REVISIONS
LTR
A
B
C
DESCRIPTION
Changes in accordance with N.O.R. 5962-R220-93.
Changes in accordance with N.O.R. 5962-R153-94.
Drawing updated to reflect current requirements. - ro
DATE (YR-MO-DA)
93-08-26
94-04-29
00-06-02
APPROVED
M. A. FRYE
M. A. FRYE
R. MONNIN
D
Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535.
Drawing updated to reflect current requirements. - gt
04-06-09
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
RICK C. OFFICER
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
DRAWING APPROVAL DATE
92-03-13
MICROCIRCUIT, LINEAR, OPERATIONAL
AMPLIFIER, WIDEBAND, FAST SETTLING,
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
11
5962-87784
DSCC FORM 2233
APR 97
5962-E276-04
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87784
01
C
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
HA-5190
EL-2190
Circuit function
Fast settling wideband operational amplifier
Fast settling wideband operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
C
X
2
Descriptive designator
GDIP1-T14 or CDIP2-T14
See figure 1
CQCC1-N20
Terminals
14
12
20
Package style
Dual-in-line
Can
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Voltage between +V and –V terminals ................................... 35 V dc
Differential input voltage ......................................................... 6.0 V dc
Voltage at either input terminal .............................................. +V to –V
Peak output current (< 10 % duty cycle) ................................. 50 mA
Storage temperature range .................................................... -65°C to +150°C
Maximum power dissipation (PD) 1/:
Case C ................................................................................ 1.02 W
Case X ................................................................................ 1.45 W
Case 2 ................................................................................ 1.06 W
Lead temperature (soldering, 10 seconds) ............................ +275°C
Junction temperature (TJ) ...................................................... +175°C
Thermal resistance, junction-to-case (θJC):
Cases C and 2 .................................................................... See MIL-STD-1835
Case X ................................................................................ 82°C/W
Thermal resistance, junction-to-ambient (θJA):
Case C ................................................................................ 98°C/W
Case X ................................................................................ 69°C/W
Case 2 ................................................................................ 95°C/W
1/ Derate linearly above T
A
= +75°C as follows: case C at 10.2°C/W, case X at 14.5°C/W, and case 2 at 10.6°C/W.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87784
SHEET
D
2
1.4 Recommended operating conditions.
Positive supply voltage range (+V) ......................................... +12 V dc to +15 V dc
Negative supply voltage range (-V) ........................................ -12 V dc to –15 V dc
Common mode input voltage (V
CM
) .......................................
≤
|(+V – (-V)) / 2|
Load resistance (R
L
) ..............................................................
≥
200
Ω
Ambient operating temperature (T
A
) ...................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
www.dodssp.daps.mil/
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87784
SHEET
D
3
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-
38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87784
SHEET
D
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
V
CM
= 0 V,
+R
S
= 100
Ω,
-R
S
= 100
Ω
Test
Symbol
Group A
subgroups
1
2,3
1
2,3
Device
type
01
Limits 2/
Min
Max
±5
±10
Unit
Input offset voltage
V
IO
mV
02
±2
±6
Input bias current
+I
IB
V
CM
= 0 V, +R
S
= 1.1 kΩ,
-R
S
= 100
Ω
1
2,3
1
2,3
1
2,3
1,2,3
All
±15
±20
±15
±20
µA
-I
IB
V
CM
= 0 V, +R
S
= 100
Ω,
-R
S
= 1.1 kΩ
Input offset current
I
IO
V
CM
= 0 V, +R
S
= 1.1 kΩ,
-R
S
= 1.1 kΩ
All
±4.0
±6.0
µA
Common mode input
voltage range
+V
CM
-V
CM
+V = 10 V, -V = -20 V
+V = 20 V, -V = -10 V
V
OUT
= 0 V and 5.0 V,
R
L
= 200
Ω
All
5.0
-5.0
V
Large signal voltage
gain
+A
VOL
1
2,3
1
2,3
1,2,3
All
15
5.0
15
5.0
kV/V
-A
VOL
V
OUT
= 0 V and –5.0 V,
R
L
= 200
Ω
Common mode rejection
ratio
+CMRR
-CMRR
∆V
CM
= 5.0 V, +V = 10 V,
-V = -20 V, V
OUT
= -5.0 V
∆V
CM
= -5.0 V, +V = 20 V,
-V = -10 V, V
OUT
= 5.0 V
V
OUT
≥
-5.0 V, T
A
= +25°C
V
OUT
≥
5.0 V, T
A
= +25°C
All
74
74
dB
Output current
+I
OUT
-I
OUT
1
All
25
-25
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87784
SHEET
D
5
