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5962-9073103M2X

SPST, 2 Func, 1 Channel, CMOS, CQCC20,

器件类别:模拟混合信号IC    信号电路   

厂商名称:TEMIC

厂商官网:http://www.temic.de/

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器件参数
参数名称
属性值
厂商名称
TEMIC
Reach Compliance Code
unknown
模拟集成电路 - 其他类型
SPST
JESD-30 代码
S-CQCC-N20
标称负供电电压 (Vsup)
-15 V
信道数量
1
功能数量
2
端子数量
20
标称断态隔离度
68 dB
最大通态电阻 (Ron)
35 Ω
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装形状
SQUARE
封装形式
CHIP CARRIER
认证状态
Not Qualified
筛选级别
MIL-STD-883
标称供电电压 (Vsup)
15 V
表面贴装
YES
最长断开时间
145 ns
最长接通时间
175 ns
技术
CMOS
温度等级
MILITARY
端子形式
NO LEAD
端子位置
QUAD
Base Number Matches
1
文档预览
REVISIONS
LTR
A
B
C
D
E
DESCRIPTION
Changes in accordance with NOR 5962-R053-93.
Changes in accordance with NOR 5962-R060-94.
Changes in accordance with NOR 5962-R041-95.
Redrawn with changes. Add case outline X. Technical and editorial changes
throughout.
Update drawing to current requirements. Editorial changes throughout. - drw
DATE (YR-MO-DA)
93-01-07
93-12-06
94-11-30
95-03-24
04-11-09
APPROVED
M. A. Frye
M. A. Frye
M. A. Frye
M. A. Frye
Raymond Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Rick C. Officer
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
10
E
11
E
12
E
13
E
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Charles E. Besore
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
92-01-13
REVISION LEVEL
E
SIZE
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, CMOS QUAD, SPST
ANALOG SWITCH, MONOLITHIC SILICON
CAGE CODE
67268
1 OF
14
5962-90731
DSCC FORM 2233
APR 97
5962-E014-05
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
90731
01
M
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
Generic number
DG411
DG412
DG413
Circuit function
CMOS, quad, SPST analog switch
CMOS, quad, SPST analog switch
CMOS, quad, SPST analog switch
Switch action
(See figures 2, 3)
(See figures 2, 3)
(See figures 2, 3)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
2
E
F
X
Descriptive designator
CQCC1-N20
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CDFP4-F16
Terminals
20
16
16
16
Package style
square leadless chip carrier
dual-in-line
flatpack
flatpack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-90731
SHEET
E
2
1.3 Absolute maximum ratings. 1/
V+ to V-............................................................................................................
Ground to V- ....................................................................................................
Logic supply voltage (V
L
) to V- .........................................................................
Digital inputs, V
S
, V
D
........................................................................................
Continuous current (any terminal) ....................................................................
Source or drain current (pulsed, 1.0 ms, 10% duty cycle) ................................
Storage temperature range ..............................................................................
Lead temperature (soldering, 10 seconds).......................................................
Power dissipation, T
A
= +25ºC (P
D
):
Case E..........................................................................................................
Case F and X................................................................................................
Case 2 ..........................................................................................................
Thermal resistance, junction-to-case (θ
JC
) .......................................................
1.4 Recommended operating conditions.
Unipolar supply voltage:
V+ .................................................................................................................
V-..................................................................................................................
Bipolar supply voltage:
V+ .................................................................................................................
V-..................................................................................................................
Logic supply voltage (V
L
) .................................................................................
Ambient operating temperature range (T
A
) ......................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
12 V dc
0 V dc
15 V dc
-15 V dc
5.25 V dc
-55ºC to +125ºC
44 V dc
25 V dc
(Ground -0.3 V dc) to 44 V dc 2/
(V-) -2.0 V dc to (V+) +2.0 V dc
or 30 mA, whichever occurs first 2/
30 mA
100 mA
-65ºC to +150ºC
+300ºC
900 mW 3/
485 mW 4/
750 mW 5/
See MIL-STD-1835
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Signals on S
X
, D
X
, or IN
X
exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum
current ratings.
3/ Derate above T
A
= +75ºC at 12 mW/ºC.
4/ Derate above T
A
= +70ºC at 6.06 mW/ºC.
5/ Derate above T
A
= +75ºC at 10 mW/ºC.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-90731
SHEET
E
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.
3.2.4 Block diagrams. The block diagrams shall be as specified on figure 3.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 82 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-90731
SHEET
E
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
T
A
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
1, 3
2
Device
type
Min
01
0
0
02
0
0
03
0
0
01
0
0
02
0
0
03
0
0
01
Limits
Max
35
45
35
45
35
45
80
100
80
100
80
100
+0.25
+20
+0.25
+20
+0.25
+20
+0.25
+20
+0.25
+20
+0.25
+20
Unit
Drain-to-source ON
resistance
r
DS(ON)
V+ = 13.5 V,
V- = -13.5 V,
I
S
= -10 mA,
V
D
= ±8.5 V
V
IN
= 0.8 V
V
IN
= 2.4 V
1, 3
2
V
IN
= 0.8 V or
2.4 V 2/
V+ = 10.8 V,
V- = 0 V,
I
S
= -10 mA,
V
D
= 3.0 V and
8.0 V
V
IN
= 0.8 V
1, 3
2
1, 3
2
V
IN
= 2.4 V
1, 3
2
V
IN
= 0.8 V or
2.4 V 2/
Source OFF leakage
current
I
S(OFF)
V+ = 16.5 V,
V- = -16.5 V,
V
D
= -15.5 V
V
S
= 15.5 V
V
IN
= 0.8 V
1, 3
2
1
2, 3
-0.25
-20
nA
V
IN
= 2.4 V
1
2, 3
02
-0.25
-20
V
IN
= 0.8 V or
2.4 V 2/
V+ = 16.5 V,
V- = -16.5 V,
V
D
= 15.5 V
V
S
= -15.5 V
V
IN
= 0.8 V
1
2, 3
1
2, 3
03
-0.25
-20
01
-0.25
-20
V
IN
= 2.4 V
1
2, 3
02
-0.25
-20
V
IN
= 0.8 V or
2.4 V 2/
See footnotes at end of table.
1
2, 3
03
-0.25
-20
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-90731
SHEET
E
5
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参数对比
与5962-9073103M2X相近的元器件有:5962-9073101MEX、5962-9073102MEX、5962-9073101M2X、5962-9073102M2X、5962-9073103MEX。描述及对比如下:
型号 5962-9073103M2X 5962-9073101MEX 5962-9073102MEX 5962-9073101M2X 5962-9073102M2X 5962-9073103MEX
描述 SPST, 2 Func, 1 Channel, CMOS, CQCC20, SPST, 4 Func, 1 Channel, CMOS, CDIP16, SPST, 4 Func, 1 Channel, CMOS, CDIP16, SPST, 4 Func, 1 Channel, CMOS, CQCC20, SPST, 4 Func, 1 Channel, CMOS, CQCC20, SPST, 2 Func, 1 Channel, CMOS, CDIP16,
Reach Compliance Code unknown unknown unknown unknown unknown unknown
模拟集成电路 - 其他类型 SPST SPST SPST SPST SPST SPST
JESD-30 代码 S-CQCC-N20 R-GDIP-T16 R-GDIP-T16 S-CQCC-N20 S-CQCC-N20 R-GDIP-T16
标称负供电电压 (Vsup) -15 V -15 V -15 V -15 V -15 V -15 V
信道数量 1 1 1 1 1 1
功能数量 2 4 4 4 4 2
端子数量 20 16 16 20 20 16
标称断态隔离度 68 dB 68 dB 68 dB 68 dB 68 dB 68 dB
最大通态电阻 (Ron) 35 Ω 35 Ω 35 Ω 35 Ω 35 Ω 35 Ω
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
封装形状 SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR
封装形式 CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
标称供电电压 (Vsup) 15 V 15 V 15 V 15 V 15 V 15 V
表面贴装 YES NO NO YES YES NO
最长断开时间 145 ns 145 ns 145 ns 145 ns 145 ns 145 ns
最长接通时间 175 ns 175 ns 175 ns 175 ns 175 ns 175 ns
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE
端子位置 QUAD DUAL DUAL QUAD QUAD DUAL
Base Number Matches 1 1 1 1 1 1
厂商名称 TEMIC - - TEMIC TEMIC TEMIC
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L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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