型号
- 型号
- 关键词
| 型号 | 5962-89841063X | ATF22V10B_10 | 5962-89841033X | 5962-8984103LA | 5962-8984106LA |
|---|---|---|---|---|---|
| 描述 | FLASH PLD, 15 ns, CDIP24 | FLASH PLD, 15 ns, CDIP24 | FLASH PLD, 15 ns, CDIP24 | FLASH PLD, 15 ns, CDIP24 | FLASH PLD, 10 ns, CDIP24 |
| 端子数量 | 28 | 24 | 28 | 24 | 24 |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 可编程逻辑类型 | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | - | QLCC | DIP | DIP |
| 包装说明 | QCCN, | - | QCCN, | DIP, DIP24,.3 | CERAMIC, DIP-24 |
| 针数 | 28 | - | 28 | 24 | 24 |
| Reach Compliance Code | compli | - | compli | compli | unknow |
| ECCN代码 | 3A001.A.2.C | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大时钟频率 | 90 MHz | - | 55.5 MHz | 50 MHz | 76.9 MHz |
| JESD-30 代码 | S-CQCC-N28 | - | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 长度 | 11.45 mm | - | 11.45 mm | 32 mm | 32 mm |
| 专用输入次数 | 11 | - | 11 | 11 | 11 |
| I/O 线路数量 | 10 | - | 10 | 10 | 10 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C |
| 输出函数 | MACROCELL | - | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | - | QCCN | DIP | DIP |
| 封装形状 | SQUARE | - | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | - | CHIP CARRIER | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 传播延迟 | 10 ns | - | 15 ns | 15 ns | 10 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 2.54 mm | - | 2.54 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | YES | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 端子面层 | TIN LEAD | - | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped |
| 端子节距 | 1.27 mm | - | 1.27 mm | 2.54 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 11.45 mm | - | 11.45 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 |