首页 > 器件类别 > 存储 > 存储

5962-8959808MUA

Standard SRAM, 128KX8, 70ns, CMOS, CQCC32, LCC-32

器件类别:存储    存储   

厂商名称:White Electronic Designs Corporation

厂商官网:http://www.wedc.com/

下载文档
5962-8959808MUA 在线购买

供应商:

器件:5962-8959808MUA

价格:-

最低购买:-

库存:点击查看

点击购买

器件参数
参数名称
属性值
包装说明
LCC-32
Reach Compliance Code
unknown
最长访问时间
70 ns
其他特性
TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
I/O 类型
COMMON
JESD-30 代码
R-CQCC-N32
JESD-609代码
e0
长度
20.83 mm
内存密度
1048576 bit
内存集成电路类型
STANDARD SRAM
内存宽度
8
功能数量
1
端子数量
32
字数
131072 words
字数代码
128000
工作模式
ASYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-55 °C
组织
128KX8
输出特性
3-STATE
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
QCCN
封装等效代码
SOLCC32,.4
封装形状
RECTANGULAR
封装形式
CHIP CARRIER
并行/串行
PARALLEL
电源
5 V
认证状态
Not Qualified
筛选级别
MIL-STD-883
座面最大高度
2.54 mm
最大待机电流
0.001 A
最小待机电流
2 V
最大压摆率
0.11 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
TIN LEAD
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
QUAD
宽度
10.16 mm
Base Number Matches
1
文档预览
NOT MEASUREMENT
SENSITIVE
MIL-HDBK-103AP
6 MARCH 2014
SUPERSEDING
MIL-HDBK-103AN
12 SEPTEMBER 2013
DEPARTMENT OF DEFENSE
HANDBOOK
LIST OF STANDARD MICROCIRCUIT DRAWINGS
This handbook is for guidance only. Do not cite this document
as a requirement.
AMSC N/A
FSC 5962
MIL-HDBK-103AP
FOREWORD
1. This handbook is approved for use by all Departments and Agencies of the Department of Defense.
2. This handbook is for guidance only. This handbook cannot be cited as a requirement. If it is, the contractor does not have
to comply.
3. The proliferation of industry prepared drawings for the same part used in a variety of military applications has become an
ever increasing item of expense to the DoD. Numerous situations have arisen where one military acquisition document would
be more appropriate and cost effective than the multiplicity of contractor prepared drawings. Standard Microcircuit Drawings
(SMDs) are being prepared to eliminate the need for the multitude of contractor prepared drawings for the same device when
the minimum requirements of SMD's are sufficient to meet the requirements of the application on an interim or permanent
basis.
4. Comments, suggestions, or questions on this document should be addressed to: Commander, DLA Land and Maritime,
ATTN: VAS, 3990 East Broad St., Columbus, OH 43218-3990, or emailed to
linear@dla.mil.
Since contact information can
change, you may want to verify the currency of this address information using the ASSIST online database at
https://assist.dla.mil.
ii
MIL-HDBK-103AP
CONTENTS
PARAGRAPH
1.
1.1
1.2
1.2.1
1.2.2
1.2.3
1.2.4
2.
3.
4.
4.1
4.2
4.3
4.4
4.5
4.6
5.
5.1
5.2
6.
6.1
6.1.1
6.1.2
6.2
7.
7.1
7.2
TABLE 1
SECTION 1
Part I
Part II
Part III
PAGE
SCOPE .......................................................................................................................................... 1
Purpose...................................................................................................................................... 1
Part or identifying number (PIN) ................................................................................................ 1
Drawing number......................................................................................................................... 1
Device class designator ............................................................................................................. 1
Case outline / lead finish ............................................................................................................ 2
Substitutability ............................................................................................................................ 2
APPLICABLE DOCUMENTS ......................................................................................................... 2
DEFINITIONS ................................................................................................................................ 2
REQUIREMENTS .......................................................................................................................... 2
Drawing requirements ................................................................................................................ 2
Preparation procedures ............................................................................................................. 2
Drawing effectivity and duration ................................................................................................. 2
Approved sources of supply....................................................................................................... 2
Radiation hardness assurance (RHA) levels ............................................................................. 2
Electrostatic discharge sensitivity (ESD) listing ......................................................................... 3
CONFIGURATION MANAGEMENT .............................................................................................. 3
Configuration management of SMDs ......................................................................................... 3
Record of users.......................................................................................................................... 3
DISTRIBUTION and REQUESTS .................................................................................................. 4
Distribution ................................................................................................................................. 4
Automatic distribution ................................................................................................................ 4
Electronic distribution ................................................................................................................. 4
Requests .................................................................................................................................... 4
NOTES .......................................................................................................................................... 4
Intended use .............................................................................................................................. 4
Subject item (key word) listing ................................................................................................... 4
Noun code descriptions ................................................................................................................. 5
Microcircuits................................................................................................................................... 12
Listed by SMD PIN .....................................................................................................................
12
Listed by generic PIN .................................................................................................................
714
Listed approved sources ............................................................................................................
932
Concluding material ...................................................................................................................
936
iii
MIL-HDBK-103AP
1. SCOPE
1.1 Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the
DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP will be
the avenue for screening candidate parts for the SMDP by the DLA Land and Maritime Military Parts Control Advisory Group
(MPCAG).
1.2 Part or Identifying number (PIN). The PIN's listed in section 1, part I, are composed of the elements shown in the
following example (see 1.2.2 for one part - one part number differentiation):
One part - one part number PIN
5962-90123
01
M
X
A
Drawing number
(1.2.1)
Device
Type
Device
Class
Designator
(1.2.2)
Case
Outline
(1.2.3)
Lead
Finish
(1.2.3)
Non - one part - one part number PIN
86030
or
5962-88668
Drawing number
01
X
A
Device type
Case outline
(1.2.3)
Lead finish
(1.2.3)
1.2.1 Drawing number. One part - one part number SMD's for device classes Q, V, H, and K may cover custom device
products which are generally used to specify application specific integrated circuits (both monolithic and hybrid). To
differentiate between one part - one part number SMD's that cover standard product from custom product a single alpha
character will be placed in the unique 3 digit portion of the SMD drawing number as in the following example: 5962-90A23.
This will be the only change to the SMD PIN for custom products.
1.2.2 Device class designator. One part - one part number SMD's (fully implemented after SMD 5962-90659) contain device
requirements for all three of the major military microcircuit requirements documents. By establishing a one part number
system covering all three documents, the OEM can acquire to the highest level available for a given generic device to meet
system needs without modifying the original contract parts selection criteria.
Military documentation format
New MIL-PRF-38535 Standard
Microcircuit Drawings
New MIL-PRF-38534 Standard
Microcircuit Drawings
New 1.2.1 of MIL-STD-883 Standard
Microcircuit Drawings, based on
Appendix A of MIL-PRF-38535
Example PIN
5962-XXXXXZZ(Q,V,T or N)YY
5962-XXXXXZZ(H,K,D,G or E)YY
5962-XXXXXZZ(M)YY
Manufacturing
source listing
QML-38535
QML-38534
MIL-HDBK-103
Document
listing
MIL-HDBK-103
MIL-HDBK-103
MIL-HDBK-103
This handbook is for guidance only and cannot be cited as a requirement.
1
MIL-HDBK-103AP
1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the
section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to
supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the
other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed
herein.
1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.
2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.
3. DEFINITIONS This section is not applicable to the handbook.
4. REQUIREMENTS
4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.
4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.
4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become
inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.
4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources
formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources
of supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device
classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the
convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.
Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of
supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for
those devices that the manufacturer specifies that he will no longer supply.
4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or
MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN
as indicated in the following example:
5962(M, D, P, L, R, F, G, or H)8999901EA
Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;
however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request
of the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The
manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in
Section 1, Part I of the appendix of this document.
2
查看更多>
BlueNRG-1&2开发环境的搭建(一) 概述【ST工程师文章】
进行BlueNRG-1&2开发之前需要搭建开发环境,那我们需要准备哪些相关的工具呢?它们又包含哪些...
nmg 意法半导体-低功耗射频
CC2531的usb/hid通信问题
小弟现在在做cc2531和电脑usb口不用安装驱动的hid通信,请问一下各位大神你们有没有相似的例子...
mingyuegx RF/无线
cc3200延时函数不准确问题
MAP_UtilsDelay(80000000/3);实际测到延时了2s,请问是哪里配置有问题 c...
790077908 无线连接
是德科技:五招教您最小化合格/不合格的误判风险 在线直播预报名全面开启!
是德科技:五招教您最小化合格/不合格的误判风险在线直播 4月17日上午10点准时开...
EEWORLD社区 测试/测量
电阻应变片传感器的一些问题
昨天的帖子可能是我没有写明白意思,就是说,在电阻应变片传感器中,电阻应变片是最重要的,传感器的数据来...
pengzai 传感器
热门器件
热门资源推荐
器件捷径:
S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY
需要登录后才可以下载。
登录取消