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5962-8967001CB

Operational Amplifier, 4 Func, 1000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, CERDIP-14

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Precision Monolithics Inc

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器件参数
参数名称
属性值
包装说明
HERMETIC SEALED, CERDIP-14
Reach Compliance Code
unknown
放大器类型
OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB)
0.02 µA
标称共模抑制比
95 dB
最大输入失调电压
1000 µV
JESD-30 代码
R-GDIP-T14
长度
19.43 mm
负供电电压上限
-18 V
标称负供电电压 (Vsup)
-15 V
功能数量
4
端子数量
14
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
CERAMIC, GLASS-SEALED
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
筛选级别
MIL-STD-883
座面最大高度
5.08 mm
供电电压上限
18 V
标称供电电压 (Vsup)
15 V
表面贴装
NO
技术
BIPOLAR
温度等级
MILITARY
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
标称均一增益带宽
20 kHz
宽度
7.62 mm
Base Number Matches
1
文档预览
REVISIONS
LTR
A
B
DESCRIPTION
Drawing updated to reflect current requirements. -ro
Update drawing as part of 5 year review. -rrp
DATE (YR-MO-DA)
01-03-12
07-10-23
APPROVED
R. MONNIN
R. HEBER
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
PREPARED BY
RICK C. OFFICER
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, LOW VOLTAGE,
MICROPOWER, QUAD OPERATIONAL
AMPLIFIER, MONOLITHIC SILICON
DRAWING APPROVAL DATE
89-11-27
AMSC N/A
REVISION LEVEL
B
SIZE
A
SHEET
CAGE CODE
67268
1 OF
9
5962-89670
DSCC FORM 2233
APR 97
5962-E509-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89670
01
C
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
OP490A
Circuit function
Low voltage, micropower, quad operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
C
3
Descriptive designator
GDIP1-T14 or CDIP2-T14
CQCC1-N28
Terminals
14
28
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage:
Single supply operation (+V
S
to GND) ............................. +1.6 V to +36 V
Dual supply operation (V
S
) ..............................................
±0.8
V to
±18
V
Input voltage ........................................................................ (-V
S
– 20 V) to (+V
S
+ 20 V)
Differential input voltage ......................................................
Output short-circuit duration ................................................
Storage temperature range .................................................
Lead temperature (soldering, 60 seconds) ..........................
Junction temperature range (T
J
) .........................................
(-V
S
– 20 V) to (+V
S
+ 20 V)
Continuous
-65°C to +150°C
+300°C
-65°C to +150°C
Thermal resistance, junction-to-case (θ
JC
) ......................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ
JA
):
Case C ............................................................................ 100°C/W
Case 3 ............................................................................. 110°C/W
1.4 Recommended operating conditions.
Single supply operation (GND to +V
S
) ................................ 0 V to +36 V
Dual supply operation (±V
S
) ................................................
±18
V
Source resistance (R
S
) ....................................................... 50
Ω
Ambient operating temperature range (T
A
) ......................... -55°C to +125°C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89670
SHEET
B
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89670
SHEET
B
3
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89670
SHEET
B
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
T
A
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
1
2,3
Device
type
Min
01
Limits
Max
±0.5
±1.0
Unit
Input offset voltage
V
OS
mV
Input offset current
I
OS
V
CM
= 0 V
1
2,3
01
±3
±5
nA
Input bias current
I
B
V
CM
= 0 V
1
2,3
01
±15
±20
nA
Common mode rejection
ratio
CMRR
+V
S
= +5 V, -V
S
= 0 V,
V
CM
= 0 V, 4 V
+V
S
= +5 V, -V
S
= 0 V,
V
CM
= 0 V, 3.5 V
V
CM
= -15 V, 13.5 V
1
01
90
dB
2,3
85
1
2,3
100
95
01
5.6
10.0
01
60
100
80
120
01
±13.5
±13.0
±10.5
±10.0
V
μA
μV/V
Power supply rejection
ratio
PSRR
V
S
=
±1.5
V,
±15
V
1
2,3
Quiescent current
supply
2/
I
SY
V
S
=
±1.5
V, no load
1
2,3
V
S
=
±15
V, no load
1
2,3
Output voltage swing
V
O
V
S
=
±15
V, R
L
= 10 kΩ
4
5,6
V
S
=
±15
V, R
L
= 2 kΩ
4
5,6
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89670
SHEET
B
5
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参数对比
与5962-8967001CB相近的元器件有:5962-8967001CA、5962-89670013A、5962-89670013C、5962-89670013X、5962-8967001CX。描述及对比如下:
型号 5962-8967001CB 5962-8967001CA 5962-89670013A 5962-89670013C 5962-89670013X 5962-8967001CX
描述 Operational Amplifier, 4 Func, 1000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, CERDIP-14 Operational Amplifier, 4 Func, 1000uV Offset-Max, BIPolar, CDIP14, Operational Amplifier, 4 Func, 1000uV Offset-Max, BIPolar, CQCC28, Operational Amplifier, 4 Func, 1000uV Offset-Max, BIPolar, CQCC28, LCC-28 Operational Amplifier, 4 Func, 1000uV Offset-Max, BIPolar, CQCC28, Operational Amplifier, 4 Func, 1000uV Offset-Max, BIPolar, CDIP14,
Reach Compliance Code unknown unknown unknown unknown unknown unknown
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB) 0.02 µA 0.02 µA 0.02 µA 0.02 µA 0.02 µA 0.02 µA
标称共模抑制比 95 dB 95 dB 95 dB 95 dB 95 dB 95 dB
最大输入失调电压 1000 µV 1000 µV 1000 µV 1000 µV 1000 µV 1000 µV
JESD-30 代码 R-GDIP-T14 R-GDIP-T14 S-CQCC-N28 S-CQCC-N28 S-CQCC-N28 R-GDIP-T14
长度 19.43 mm 19.43 mm 11.43 mm 11.43 mm 11.43 mm 19.43 mm
标称负供电电压 (Vsup) -15 V -15 V -15 V -15 V -15 V -15 V
功能数量 4 4 4 4 4 4
端子数量 14 14 28 28 28 14
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
封装代码 DIP DIP QCCN QCCN QCCN DIP
封装形状 RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE RECTANGULAR
封装形式 IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 5.08 mm 2.54 mm 2.54 mm 2.54 mm 5.08 mm
标称供电电压 (Vsup) 15 V 15 V 15 V 15 V 15 V 15 V
表面贴装 NO NO YES YES YES NO
技术 BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm
端子位置 DUAL DUAL QUAD QUAD QUAD DUAL
标称均一增益带宽 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz
宽度 7.62 mm 7.62 mm 11.43 mm 11.43 mm 11.43 mm 7.62 mm
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
Base Number Matches 1 1 1 1 - -
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