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593326-2

26 CONTACT(S), MALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE, ROHS COMPLIANT

器件类别:连接器    连接器   

厂商名称:TE Connectivity(泰科)

厂商官网:http://www.te.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
TE Connectivity(泰科)
包装说明
ROHS COMPLIANT
Reach Compliance Code
unknown
主体/外壳类型
RECEPTACLE
连接器类型
D SUBMINIATURE CONNECTOR
联系完成配合
NOT SPECIFIED
触点性别
MALE
触点材料
NOT SPECIFIED
DIN 符合性
NO
空壳
NO
滤波功能
NO
IEC 符合性
NO
MIL 符合性
NO
制造商序列号
593326
混合触点
NO
安装类型
BOARD AND PANEL
选件
GENERAL PURPOSE
外壳面层
GOLD
外壳材料
BRASS
外壳尺寸
2/A
端接类型
SOLDER
触点总数
26
Base Number Matches
1
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593326-2 Product Details
Subm iniature D Pin/Socket Connectors f or MIL-C -24308 and MIL-C-39029
Alway s EU Ro HS/ELV Co mplian t
(
Statemen t o f Comp lian ce
)
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Product Highlights:
Connector
Product Series = 90
Density = Standard
Term inate To Printed Circuit Board
Number of Positions = 26
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593326-2
T E Par t Nu m be r: 5 93 32 6-2
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Documentation & A dditional Information
Product Drawings:
None Available
Catalog Pages/Data Sheets:
None Available
Product Specifications:
None Available
Application Specifications:
None Available
Instruction Sheets:
None Available
CAD Files:
None Available
Additional Information:
Product Line Inform ation
Related Products:
Tooling
Product Features
(Please use the Product Drawing f or all design activity)
Product Type Features:
Product Ty pe
= Connector
Product Series
= 90
Number of Positions
= 26
Gender
= Plug
PCB Mount Angle
= Right Angle
Shell Size
= 2
Shell Material
= Brass
Comm ent = Customer marking on front shell: (1BO B-003)
Industry Standards:
Termination Related Features:
Term ination (Solder) Post Length (mm [in])
= 3.81 [0.150]
Body Related Features:
Insert Arrangement
= MS18274-2
Blindm ate
= No
Non-Magnetic
= No
Pins
= With
Rear Grom met
= No
Power/Signal/Coax Combination
= No
Shell Plating
= Gold over Copper
Post Diameter (m m [in])
= 0.51 [0.020]
Mount Sty le = Mounting Holes
Other:
Brand = AMP
Conditions for Usage:
Term inate To = Printed Circuit Board
Government/Industry Qualification = No
RoHS/ELV Compliance
= RoHS compliant, ELV com pliant
Lead Free Solder Processes
= Wave solder capable to 240C, Wave solder capable to 260C, Wave
solder capable to 265C
RoHS/ELV Compliance History = Alw ay s was RoHS compliant
NASA Qualification = No
Configuration Related Features:
Density
= Standard
Contact Related Features:
Contact Sty le
= Posted
Contact Material = Copper Alloy
Contact Mating Area Plating Material = G old over Copper
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