REVISIONS
LTR
A
B
DESCRIPTION
Changes are in accordance with the notice of revision 5962-R173-93. - ltg
Redraw switching waveforms and test circuit and add notes to figure 4,
switching waveforms and test circuit. Update the boilerplate to current
requirements as specified in MIL-PRF-38535. Editorial changes throughout. –
jak
DATE (YR-MO-DA)
93-06-05
06-07-11
APPROVED
Monica L. Poelking
Thomas M. Hess
CURRENT CAGE CODE IS 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Greg A. Pitz
A
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
B
11
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
D. A. Dicenzo
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Nelson A. Hauck
DRAWING APPROVAL DATE
87-06-04
REVISION LEVEL
MICROCIRCUIT, DIGITAL, ADVANCED CMOS,
DUAL 4-INPUT MULTIPLEXER, MONOLITHIC
SILICON
SIZE
CAGE CODE
AMSC N/A
B
A
SHEET
14933
1 OF
11
5962-87625
DSCC FORM 2233
APR 97
5962-E374-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87625
01
E
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
54AC153
Circuit function
Dual 4 input multiplexer
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC1-N20
Terminals
16
16
20
Package style
Dual-in-line
Flat pack
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
) ...........................................................................
DC input voltage range (V
IN
) .........................................................................
DC output voltage range (V
OUT
) ....................................................................
Clamp diode current (I
IK
, I
OK
).......................................................................
DC output current (per pin) (I
OUT
)..................................................................
DC V
CC
or GND current (I
CC
, I
GND
) ................................................................
Storage temperature range (T
STG
) ................................................................
Maximum power dissipation (P
D
) 2/ ..............................................................
Lead temperature (soldering, 10 seconds)....................................................
Thermal resistance, junction-to-case (θ
JC
) ....................................................
Junction temperature (T
J
) .............................................................................
1.4 Recommended operating conditions. 1/ 3/
Supply voltage range (V
CC
) ...........................................................................
Input voltage range (V
IN
) ...............................................................................
Output voltage range (V
OUT
)..........................................................................
Case operating temperature range (T
C
) ........................................................
Input rise or fall times (t
r
, t
f
):
V
CC
= 3.6 V ................................................................................................
V
CC
= 5.5 V ................................................................................................
+3.0 V dc to +5.5 V dc
0.0 V to V
CC
0.0 V to V
CC
-55°C to +125°C
0 to 116 ns (10% to 90%, 40 ns/V)
0 to 88 ns (10% to 90%, 20 ns/V)
-0.5 V dc to +6.0 V dc
-0.5 V dc to V
CC
+ 0.5 V dc
-0.5 V dc to V
CC
+ 0.5 V dc
±20
mA
±50
mA
±100
mA
-65°C to +150°C
500 mW
+245°C
See MIL-STD-1835
+175°C 2/
1/ Unless other wise specified, all voltages are referenced to ground.
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
3/ Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery backup systems.
Data retention implies no input transitions and no stored data loss with the following conditions:
V
IH
≥
70% V
CC
, V
IL
≤
30% V
CC
, V
OH
≥
70% V
CC
at -20 µA, V
OL
≤
30% V
CC
at 20 µA.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87625
SHEET
B
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for
non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified
Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional
certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program
plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality
Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or
function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87625
SHEET
B
3
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of
MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87625
SHEET
B
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
V
IN
= V
IH
minimum or V
IL
maximum
I
OH
= -50
μA
V
IN
= V
IH
minimum or V
IL
maximum
I
OH
= -4.0 mA
V
IN
= V
IH
minimum or V
IL
maximum
I
OH
= -24 mA
V
IN
= V
IH
minimum or V
IL
maximum
I
OH
= -50 mA
Low level output voltage
V
OL
1/
V
IN
= V
IH
minimum or V
IL
maximum
I
OL
= 50
μA
V
IN
= V
IH
minimum or V
IL
maximum
I
OL
= 12 mA
V
IN
= V
IH
minimum or V
IL
maximum
I
OL
= 24 mA
V
IN
= V
IH
minimum or V
IL
maximum
I
OL
= 50 mA
High level output voltage
V
IH
2/
V
IL
2/
I
IL
I
IH
I
CCH
I
CCL
C
IN
C
PD
3/
See 4.3.1c
See 4.3.1c
Tested at V
CC
= 3.0 V and repeated
at V
CC
= 5.5 V, See 4.3.1d
C
L
= 50 pF
R
L
= 500Ω
See figure 4
V
IN
= 0.0 V
V
IN
= 5.5 V
V
IN
= V
CC
or GND
V
CC
Group A
subgroups
1, 2, 3
Limits
Min
2.9
4.4
5.4
2.4
3.7
4.7
3.85
1, 2, 3
0.1
0.1
0.1
0.5
0.5
0.5
1.65
1, 2, 3
2.1
3.15
3.85
0.9
1.35
1.65
-1.0
+1.0
160
160
4
4
7, 8
3.0 V
4.5 V
3.0 V
4.5 V
9
10, 11
9
10, 11
9
10, 11
9
10, 11
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
11.5
14.5
8.5
10.5
12.5
16.0
9.0
11.5
ns
ns
ns
ns
8.0
70
pF
pF
V
V
Max
V
Unit
High level output voltage
V
OH
1/
3.0 V
4.5 V
5.5 V
3.0 V
4.5 V
5.5 V
5.5 V
3.0 V
4.5 V
5.5 V
3.0 V
4.5 V
5.5 V
5.5 V
3.0 V
4.5 V
5.5 V
3.0 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
Low level input voltage
1, 2, 3
V
Input leakage current, low
Input leakage current, high
Quiescent supply current,
output high
Quiescent supply current,
output low
Input capacitance
Power dissipation
capacitance
Functional tests
Propagation delay time,
In to Z
1, 2, 3
1, 2, 3
μA
μA
t
PHL1
4/
t
PLH1
4/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87625
SHEET
B
5
嵌入式系统
