1. The above test circuits are utilized for all package types.
2. The Dynamic Test Circuit is utilized for all life testing.
NOTES:
R = 1kΩ
±5%,
1
/
4
W.
C
1
= C
2
= 0.01µF minimum, 1 each per socket, minimum.
V
S
+ = 15.5V
±0.5V,
V
S
- = -15.5V
±0.5V,
V
R
= 15.5
±0.5V.
FIGURE 2. STATIC BURN-IN TEST CIRCUIT
Irradiation Circuit
HS-1840ARH
+15V
NC
NC
+1V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
-15V
1kΩ
+5V
NOTE:
3. All irradiation testing is performed in the 28 lead CERDIP package.
3
HS-1840ARH
Die Characteristics
DIE DIMENSIONS:
(2820µm x 4080µm x 483µm
±25.4µm)
111 mils x 161 mils x 19 mils
±1
mil
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 8.0k
Å
±1k
Å
Top Metallization:
Type: AlSiCu
Thickness: 16.0k
Å
±2k
Å
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Unbiased (DI)
ADDITIONAL INFORMATION:
Worst Case Current Density:
Modified SEM
Transistor Count:
407
Process:
Radiation Hardened Silicon Gate,
Bonded Wafer, Dielectric Isolation
Metallization Mask Layout
HS-1840ARH
IN7
IN6
IN5
IN4
IN3
IN2
IN1
IN8
ENABLE
A0
-V
A1
OUT
A2
+V
A3
V
REF
IN16
GND
IN15
IN14
IN13
IN12
IN11
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
专注于引入新品并提供海量库存的电子元器件分销商贸泽电子 (Mouser Electronics) 宣布与Analog Devices合作推出一本电子书,书中重点介绍了储能系统 (ESS) 及其在新兴智能能源基础设施中所起到的关键作用。在Energy Storage Solutions: Saving Power for the Future(《储能解决方案:为未来节能》)一书中,来自Analog...[详细]
大陆智慧型手机品牌厂积极抢市,带动台湾智慧型手机市场战火升温。大陆手机品牌厂华为及号称「大陆版iPhone」的小米机均已登台亮相,由于华为、小米在大陆市场表现不俗,进入台湾市场也引发关注。 大陆手机供应链业者认为,由于台湾智慧型手机市场版图中,市占率领先的手机品牌厂大多为国际品牌厂,包括三星电子(Samsung Electronics)、索尼行动通讯(Sony Mobile Communi...[详细]