 | 200 | 200 |
| RoHS | No -; RoHS Version Available | No -; RoHS Version Available | Details | - |
| 节距 Pitch |
1.27 mm | 1.27 mm | - | 1.27 mm |
| 系列 Packaging |
Reel | Reel | Reel | Reel |
