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5962-88513012X

Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CQCC20,

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Precision Monolithics Inc

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器件参数
参数名称
属性值
厂商名称
Precision Monolithics Inc
Reach Compliance Code
unknown
放大器类型
OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB)
0.02 µA
标称共模抑制比
94 dB
最大输入失调电压
2000 µV
JESD-30 代码
S-CQCC-N20
长度
8.89 mm
负供电电压上限
-20 V
标称负供电电压 (Vsup)
-15 V
功能数量
1
端子数量
20
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
QCCN
封装形状
SQUARE
封装形式
CHIP CARRIER
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
座面最大高度
2.54 mm
标称压摆率
52 V/us
供电电压上限
20 V
标称供电电压 (Vsup)
15 V
表面贴装
YES
技术
BIPOLAR
温度等级
MILITARY
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
标称均一增益带宽
10000 kHz
宽度
8.89 mm
Base Number Matches
1
文档预览
REVISIONS
LTR
A
DESCRIPTION
Page 2, 1.4, add IVR test conditions. Page 4, table I, I
IB
and I
OS
, add footnote
to guarantee subgroup 3. For I
OS
, change unit from pA to nA.
For V
O
, add subgroup 6. Editorial changes throughout.
B
C
D
Add device type 02 and case outline, F-4. Editorial changes throughout.
Change boilerplate to add one-part part numbers. Add delta test limits.
Make changes to table IIA. - ro
91-03-07
96-11-13
02-01-07
M. A. FRYE
R. MONNIN
R. MONNIN
DATE (YR-MO-DA)
88-07-19
APPROVED
M. A. FRYE
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
PREPARED BY
MARCIA B. KELLEHER
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
D. A. DiCENZO
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
ROBERT P. EVANS
MICROCIRCUIT, LINEAR, HIGH SPEED, FAST
SETTLING, PRECISION OPERATIONAL
AMPLIFIER, MONOLITHIC SILICON
DRAWING APPROVAL DATE
87-11-27
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
11
5962-88513
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E127-02
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
\/
Drawing number
For device class V:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
OP-42A
OP-42B
Circuit function
High speed, fast settling, precision
operational amplifier
High speed, fast settling, precision
operational amplifier
88513
01
Device
type
(see 1.2.2)
/
V
Device
class
designator
(see 1.2.3)
G
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
88513
01
Device
type
(see 1.2.2)
/
G
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88513
SHEET
D
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
G
H
P
2
Descriptive designator
MACY1-X8
GDFP1-F10 or CDFP2-F10
GDIP1-T8 or CDIP2-T8
CQCC1-N20
Terminals
8
10
8
20
Package style
Can
Flat pack
Dual-in-line
Square lead less chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (V
S
) ..........................................................................
±20
V
Input voltage (V
IN
) ............................................................................
±20
V 2/
Differential input voltage ...................................................................
±40
V 2/
Output short-circuit duration ............................................................. Indefinite
Storage temperature range .............................................................. -65°C to +150°C
Lead temperature (soldering, 60 seconds)........................................ +300°C
Power dissipation (P
D
) ....................................................................... 500 mW 3/
Thermal resistance, junction-to-case (θ
JC
) ....................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ
JA
):
Case G........................................................................................... 150°C/W
Cases H and P............................................................................... 119°C/W
Case 2 ........................................................................................... 120°C/W
1.4 Recommended operating conditions.
Supply voltage (V
S
) ........................................................................... ±15 V
Source resistance (R
S
)...................................................................... 50
Common mode voltage (V
CM
)........................................................... 0 V
Input voltage range (V
INR
)................................................................. ±11 V
Ambient operating temperature range (T
A
) ....................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
_____
1/ Unless otherwise specified, T
A
= +25°C.
2/ For supply voltages less than 20 V, the absolute maximum input voltage is equal to the supply voltage.
3/ Must withstand the added P
D
due to short circuit test, e.g., I
SC
.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88513
SHEET
D
3
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88513
SHEET
D
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
T
A
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
1
Device
type
Min
01
02
Limits
Max
±1.0
±1.5
±2.0
±200
±20
Unit
Input offset voltage
V
OS
mV
2,3
Input bias current
I
IB
1
2,3 2/
Input offset current
I
OS
1
2,3 2/
Common mode
rejection
3/
CMR
V
CM
= IVR =
±11
V
1
2,3
Power supply rejection
ratio
PSRR
V
S
=
±10
V to
±20
V
1
2,3
Short circuit output
current
I
SC
Output shorted to ground
1
2,3
Supply current
External V
OS
trim range
Output voltage swing
ISY
V
OS
V
O
= 0 V, no load
R
POT
= 10 kΩ,
T
A
= +25°C
V
O
R
L
= 1 kΩ
R
L
= 2 kΩ
Large signal voltage gain
A
VO
R
L
= 1 kΩ, V
O
=
±10
V
4
5,6
4
5,6
R
L
= 2 kΩ, V
O
=
±10
V
4
5,6
R
L
= 1 kΩ, V
O
=
±10
V,
T
A
= +25°C
See footnotes at end of table.
4
1,2,3
1
All
All
pA
nA
pA
nA
dB
All
±40
±1
All
86
80
All
40
50
µV/V
All
20
8
60
60
6.0
mA
All
All
±2.5
±11.5
±11.0
All
500
160
200
80
100
mA
mV
±10
All
V
V/mV
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88513
SHEET
D
5
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参数对比
与5962-88513012X相近的元器件有:5962-88513012C、5962-88513012A、5962-8851301GA、5962-8851301PA、5962-8851301PB、5962-8851301GX、PFC-W0805R-02-1720-D、5962-8851301GB。描述及对比如下:
型号 5962-88513012X 5962-88513012C 5962-88513012A 5962-8851301GA 5962-8851301PA 5962-8851301PB 5962-8851301GX PFC-W0805R-02-1720-D 5962-8851301GB
描述 Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CQCC20, Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CQCC20, CERAMIC, LCC-20 Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, CQCC20, Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, MBCY8, Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, CDIP8, Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CDIP8, CERAMIC, DIP-8 Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, MBCY8, Fixed Resistor, Thin Film, 0.25W, 172ohm, 100V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0805, CHIP Operational Amplifier, 1 Func, 2000uV Offset-Max, MBCY8, METAL CAN, 8-PIN
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown compliant unknown
端子数量 20 20 20 8 8 8 8 2 8
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 150 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -65 °C -55 °C
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CYLINDRICAL IN-LINE IN-LINE CYLINDRICAL SMT CYLINDRICAL
表面贴装 YES YES YES NO NO NO NO YES NO
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER - OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB) 0.02 µA 0.02 µA 0.0002 µA 0.0002 µA 0.0002 µA 0.02 µA 0.02 µA - 0.02 µA
标称共模抑制比 94 dB 80 dB 86 dB 86 dB 86 dB 80 dB 94 dB - 80 dB
最大输入失调电压 2000 µV 2000 µV 1000 µV 1000 µV 1000 µV 2000 µV 2000 µV - 2000 µV
JESD-30 代码 S-CQCC-N20 S-CQCC-N20 S-CQCC-N20 O-MBCY-W8 R-CDIP-T8 R-GDIP-T8 O-MBCY-W8 - O-MBCY-X8
负供电电压上限 -20 V -20 V -20 V -20 V -20 V -20 V -20 V - -20 V
标称负供电电压 (Vsup) -15 V -15 V -15 V -15 V -15 V -15 V -15 V - -15 V
功能数量 1 1 1 1 1 1 1 - 1
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED METAL CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED METAL - METAL
封装代码 QCCN QCCN QCCN TO-99 DIP DIP TO-99 - -
封装形状 SQUARE SQUARE SQUARE ROUND RECTANGULAR RECTANGULAR ROUND - ROUND
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
座面最大高度 2.54 mm 2.54 mm 2.54 mm - 5.08 mm 5.08 mm - - -
标称压摆率 52 V/us 52 V/us 52 V/us 52 V/us 52 V/us 52 V/us 52 V/us - -
供电电压上限 20 V 20 V 20 V 20 V 20 V 20 V 20 V - 20 V
标称供电电压 (Vsup) 15 V 15 V 15 V 15 V 15 V 15 V 15 V - 15 V
技术 BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR THIN FILM -
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY - MILITARY
端子形式 NO LEAD NO LEAD NO LEAD WIRE THROUGH-HOLE THROUGH-HOLE WIRE - UNSPECIFIED
端子节距 1.27 mm 1.27 mm 1.27 mm - 2.54 mm 2.54 mm - - -
端子位置 QUAD QUAD QUAD BOTTOM DUAL DUAL BOTTOM - BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
标称均一增益带宽 10000 kHz 10000 kHz 10000 kHz 10000 kHz 10000 kHz 10000 kHz 10000 kHz - -
宽度 8.89 mm 8.89 mm 8.89 mm - 7.62 mm 7.62 mm - - -
Base Number Matches 1 1 1 1 1 1 1 - 1
包装说明 - QCCN, QCCN, - - CERAMIC, DIP-8 - CHIP METAL CAN, 8-PIN
JESD-609代码 - e0 e0 e0 e0 e0 - e0 e0
端子面层 - TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD - Tin/Lead (Sn/Pb) TIN LEAD
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