ATMEL - ATF750C-10JU - IC; CPLD; EEPROM; 10 MACROCELL; 10NS; PLCC-28
ATMEL - ATF750C-10JU - IC; CPLD; 电可擦除只读存储器; 10 MACROCELL; 10NS; PLCC-28
厂商名称:Atmel (Microchip)
下载文档型号 | 5962-0720102MLA | 5962-0720101M3A | 5962-0720102M3A | ATF750C-10JU | ATF750C-10XU | ATF750C-15NM/883 |
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描述 | ATMEL - ATF750C-10JU - IC; CPLD; EEPROM; 10 MACROCELL; 10NS; PLCC-28 | ATMEL - ATF750C-10JU - IC; CPLD; EEPROM; 10 MACROCELL; 10NS; PLCC-28 | ATMEL - ATF750C-10JU - IC; CPLD; EEPROM; 10 MACROCELL; 10NS; PLCC-28 | ATMEL - ATF750C-10JU - IC; CPLD; EEPROM; 10 MACROCELL; 10NS; PLCC-28 | ATMEL - ATF750C-10JU - IC; CPLD; EEPROM; 10 MACROCELL; 10NS; PLCC-28 | ATMEL - ATF750C-10JU - IC; CPLD; EEPROM; 10 MACROCELL; 10NS; PLCC-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 |
零件包装代码 | DIP | QLCC | QLCC | LCC | TSSOP | QLCC |
包装说明 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | QCCJ, LDCC28,.5SQ | TSSOP, TSSOP24,.25 | QCCN, LCC28,.45SQ |
针数 | 24 | 28 | 28 | 28 | 24 | 28 |
Reach Compliance Code | compli | compli | compli | unknown | compli | compli |
其他特性 | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 55 MHz | 83 MHz | 55 MHz | 83 MHz | 83 MHz | 55 MHz |
系统内可编程 | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | S-PQCC-J28 | R-PDSO-G24 | S-CQCC-N28 |
JTAG BST | NO | NO | NO | NO | NO | NO |
长度 | 32 mm | 11.43 mm | 11.43 mm | 11.5062 mm | 7.8 mm | 11.43 mm |
专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 |
I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 |
宏单元数 | 10 | 10 | 10 | 10 | 10 | 10 |
端子数量 | 24 | 28 | 28 | 28 | 24 | 28 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C |
组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | QCCN | QCCN | QCCJ | TSSOP | QCCN |
封装等效代码 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | LDCC28,.5SQ | TSSOP24,.25 | LCC28,.45SQ |
封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 15 ns | 10 ns | 15 ns | 10 ns | 10 ns | 15 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 2.54 mm | 2.54 mm | 4.572 mm | 1.2 mm | 2.54 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | J BEND | GULL WING | NO LEAD |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm |
端子位置 | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD |
宽度 | 7.62 mm | 11.43 mm | 11.43 mm | 11.5062 mm | 4.4 mm | 11.43 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | - | 3A001.A.2.C |
JESD-609代码 | e0 | e0 | e0 | e3 | - | e0 |
筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - | - | MIL-STD-883 |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) |