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5962-0824203KTA

High Speed Optocouplers 10MBd 2CH 1500Vdc Hermetically sealed

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厂商名称:Broadcom(博通)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Broadcom(博通)
包装说明
DIP-16
Reach Compliance Code
unknown
ECCN代码
EAR99
其他特性
TTL COMPATIBLE
配置
SEPARATE, 2 CHANNELS
标称数据速率
10 MBps
最大正向电流
0.02 A
最大绝缘电压
1500 V
JESD-609代码
e0
安装特点
SURFACE MOUNT
元件数量
2
最大通态电流
0.025 A
最高工作温度
125 °C
最低工作温度
-55 °C
光电设备类型
LOGIC IC OUTPUT OPTOCOUPLER
最大功率耗散
0.2 W
标称响应时间
1.4e-7 ns
最小供电电压
3 V
标称供电电压
3.6 V
表面贴装
YES
端子面层
Tin/Lead (Sn/Pb)
Base Number Matches
1
文档预览
Data Sheet
ACPL-267xL, ACPL-268KL, ACPL-560xL,
ACPL-563xL, ACPL-665xL, and 5962-08242
1
Hermetically Sealed, 3.3V High-Speed,
High CMR, Logic Gate Optocouplers
Description
The Broadcom
®
ACPL-267xL, ACPL-268KL, ACPL-560xL,
ACPL-563xL, ACPL-665xL, and 5962-08242 units are
single, dual, and quad channel, hermetically sealed
optocouplers. The products are capable of operation and
storage over the full military temperature range and can be
purchased as either standard commercial product or with
full MIL-PRF-38534 Class Level H or K testing or from DLA
Standard Microcircuit Drawing (SMD) 5962-08242. All
devices are manufactured and tested on a MIL-PRF-38534
certified line and are included in the DLA Qualified
Manufacturers List QML-38534 for Hybrid Microcircuits.
Features
Low power consumption
3.3V supply voltages
Dual marked with device part number and DLA
Standard Microcircuit Drawing (SMD)
Manufactured and tested on a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Four hermetically sealed package configurations
Performance guaranteed over full military temperature
range: –55°C to +125°C
High speed: 10 Mbd typical
CMR: >10,000 V/μs typical
1500 Vdc withstand test voltage
TTL circuit compatibility
HCPL-260L/060L/263L/063L function compatibility
Applications
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
Military and aerospace
High reliability systems
Transportation, medical, and life critical systems
Line receiver
Voltage level shifting
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Isolation for computer, communication, and test
equipment systems
1. See
Selection Guide – Package Styles and Lead
Configuration Options
for available extensions.
Broadcom
AV02-1327EN
February 7, 2018
ACPL-267xL, ACPL-268KL, ACPL-560xL, ACPL-563xL, ACPL-665xL, and
5962-08242
Data Sheet
Hermetically Sealed, 3.3V High-Speed,
High CMR, Logic Gate Optocouplers
Functional Diagram
Multiple channel devices available.
V
CC
V
E
V
OUT
GND
NOTE:
An external 0.01-μF to 0.1-μF bypass capacitor
must be connected as close as possible between
pin V
CC
and GND.
Each channel contains a GaAsP light emitting diode that is
optically coupled to an integrated high-speed photon
detector. The output of the detector is an open collector
Schottky clamped transistor. Internal shields provide a
guaranteed common mode transient immunity specification
of 1000 V/µs. Package styles for these parts are 8- and 16-
pin DIP through hole (case outlines P and E respectively),
and 16-pin surface mount DIP flat pack (case outline F).
Devices may be purchased with a variety of lead bend and
plating options. See
Selection Guide – Package Styles and
Lead Configuration Options
for details. Standard
Microcircuit Drawing (SMD) parts are available for each
package and lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this data
sheet, absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are identical for all parts.
Occasional exceptions exist due to package variations and
limitations, and are as noted. Additionally, the same
package assembly processes and materials are used in all
devices.
Truth Tables
(Positive Logic)
Multichannel Devices
Input
On (H)
Off (L)
Output
L
H
Single-Channel DIP
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
L
H
H
H
Broadcom
AV02-1327EN
2
ACPL-267xL, ACPL-268KL, ACPL-560xL, ACPL-563xL, ACPL-665xL, and
5962-08242
Data Sheet
Hermetically Sealed, 3.3V High-Speed,
High CMR, Logic Gate Optocouplers
Selection Guide – Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Withstand Test Voltage
Part Number and Options
Standard Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Gull Wing/Soldered
b
Class H SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
Class K SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
5962-
0824203KEC
0824203KEA
0824203KUC
0824203KUA
0824203KTA
5962-
0824201KPC
0824201KPA
0824201KYC
0824201KYA
0824201KXA
5962-
0824202KPC
0824202KPA
0824202KYC
0824202KYA
0824202KXA
5962-
0824203HEC
0824203HEA
0824203HUC
0824203HUA
0824203HTA
5962-
0824201HPC
0824201HPA
0824201HYC
0824201HYA
0824201HXA
5962-
0824202HPC
0824202HPA
0824202HYC
0824202HYA
0824202HXA
ACPL-2670L
ACPL-2672L
ACPL-268KL
Gold Plate
Option -200
Option -100
Option -300
ACPL-5600L
ACPL-5601L
ACPL-560KL
Gold Plate
Option -200
Option -100
Option -300
ACPL-5630L
ACPL-5631L
ACPL-563KL
Gold Plate
Option -200
Option -100
Option -300
ACPL-6650L
ACPL-6651L
ACPL-665KL
Gold Plate
2
VCC, GND
1500 Vdc
16-Pin DIP
Through Hole
1
None
1500 Vdc
8-Pin DIP
Through Hole
2
VCC, GND
1500 Vdc
8-Pin DIP
Through Hole
4
VCC, GND
1500 Vdc
16-Pin Flat Pack
Unformed leads
a. Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches.
b. Solder lead finish: Sn63/Pb37.
Broadcom
AV02-1327EN
3
ACPL-267xL, ACPL-268KL, ACPL-560xL, ACPL-563xL, ACPL-665xL, and
5962-08242
Data Sheet
Hermetically Sealed, 3.3V High-Speed,
High CMR, Logic Gate Optocouplers
Functional Diagrams
16-Pin DIP
Through Hole
2 Channels
1
2
3
4
5
6
7
8
GND
V
O2
V
CC
V
O1
16
15
14
13
12
11
10
9
4
GND
5
8-Pin DIP
Through Hole
1 Channel
1
2
3
V
CC
V
E
V
OUT
6
8
7
8-Pin DIP
Through Hole
2 Channels
1
2
3
4
V
CC
V
O1
V
O2
16-Pin Flat Pack
Unformed Leads
4 Channels
8
7
6
5
1
2
3
4
5
6
7
8
V
CC
V
O1
V
O2
V
O3
V
O4
GND
16
15
14
13
12
11
10
9
GND
NOTE:
All DIP and flat pack devices have common V
CC
and ground. Single-channel DIP has an enable pin 7.
Device Marking
Avago LOGO
Avago P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
* 50434
[1] QML PARTS ONLY
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE
[1]
Outline Drawings
16-Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Broadcom
AV02-1327EN
4
ACPL-267xL, ACPL-268KL, ACPL-560xL, ACPL-563xL, ACPL-665xL, and
5962-08242
Data Sheet
Hermetically Sealed, 3.3V High-Speed,
High CMR, Logic Gate Optocouplers
8-Pin DIP Through Hole, 1 and 2 Channels
10.03 (0.395)
10.29 (0.405)
1.02 (0.040)
1.52 (0.060)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
16-Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
11.13 (0.438)
10.72 (0.422)
1.27 (0.050)
REF.
0.46 (0.018)
0.36 (0.014)
2.85 (0.112)
MAX.
8.13 (0.320)
MAX.
0.31 (0.012)
0.23 (0.009)
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Broadcom
AV02-1327EN
5
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参数对比
与5962-0824203KTA相近的元器件有:5962-0824201HXA、5962-0824203HUC、5962-0824201HYA、5962-0824202KYC。描述及对比如下:
型号 5962-0824203KTA 5962-0824201HXA 5962-0824203HUC 5962-0824201HYA 5962-0824202KYC
描述 High Speed Optocouplers 10MBd 2CH 1500Vdc Hermetically sealed High Speed Optocouplers 10MBd 1CH 1500Vdc Hermetically sealed High Speed Optocouplers 10MBd 2CH 1500Vdc Hermetically sealed High Speed Optocouplers 10MBd 1CH 1500Vdc Hermetically sealed High Speed Optocouplers 10MBd 2CH 1500Vdc Hermetically sealed
是否Rohs认证 不符合 不符合 符合 不符合 符合
包装说明 DIP-16 DIP-16 DIP-16 DIP-16 DIP-8
Reach Compliance Code unknown compliant compliant compliant compliant
ECCN代码 EAR99 3A001.A.2.C EAR99 EAR99 EAR99
其他特性 TTL COMPATIBLE TTL COMPATIBLE TTL COMPATIBLE TTL COMPATIBLE TTL COMPATIBLE
配置 SEPARATE, 2 CHANNELS SINGLE SEPARATE, 2 CHANNELS SINGLE SEPARATE, 2 CHANNELS
标称数据速率 10 MBps 10 MBps 10 MBps 10 MBps 10 MBps
最大正向电流 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A
最大绝缘电压 1500 V 1500 V 1500 V 1500 V 1500 V
JESD-609代码 e0 e0 e4 e0 e4
安装特点 SURFACE MOUNT SURFACE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT SURFACE MOUNT
元件数量 2 1 2 1 2
最大通态电流 0.025 A 0.025 A 0.025 A 0.025 A 0.025 A
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C
光电设备类型 LOGIC IC OUTPUT OPTOCOUPLER LOGIC IC OUTPUT OPTOCOUPLER LOGIC IC OUTPUT OPTOCOUPLER LOGIC IC OUTPUT OPTOCOUPLER LOGIC IC OUTPUT OPTOCOUPLER
最大功率耗散 0.2 W 0.2 W 0.2 W 0.2 W 0.04 W
标称响应时间 1.4e-7 ns 1.4e-7 ns 1.4e-7 ns 1.4e-7 ns 1.4e-7 ns
最小供电电压 3 V 3 V 3 V 3 V 3 V
标称供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.3 V
表面贴装 YES YES NO NO YES
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Gold (Au) Tin/Lead (Sn/Pb) Gold (Au)
厂商名称 Broadcom(博通) Broadcom(博通) Broadcom(博通) - Broadcom(博通)
Base Number Matches 1 - 1 1 1
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