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5962F0422902QZC

Field Programmable Gate Array, 1536 CLBs, 320640 Gates, CMOS, CBGA484, CERAMIC, LGA-484

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Cobham Semiconductor Solutions

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器件参数
参数名称
属性值
厂商名称
Cobham Semiconductor Solutions
零件包装代码
LGA
包装说明
BGA,
针数
484
Reach Compliance Code
unknown
ECCN代码
3A001.A.2.C
CLB-Max的组合延迟
1.92 ns
JESD-30 代码
S-CBGA-B484
JESD-609代码
e4
长度
29 mm
等效关口数量
3200000
端子数量
484
最高工作温度
125 °C
最低工作温度
-40 °C
组织
3200000 GATES
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
BGA
封装形状
SQUARE
封装形式
GRID ARRAY
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
筛选级别
MIL-PRF-38535 Class Q
座面最大高度
2.95 mm
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
GOLD
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
总剂量
300k Rad(Si) V
宽度
29 mm
Base Number Matches
1
文档预览
Standard Products
UT6325 RadTol Eclipse FPGA
Data Sheeet
November 2013
www.aeroflex.com/FPGA
FEATURES
0.25m, five-layer metal, ViaLink
TM
epitaxial CMOS
process for smallest die sizes
One-time programmable, ViaLink technology for
personalization
Typical performance characteristics -- 120 MHz 16-bit
counters, 120 MHz datapaths, 60+ MHz FIFOs
2.5V core supply voltage, 3.3V I/O supply voltage
Up to 320,000 system gates (non-volatile)
I/Os
- Interfaces with 3.3 volt
- PCI compliant with 3.3 volt
- Full JTAG 1149.1 compliant
- Registered I/O cells with individually controlled enables
Operational environment; total dose irradiation testing to
MIL-STD-883 Test Method 1019
- Total-dose: 300 krad(Si)
- SEL Immune: <120MeV-cm
2
/mg
- LET
TH
(0.25) MeV-cm
2
/mg:
>42 logic cell flip flops
>64 for embedded SRAM
- Saturated Cross Section (cm2) per bit
5.0E-7 logic cell flip flops
2.0E-7 embedded SRAM
Up to 24 dual-port RadTol SRAM modules, organized in
user-configurable 2,304 bit blocks
- 5ns access times, each port independently accessible
- Fast and efficient for FIFO, RAM, and initialized RAM
functions
100% routable with full logic cell utilization and 100% user
fixed I/O
Variable-grain logic cells provide high performance and
100% utilization
Typical logic utilization = 65-80% (design dependent)
Comprehensive design tools include high quality Verilog/
VHDL synthesis and simulation
QuickLogic IP available for microcontrollers, DRAM
controllers, USART and PCI
Packaged in a 208-pin CQFP, 288 CQFP, 484 CCGA, 484
CLGA, 208 PQFP, 280 PBGA, and 484 PBGA
Standard Microcircuit Drawing 5962-04229
- QML Q & V
INTRODUCTION
The UT6325 RadTol Eclipse Field Programmable Gate Array
Family (FPGA) offers up to 320,000 system gates including
Dual-Port RadTol SRAM modules. It is fabricated on 0.25m
five-layer metal ViaLink CMOS process and contains 1,536
logic cells and 24 dual-port SRAM modules (see Figure 1 Block
Diagram). Each SRAM module has 2,304 RAM bits, for a
maximum total of 55,300 bits. Please reference product family
features chart on page 2.
SRAM modules are Dual Port (one asynchronous/synchronous
read port, one write port) and can be configured into one of four
modes (see Figure 2). Designers can cascade multiple RAM
modules to increase the depth or width allowed in single
modules by connecting corresponding address lines together and
dividing the words between modules (see Figure 3). This
approach allows a variety of address depths and word widths to
be tailored to a specific application.
The UT6325 RadTol Eclipse FPGA is available in a 208-pin
Cerquad Flatpack, allowing access to 99 bidirectional signal I/
O, 1 dedicated clock, 8 programmable clocks and 16 high drive
inputs. Other package options include a 288 CQFP, 484 CCGA
and a 484 CLGA.
Aeroflex uses QuickLogic Corporation’s licensed ESP
(Embedded Standard Products) technology. QuickLogic is a
pioneer in the FPGA semiconductor and software tools field.
1
UT6325 Product Features
Features
Device
System
Gates
320,640
Logic
Cells
1,536
Maximum
Logic
Flip Flops Cell Flip
Flops
4,002
3072
RAM
Modules
24
RAM
Bits
55,300
I/O Standards
Clocks
High
Drive
Inputs
16
UT6325
LVTTL,
LVCMOS3, PCI
9
Operational Environment
Device
UT6325
Total Dose
3E5
LET
TH
(0.25) MeV-cm
2
/mg
>42 logic cell flip flops
>64 embedded SRAM
Saturated Cross Section
5.0E-7 logic cell flip flops
2.0E-7 embedded SRAM
Latch-up
Immune
>120
Bidirectional I/O per Package
Device
UT6325
208 PQFP
99
208 CQFP
99
280PBGA
163
288 CQFP
163
484 PBGA
310
484 CLGA
316
484 CCGA
316
2
Embedded RAM Blocks
IP
Maximum
of
24
RadTol
SRAM
Blocks
Fabric
Maximum
of
1,536
High
Speed
Variable
Grain
Logic
Cells
Embedded RAM Blocks
Bidirectional I//O and
High-Drive Inputs
Figure 1. UT6325 Eclipse FPGA Block Diagram
3
PRODUCT DESCRIPTION
I/O Pins
(9:0)
(17:0)
WA
WD
WE
WCLK
(1:0)
MODE
RE
RCLK
RA
RD
ASYNCRD
(9:0)
(17:0)
• Up to 316 bi-directional input/output pins, PCI-compliant for
3.3V buses (see Table 4)
• Each bidirectional I/O contains RadTol flip-flops for input,
output, and output enable lines
Distributed Networks
• One, dedicated clock network, hardwired to each logic cell
flip-flop clock pin to minimize skew
• Three programmable, global clock networks accessible from
clock input only pins
Figure 2. UT6325 Eclipse FPGA RAM Module
Software support for the product is available from both
Aeroflex and QuickLogic. The Windows PC-based Quick-
Works
TM
package provides the most complete software solu-
tion from design entry to logic synthesis, place and route,
simulation, static timing, and power analysis. Device libraries
are available to provide support for designers who use Mentor,
Synplicity, Synopsys or other third party tools for design entry,
synthesis and simulation. Please visit QuickLogic’s website at
www.quicklogic.com for more information.
The variable grain logic cell features up to 17 simultaneous in-
puts and 6 outputs within a cell that can be fragmented into 6
independent sections. Each cell has a fan-in of 30 including
register and control lines (see Figure 5).
• Five programmable quadrant clock networks, accessible from
clock pins or internal logic
• 20 pre-defined Quad-clock networds, five per quadrant. Ac-
cessed by the five programmable quadrant clock networks
• Sixteen high drive inputs. Two inputs located in each of the
eight I/O banks. Used as clock or enable signals for the I/O
RadTol flip-flops, or as high drive inputs for internal logic
Typical Performance
• Input + logic cell + output total delays under 12ns
• Data path speeds over 120 MHz
• Counter speeds over 120 MHz
WDATA
RAM
Module
(2,304 bits)
RDATA
• FIFO speeds over 60+ MHz
WADDR
RADDR
RAM
Module
(2,304 bits)
WDATA
RDATA
Figure 3. UT6325 Eclipse FPGA Module Bits
4
+
-
INPUT
REGISTER
Q
E
D
R
PAD
Q
OUTPUT
REGISTER
D
R
E
OUTPUT
ENABLE
REGISTER
D
Q
R
Figure 4. RadTol Eclipse FPGA I/O Cell
5
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