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55755-101LF

Board to Board & Mezzanine Connectors 200 POS RECEPTACLE .76 GOLD

器件类别:连接器   

厂商名称:FCI / Amphenol

器件标准:

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器件:55755-101LF

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
FCI / Amphenol
产品种类
Product Category
Board to Board & Mezzanine Connectors
RoHS
Details
产品
Product
Receptacles
位置数量
Number of Positions
240 Position
电流额定值
Current Rating
450 mA
电压额定值
Voltage Rating
200 V
系列
Packaging
Cut Tape
系列
Packaging
Reel
主体材料
Contact Plating
Gold
外壳材料
Housing Material
Liquid Crystal Polymer (LCP)
触点材料
Contact Material
Copper Alloy
绝缘电阻
Insulation Resistance
1000 MOhms
最大工作温度
Maximum Operating Temperature
+ 85 C
最小工作温度
Minimum Operating Temperature
- 40 C
Stack Height
6 mm
工厂包装数量
Factory Pack Quantity
200
文档预览
PDS: Rev :H
STATUS:Released
Printed: May 24, 2013
PDS: Rev :H
STATUS:Released
Printed: May 24, 2013
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参数对比
与55755-101LF相近的元器件有:55755-191LF、55755-201LF、55755-001LF、55755-191。描述及对比如下:
型号 55755-101LF 55755-191LF 55755-201LF 55755-001LF 55755-191
描述 Board to Board & Mezzanine Connectors 200 POS RECEPTACLE .76 GOLD Board to Board & Mezzanine Connectors 240P RCPT 6MM W/CAP Board to Board & Mezzanine Connectors MEG ARRAY Board to Board & Mezzanine Connectors 200 POS RECEPTACLE .38 GOLD Board to Board & Mezzanine Connectors 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value
制造商
Manufacturer
FCI / Amphenol FCI / Amphenol FCI / Amphenol FCI / Amphenol FCI / Amphenol
产品种类
Product Category
Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors
工厂包装数量
Factory Pack Quantity
200 200 200 200 200
产品
Product
Receptacles - Receptacles Receptacles -
位置数量
Number of Positions
240 Position - 240 Position 240 Position -
电流额定值
Current Rating
450 mA - 450 mA 450 mA -
电压额定值
Voltage Rating
200 V - 200 V 200 V -
系列
Packaging
Reel Reel Reel Reel Reel
主体材料
Contact Plating
Gold - Gold Gold -
外壳材料
Housing Material
Liquid Crystal Polymer (LCP) - Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP) -
触点材料
Contact Material
Copper Alloy - Copper Alloy Copper Alloy -
绝缘电阻
Insulation Resistance
1000 MOhms - 1000 MOhms 1000 MOhms -
最大工作温度
Maximum Operating Temperature
+ 85 C - + 85 C + 85 C -
最小工作温度
Minimum Operating Temperature
- 40 C - - 40 C - 40 C -
Stack Height 6 mm - 6 mm 6 mm -
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